TW200609207A - Novel phenol compound and novel epoxy resin derivable from such phenol compound - Google Patents

Novel phenol compound and novel epoxy resin derivable from such phenol compound

Info

Publication number
TW200609207A
TW200609207A TW094109188A TW94109188A TW200609207A TW 200609207 A TW200609207 A TW 200609207A TW 094109188 A TW094109188 A TW 094109188A TW 94109188 A TW94109188 A TW 94109188A TW 200609207 A TW200609207 A TW 200609207A
Authority
TW
Taiwan
Prior art keywords
phenol compound
novel
epoxy resin
carbon atoms
formula
Prior art date
Application number
TW094109188A
Other languages
English (en)
Other versions
TWI367204B (zh
Inventor
Mitsuo Akutsu
Masaaki Shimizu
Yoshie Makabe
Naomi Sato
Original Assignee
Asahi Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Co Ltd filed Critical Asahi Denka Co Ltd
Publication of TW200609207A publication Critical patent/TW200609207A/zh
Application granted granted Critical
Publication of TWI367204B publication Critical patent/TWI367204B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/17—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings containing other rings in addition to the six-membered aromatic rings, e.g. cyclohexylphenol
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/28—Ethers with hydroxy compounds containing oxirane rings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Compounds (AREA)
TW094109188A 2004-03-25 2005-03-24 Novel phenol compound and novel epoxy resin derivable from such phenol compound TW200609207A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004090129 2004-03-25

Publications (2)

Publication Number Publication Date
TW200609207A true TW200609207A (en) 2006-03-16
TWI367204B TWI367204B (zh) 2012-07-01

Family

ID=35056117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109188A TW200609207A (en) 2004-03-25 2005-03-24 Novel phenol compound and novel epoxy resin derivable from such phenol compound

Country Status (4)

Country Link
JP (1) JP4698586B2 (zh)
CN (1) CN100386298C (zh)
TW (1) TW200609207A (zh)
WO (1) WO2005092826A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4198101B2 (ja) * 2004-09-17 2008-12-17 株式会社Ａｄｅｋａ アルカリ現像性樹脂組成物
JP4198173B2 (ja) 2004-09-17 2008-12-17 凸版印刷株式会社 着色アルカリ現像性感光性樹脂組成物及び該着色アルカリ現像性感光性樹脂組成物を用いたカラーフィルタ
WO2006137257A1 (ja) * 2005-06-20 2006-12-28 Toppan Printing Co., Ltd. 着色アルカリ現像型感光性樹脂組成物、及び該着色アルカリ現像型感光性樹脂組成物を用いたカラーフィルタ
JP4916224B2 (ja) * 2005-06-20 2012-04-11 株式会社Ａｄｅｋａ アルカリ現像性感光性樹脂組成物
JP4878845B2 (ja) * 2006-01-10 2012-02-15 凸版印刷株式会社 アルカリ現像型感光性樹脂組成物を用いて形成した液晶分割配向制御用突起付き基板、及び液晶表示装置
JP4738190B2 (ja) * 2006-02-01 2011-08-03 株式会社Ａｄｅｋａ エポキシ樹脂、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物
JP4667261B2 (ja) * 2006-02-01 2011-04-06 株式会社Ａｄｅｋａ アルカリ現像性感光性樹脂組成物
JP4878876B2 (ja) * 2006-03-15 2012-02-15 株式会社Ａｄｅｋａ エポキシ樹脂、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物
JP5546093B2 (ja) 2006-12-26 2014-07-09 株式会社Ａｄｅｋａ 重合性化合物及び重合性組成物
JP5311750B2 (ja) * 2007-02-28 2013-10-09 株式会社Ａｄｅｋａ フェノール樹脂、エポキシ樹脂、アルカリ現像性樹脂組成物及びアルカリ現像性感光性樹脂組成物
SG181486A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Coating compositions
SG181461A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Epoxy resin compositions
WO2011068643A2 (en) * 2009-12-02 2011-06-09 Dow Global Technologies Inc. Composite compositions
JP7465673B2 (ja) 2020-02-25 2024-04-11 株式会社Adeka 重合体、成形体及び光学材料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987006243A1 (en) * 1986-04-14 1987-10-22 Hughes Aircraft Company Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof
JP3200123B2 (ja) * 1991-11-27 2001-08-20 住友化学工業株式会社 電子部品封止用エポキシ樹脂組成物
JP3173629B2 (ja) * 1992-02-12 2001-06-04 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
JPH05295089A (ja) * 1992-04-21 1993-11-09 Daihachi Chem Ind Co Ltd 硬化性樹脂組成物
SG63691A1 (en) * 1996-02-09 1999-03-30 Nippon Kayaku Kk Epoxy resin epoxy resin composition and hardened product thereof
JP2000239206A (ja) * 1998-12-25 2000-09-05 Honshu Chem Ind Co Ltd 非対称アルキリデン多価フェノール類とその製造方法
JP2002316963A (ja) * 2001-02-15 2002-10-31 Osaka Gas Co Ltd 低ホルモン活性ビスフェノール類
JP2003064121A (ja) * 2001-08-23 2003-03-05 Tosoh Corp ポリオレフィンの製造方法
JP4067974B2 (ja) * 2002-02-15 2008-03-26 本州化学工業株式会社 １，３，５−トリス（４−ヒドロキシフェニル）アダマンタン類及びその製造方法

Also Published As

Publication number Publication date
JP4698586B2 (ja) 2011-06-08
CN100386298C (zh) 2008-05-07
JPWO2005092826A1 (ja) 2008-02-14
TWI367204B (zh) 2012-07-01
CN1771219A (zh) 2006-05-10
WO2005092826A1 (ja) 2005-10-06

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