CN100580911C - 电路模块和使用该电路模块的电路装置 - Google Patents

电路模块和使用该电路模块的电路装置 Download PDF

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CN100580911C
CN100580911C CN200680039316A CN200680039316A CN100580911C CN 100580911 C CN100580911 C CN 100580911C CN 200680039316 A CN200680039316 A CN 200680039316A CN 200680039316 A CN200680039316 A CN 200680039316A CN 100580911 C CN100580911 C CN 100580911C
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substrate
shaped
frame
connection electrode
interarea
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CN101292347A (zh
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酒井范夫
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

本发明提供在将密封树脂充填到由平板形基板与框形基板构成的空腔并使其硬化之时，能抑制因其收缩应力而使框形基板向内侧发生变形的电路模块。利用导电性接合材料(20)分别接合平板形基板(1)的连接电极(6)与框形基板(10)的连接电极(12)，从而将电路元器件(8)安装于比框形基板(10)更靠近内侧的平板形基板(1)的表面上。将密封树脂充填到由框形基板(10)与平板形基板(1)形成的空腔(11)中并使其硬化。由于框形基板(10)的连接电极(12)的中心比平板形基板(1)的连接电极(6)的中心再向内侧方向偏移α，所以能以导电接合材料(20)的硬化收缩应力F2来缓和密封树脂(21)的硬化收缩应力F1，从而能够抑制框形基板(10)的变形。

Description

电路模块和使用该电路模块的电路装置
技术领域
本发明涉及接合平板形基板与框形基板的电路模块和使用该电路模块的电路装置。
背景技术
以往，作为提高安装密度以实现小型化的电路模块，已如特许文献1～4中所述的情况。这种电路模块是在陶瓷基板等的平板形基板的表面上形成多个连接电极，同时在树脂等的框形基板的表面上形成对应于上述多个连接电极的多个连接电极，并使框形基板的表面与平板形基板的表面对置，且用焊锡等的导电性接合材料接合平板形基板的连接电极与框形基板的连接电极的一种模块。在框形基板内侧的平板形基板的表面上安装半导体元件那样的电路元器件，向由框形基板内侧面与平板形基板表面构成的空腔内充填密封树脂，以覆盖该电路元器件。
将密封树脂充填到空腔中的目的在于保护安装于平板形基板上的电路元器件(在用导线结合方式将电路元器件连接到平板形基板的情况下，防止因导线卷曲引起的短路，在裸片或倒装片情况下防止因异物混入微细端子间而引起的短路等)与提高机械强度。这种封装树脂广泛地应用于环氧树脂等的热硬化性树脂中。
在将密封树脂充填到空腔之后并使其热硬化时，树脂以某种比例进行收缩。这时的收缩应力也作用到框形基板上，将框形基板拉向内侧的力来起作用。相对于陶瓷的杨氏模量为100～300GPa左右而言，树脂的杨氏模量为10～60Gpa左右，虽然由陶瓷基板构成的平板形基板几乎不变形，但树脂制的框形基板容易变形。近年来，电路模块力求更进一步的小型化，由于如果框形基板的宽度达到数百μm左右则变得非常窄，所以更加容易变形。结果常常发生因密封树脂的收缩应力而使框形基板向内侧变形的问题。
