JP4682657B2 - 弾性表面波デバイス - Google Patents
弾性表面波デバイス Download PDFInfo
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- JP4682657B2 JP4682657B2 JP2005080945A JP2005080945A JP4682657B2 JP 4682657 B2 JP4682657 B2 JP 4682657B2 JP 2005080945 A JP2005080945 A JP 2005080945A JP 2005080945 A JP2005080945 A JP 2005080945A JP 4682657 B2 JP4682657 B2 JP 4682657B2
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- Prior art keywords
- film
- under bump
- layer
- acoustic wave
- bump metal
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- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
以下、実施の形態1を用いて、本発明について説明する。
12 櫛型電極
13 パッド電極
14 密着層
15 応力緩和層
16 耐拡散バリア層
17 半田濡れ層
Claims (4)
- 圧電基板と、この圧電基板上に設けられた櫛型電極およびパッド電極と、このパッド電極の上に設けられたアンダーバンプメタル膜と、このアンダーバンプメタル膜の上に設けられた鉛フリーの半田バンプとを備え、前記アンダーバンプメタルは、前記パッド電極の上に密着層を介してまたは前記パッド電極の上に接して設けられたアルミニウムを主成分とする応力緩和層と、この応力緩和層の上に接して設けられたニッケルを主成分とする金属膜からなる耐拡散バリア層とを有し、前記耐拡散バリア層は800nm以上、2000nm以下の厚みを有することを特徴とした弾性表面波デバイス。
- 鉛フリーの半田バンプは、スズと銀と銅を含有する請求項1記載の弾性表面波デバイス。
- 密着層はチタンを主成分とする請求項2記載の弾性表面波デバイス。
- 応力緩和層の厚みが、耐拡散バリア層の厚みの、半分以上、1.5倍以下である請求項3記載の弾性表面波デバイス。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005080945A JP4682657B2 (ja) | 2005-03-22 | 2005-03-22 | 弾性表面波デバイス |
CN200680009633A CN100590825C (zh) | 2005-03-22 | 2006-03-07 | 凸点下金属膜及其形成方法、及声表面波器件 |
PCT/JP2006/304340 WO2006100900A1 (ja) | 2005-03-22 | 2006-03-07 | アンダーバンプメタル膜とその形成方法、ならびに弾性表面波デバイス |
US11/817,171 US7764007B2 (en) | 2005-03-22 | 2006-03-07 | Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005080945A JP4682657B2 (ja) | 2005-03-22 | 2005-03-22 | 弾性表面波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006269458A JP2006269458A (ja) | 2006-10-05 |
JP4682657B2 true JP4682657B2 (ja) | 2011-05-11 |
Family
ID=37023574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005080945A Expired - Fee Related JP4682657B2 (ja) | 2005-03-22 | 2005-03-22 | 弾性表面波デバイス |
Country Status (4)
Country | Link |
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US (1) | US7764007B2 (ja) |
JP (1) | JP4682657B2 (ja) |
CN (1) | CN100590825C (ja) |
WO (1) | WO2006100900A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5023749B2 (ja) * | 2007-03-16 | 2012-09-12 | パナソニック株式会社 | 弾性表面波フィルタ |
DE102007023590A1 (de) * | 2007-05-21 | 2008-11-27 | Epcos Ag | Bauelement mit mechanisch belastbarer Anschlussfläche |
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US7764007B2 (en) | 2010-07-27 |
JP2006269458A (ja) | 2006-10-05 |
CN101147250A (zh) | 2008-03-19 |
US20090021109A1 (en) | 2009-01-22 |
CN100590825C (zh) | 2010-02-17 |
WO2006100900A1 (ja) | 2006-09-28 |
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