JP4655092B2 - 回路モジュールおよびこの回路モジュールを用いた回路装置 - Google Patents
回路モジュールおよびこの回路モジュールを用いた回路装置 Download PDFInfo
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- JP4655092B2 JP4655092B2 JP2007540900A JP2007540900A JP4655092B2 JP 4655092 B2 JP4655092 B2 JP 4655092B2 JP 2007540900 A JP2007540900 A JP 2007540900A JP 2007540900 A JP2007540900 A JP 2007540900A JP 4655092 B2 JP4655092 B2 JP 4655092B2
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- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Combinations Of Printed Boards (AREA)
Description
図1,図2は本発明にかかる回路モジュールの第1実施形態を示す。この回路モジュールAは、平板状基板(以下、配線基板と呼ぶ)1に枠状基板(以下、端子板と呼ぶ)10を接合した構造となっている。
Claims (8)
- 第1主面の周縁部に複数の接続電極が配置された平板状基板と、第1主面上に前記接続電極に対応する複数の接続電極が配置された枠状基板とを備え、
前記平板状基板の複数の前記接続電極と前記枠状基板の複数の前記接続電極とが導電性接合材を介してそれぞれ接続されており、
前記枠状基板の内側面と前記平板状基板の前記第1主面とで構成されるキャビティに回路部品が収納されており、
前記回路部品を覆うように、前記キャビティに封止樹脂が充填・硬化された回路モジュールにおいて、
前記枠状基板の接続電極の中心は、前記平板状基板の接続電極の中心よりも、前記枠状基板の内側方向にずれていることを特徴とする回路モジュール。 - 前記枠状基板の接続電極の内側縁が前記平板状基板の接続電極の内側縁より、前記枠状基板の内側方向にずれていることを特徴とする請求項1に記載の回路モジュール。
- 前記平板状基板の前記第1主面の周縁部には前記複数の接続電極が枠状に配列されており、
前記枠状基板の前記第1主面上には複数の接続電極が枠状に配列されており、
前記枠状基板の各接続電極の中心は、前記平板状基板の各接続電極の中心よりも、前記枠状基板の中心方向にそれぞれずれていることを特徴とする請求項1または2に記載の回路モジュール。 - 前記平板状基板はセラミック基板であり、前記枠状基板は樹脂基板である、請求項1ないし3のいずれか1項に記載の回路モジュール。
- 前記平板状基板の前記第1主面と対向する第2主面には、別の回路部品が搭載されている、請求項1ないし4のいずれか1項に記載の回路モジュール。
- 前記枠状基板の前記第1主面と対向する第2主面上には、前記接続電極と層間接続導体を介して接続された端子電極が形成されていることを特徴とする請求項1ないし5のいずれか1項に記載の回路モジュール。
- 請求項6に記載の回路モジュールを、マザー基板の主面上に導電性接合材を介して実装した回路装置であって、
前記マザー基板の主面上には、前記枠状基板の端子電極に対応する表面電極が設けられており、
前記枠状基板の端子電極の中心は、前記マザー基板の表面電極の中心よりも、前記枠状基板の内側方向にずれていることを特徴とする回路装置。 - 前記枠状基板の前記第2主面上には複数の端子電極が枠状に配列されており、
前記マザー基板の主面上には、複数の表面電極が枠状に配列されており、
前記枠状基板の各端子電極の中心は、前記マザー基板の各表面電極の中心よりも、前記枠状基板の中心方向にそれぞれずれていることを特徴とする請求項7に記載の回路装置。
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JP2005305256 | 2005-10-20 | ||
JP2005305256 | 2005-10-20 | ||
PCT/JP2006/317721 WO2007046197A1 (ja) | 2005-10-20 | 2006-09-07 | 回路モジュールおよびこの回路モジュールを用いた回路装置 |
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JP (1) | JP4655092B2 (ja) |
KR (1) | KR100952171B1 (ja) |
CN (1) | CN100580911C (ja) |
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WO (1) | WO2007046197A1 (ja) |
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KR100994172B1 (ko) * | 2008-07-23 | 2010-11-15 | 삼화콘덴서공업주식회사 | 커패시터 모듈 |
US8194411B2 (en) * | 2009-03-31 | 2012-06-05 | Hong Kong Applied Science and Technology Research Institute Co. Ltd | Electronic package with stacked modules with channels passing through metal layers of the modules |
WO2011077968A1 (ja) * | 2009-12-22 | 2011-06-30 | 株式会社村田製作所 | 回路モジュールの製造方法、回路モジュール及び回路モジュールを備える電子機器 |
EP2519084A4 (en) * | 2009-12-24 | 2014-01-22 | Furukawa Electric Co Ltd | ASSEMBLY STRUCTURE FOR INJECTION MOLDED SUBSTRATE AND MOUNTING COMPONENT |
JP5510461B2 (ja) * | 2010-04-13 | 2014-06-04 | 株式会社村田製作所 | モジュール基板、及びモジュール基板の製造方法 |
KR20120004777A (ko) * | 2010-07-07 | 2012-01-13 | 삼성전기주식회사 | 전자 부품 모듈 및 이의 제조방법 |
US20130087903A1 (en) * | 2011-10-06 | 2013-04-11 | Schlumberger Technology Corporation | Electronics Packaging For High Temperature Downhole Applications |
CN104364899B (zh) * | 2012-06-22 | 2017-11-24 | 株式会社村田制作所 | 电子部件模块 |
CN104471707B (zh) * | 2012-07-26 | 2017-07-04 | 株式会社村田制作所 | 半导体模块 |
CN105230135B (zh) | 2013-05-21 | 2018-04-20 | 株式会社村田制作所 | 模块 |
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DE112006002635T5 (de) | 2008-08-28 |
KR100952171B1 (ko) | 2010-04-09 |
CN101292347A (zh) | 2008-10-22 |
WO2007046197A1 (ja) | 2007-04-26 |
US20080180926A1 (en) | 2008-07-31 |
KR20080044328A (ko) | 2008-05-20 |
US7450395B2 (en) | 2008-11-11 |
CN100580911C (zh) | 2010-01-13 |
JPWO2007046197A1 (ja) | 2009-04-23 |
DE112006002635B4 (de) | 2012-11-15 |
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