特许文献1：日本专利特开平6-216314号公报
特许文献2：日本专利特开平7-50357号公报
特许文献3：日本专利特开2000-101348号公报
特许文献4：日本专利特开2001-339137号公报
因此，本发明的较佳实施形态的目的在于，提供在将密封树脂充填到由平板形基板与框形基板构成的空腔并使其硬化之时，能抑制因其收缩应力引起框形基板向内侧变形的电路模块和用该电路模块的电路装置。
发明内容
为了达到上述目的，本发明的较佳实施形态的电路模块，其特征在于，包括将多个连接电极配置于第1主面的周边部的平板形基板和将对应于上述连接电极的多个连接电极配置于第1主面上的框形基板，通过导电性接合材料分别连接上述平板形基板的多个上述连接电极与上述框形基板的多个上述连接电极，电路元器件被收纳于由上述框形基板的内侧面与上述平板形基板的上述第1主面构成的空腔内，在对上述空腔充填密封树脂并使其硬化以覆盖上述电路元器件的电路模块中，上述框形基板的连接电极的中心比上述平板形基板的连接电极的中心更偏向上述框形基板的内侧方向。
在以往的电路模块中，在将接合平板形基板与框形基板的焊锡或导电性粘接剂等的接合材料硬化之际，为避免不均匀应力，平板形基板的连接电极与框形基板的连接电极正确地对向配置，即使相互的连接中心一致地进行配置。与之相对，本发明中将框形基板的连接电极的中心设置在从平板形基板的连接电极的中心偏向框形基板的内侧方向的位置上。在将密封树脂填充到由平板形基板与框形基板构成的空腔中并使其硬化之际，密封树脂的硬化收缩应力F1，与以往一样在将框形基板拉向内侧的方向上起作用。与此相对，硬化收缩应力F2也同样地作用于设置在框形基板的连接电极与平板形基板的连接电极之间的导电性接合材料，该应力F2因框形基板的连接电极中心从平板形基板的连接电极中心偏向内侧，所以在将框形基板的连接电极向外侧拉的方向在起作用。结果，由导电性接合材料的收缩应力F2来缓和密封树脂的收缩应力F1，能减少因密封树脂的收缩应力F1而引起的影响。换而言之，利用接合材料预先使应力F2起作用，能压住树脂硬化时的应力F1。结果，能抑制框形树脂的变形，提高框形基板的连接电极与平板形基板的连接电极之间的连接可靠性。另外，本发明中，所谓“平板形基板”，只要将连接框形基板的多个连接电极设置于同一平面上即可，也可在与框形基板连接的平面部以外的部分设置凸部或凹部。
较好的情况是，框形基板的连接电极的内侧缘比平板形基板的连接电极的内侧缘更偏向框形基板的内侧方向。如上所述，在框形基板的连接电极的内侧缘比平板形基板的连接电极的内侧缘更偏向内侧方向时，由于焊锡等的接合材料在一方的连接电极与另一方的连接电极之间以在宽度方向上被拉长的形状进行硬化，所以能加大其硬化收缩应力F2。结果，能以导电性接合材料的收缩应力F2更有效地缓和密封树脂的收缩应力F1。另外，本发明中，框形基板的连接电极的中心只要位于从平板形基板的连接电极的中心偏移到内侧的位置上即可，框形基板的连接电极的内侧缘未必一定要偏向比平板形基板的连接电极的内侧缘更靠近内侧。例如，在平板形基板的连接电极比框形基板的连接电极更宽时，也存在两连接电极的内侧缘位于同一位置或平板形基板的连接电极的内侧缘比框形基板的连接电极的内侧缘更靠近内侧的情况。
较好的情况是，在平板形基板的第1主面的周边部上将多个连接电极排列成框形，在框形基板的第1主面上将多个连接电极排列成框形，使框形基板的各连接电极的中心分别比平板形基板的各连接电极的中心更偏向框形基板的中心方向。平板形基板和框形基板的连接电极既可以只配置成对向的2边，也可以配置成框形(4边)。另外，即使在配置成框形时，平板形基板和框形基板的连接电极也可以只在对向的2边上发生偏移，也可以在全部4边上发生偏移。这样，在板形基板和框形基板的连接电极偏移全部4边时，由于能通过导电性接合材料的收缩应力F2缓和对框形基板的全部4边的密封树脂的收缩应力F1，故能有效地抑制框形基板的变形。
较好的是平板形基板为陶瓷基板，且框形基板为树脂基板的情况。虽然也可以是平板形基板和框形基板都用陶瓷基板或树脂基板来构成，但在平板形基板为陶瓷基板，且框形基板为树脂基板时，平板形基板的机械强度高，能防止因密封树脂而引起的变形，同时能利用树脂制的框形基板来提高热循环的可靠性。另外，在用陶瓷多层基板用作为平板形基板时，由于能在基板内部构成复杂的电路，所以能提高电路密度。
也可在与平板形基板的第1主面相对的第2主面上安装其他电路元器件。在这种情况下，电路元器件能安装在平板形基板的两面上，且能够提高安装密度。作为这种电路元器件，既可以是对平板形基板用焊锡等进行表面安装的表面安装元器件，也可以是面朝上搭载之后进行导线结合的集成电路元件，还可以是利用突起形进行面朝下安装的电路元件。
较好的情况是，在与框形基板的第1主面相对的第2主面上，形成通过层间连接导体与连接电极连接的端子电极。这时，在将电路模块安装到母基板等上时，有必要设置端子电极，但通过将该端子电极形成在与框形基板的第1主面相对的第2主面上，能将平板形基板保持在与母基板分离的位置上。因此，利用框形基板能抑制从母基板传向平板形基板的应力波和热传导。作为层间连接导体，可以是贯通框形基板内部的通路孔导体，也可以是穿通孔，还可以是形成于基板外侧面或内侧面上的图案电极。
较好的情况是，作为将在框形基板的第2主面上形成有端子电极的电路模块通过焊锡等导电性接合材料安装于母基板的主面上后得到的电路装置，在母基板的主面上，设置与框形基板的端子电极对应的表面电极，且框形基板的端子电极的中心比母基板的表面电极的中心更偏向框形基板的内侧方向。如上所述，利用框形基板的连接电极与平板形基板的连接电极的位置关系，能由导电性接合材料的收缩应力F2来缓和密封树脂的收缩应力F1，但是当然未必一定能完全地抵消密封树脂的收缩应力F1。因此，这时通过使框形基板的端子电极的中心比母基板的表面电极的中心更偏向内侧方向，电路模块安装到母基板上用的导电性接合材料也产生与导电性接合材料的收缩应力F2同一方向的应力F3，从而更有效地缓和密封树脂的收缩应力F1。
较好的情况是，在框形基板的第2主面上将多个端子电极排列成框形，在母基板的主面上将多个表面电极排列成框形，且使框形基板的各端子电极的中心分别比母基板的各表面电极的中心更偏向框形基板的中心方向。这种情况与上述的平板形基板的连接电极和框形基板的连接电极之间的关系是相同的，当在全部4边上母基板的表面电极与框形基板的端子电极发生偏移时，能对框形基板的4边产生导电性接合材料的收缩应力F3，因此能有效地抑制框形基板的变形。
如上所述，根据本发明的较佳实施形态，由于将框形基板的连接电极的中心设置于比平板形基板的连接电极的中心更偏向内侧方向的位置上，所以设置于框形基板的连接电极与平板形基板的连接电极之间的导电性接合材料的硬化收缩应力F2，在向外侧偏移的方向上对框形基板起作用，且能缓和密封树脂的收缩应力F1。结果，能减少由密封树脂的收缩应力F1而产生的影响，能抑制框形基板的变形，且提高框形基板的连接电极与平板形基板的连接电极的连接可靠性。
附图说明
图1是本发明的电路模块的一实施形态的剖面图。
图2是图1所示的电路模块的底面图。
图3示出图1所示的电路模块的制造方法的前半部分的工序图。
图4示出图1所示的电路模块的制造方法的后半部分的工序图。
图5为将图1所示的电路模块安装到母基板上后的电路装置的剖面图。
图6是图5的主要部分的扩大图。
具体实施方式
(第1实施形态)
图1、图2示出本发明的电路模块的第1实施形态。该电路模块A为将框形基板(以下、称端子板)10接合到平板形基板(以下、称配线基板)1后得到的构造。
配线基板1是层叠例如LTCC(Low-Temperature Co-firable Ceramic：低温烧结陶瓷)等的多个陶瓷层而成的陶瓷多层基板，在第2主面上形成多个连接盘电极2，在其上连接多个电路元器件3。此外，在配线基板1的表层和内层设置以银或铜为主的电极图案，从而形成电容器和电感器那样的无源元件图案，以及连接电路元器件3和无源元件用的配线图案。本例中，电路元器件3是将焊接在连接盘电极2上的例如层叠型陶瓷电容器等的表面安装元器件与通过突起而面朝下地安装于连接盘电极2上的例如半导体器件等的表面安装元器件的组合，但不仅限于此。连接盘电极2通过设置于配线基板1内部的通路孔导体4和内部配线5连接到形成于第1主面的多个连接电极6或多个焊盘电极7。连接电极6在配线基板1的第1主面的周边部配置成框形。焊盘电极7形成于比配置成框形的连接电极6更靠近内侧的区域，且通过结合导线9与安装于配线基板1第1主面的集成电路元件等的电路元器件8连接。本例中，配线基板1的第1主面上安装有集成电路元件8，但是也可以安装层叠型陶瓷电容器等的表面安装元器件或半导体器件等的面朝下安装元器件等。
端子板10由框形的树脂基板构成，其外形尺寸比配线基板1稍小。在与配线基板1的第1主面对向的端子板10的第1主面上，将多个连接电极12配置成框形。如图1所示，连接电极12的中心比配线基板1的连接电极6的中心再向端子板10的内侧方向偏移α。本例中，连接电极12的内侧缘比连接电极6的内侧缘再向内侧偏移β。在连接电极12与连接电极6为相同形状时，虽然α＝β，但是在连接电极6的宽度比连接电极12的宽度要大(图1的左右方向的尺寸较大)时，变为α＞β。配线基板1的连接电极6与端子板10的连接电极12通过焊锡或导电性粘接剂等的导电性接合材料20加以电连接，并且进行机械接合。如上所述，由于在连接电极12的中心与连接电极6的中心之间具有偏差α，所以接合材料20以在内外方向上延长的状态进行硬化。因此，在端子板10的连接电极12上，如箭头所示，作用向外的硬化收缩应力F2。另外，这时虽然应力F2的反作用力发生作用，但此力集中于框形端子板10的角部，在端子板10的壁部分留有应力F2。但是，最好是端子板10的连接电极12的中心位于配线基板1的连接电极6的投影面内。在连接电极12的中心超出连接电极6的投影面内的情况下，在进行配线基板1与端子板10之间的连接时，作对接合材料20起作用的应力变得过大，有时会降低端子板10与配线基板1之间的连接强度。
在端子板10的第2主面上，将与连接电极12对应的多个端子电极13配置成框形，连接电极12与端子电极13经由在厚度方向上贯通端子板10的通路孔导体14而相互连接。本例中，连接电极12与端子电极13形状相同，而且在端子板10的正反主面的同一位置上对置。作为连接连接电极12与端子电极13的层间连接导体，并不仅限于通路孔导体14，也可以是形成于端子板10的外侧面或内侧面上的连接用图案电极，又可以是穿通孔导体。所谓通孔导体，是将电极形成于在厚度方向上贯通端子板10的孔内面而成的导体。此外，最好的情况是，层间连接导体是将金属薄板经过弯曲加工而成的导体，且端子板10是用树脂对此薄板形导体进行模压成型而成的模压树脂性的端子板。如果层间连接导体是将金属薄板经过弯曲加工而成的部分，那么即使对端子板10施加应力，层间连接导体也不会断线，从而能确保连接可靠性。
通过利用导电性接合材料20将端子板10接合到配线基板1，从而形成空腔11。设定包括接合材料20在内的端子板10的厚度，使其比包括安装于配线基板1第1主面的结合导线9在内的电路元器件8的高度要厚。向由端子板10与配线基板1形成的空腔11中充填密封树脂21并使其硬化，包括结合导线9的电路元器件8全部被埋入密封树脂21中。由于包括接合材料20的端子板10的厚度比包括结合导线9的电路元器件8的高度要厚，所以密封树脂21的表面不会从端子板10突出。由于密封树脂21的硬化，如图1所示，向内的硬化收缩应力F1作用于端子板10。然而，如上所述，因为向外的硬化收缩应力F2作用于接合材料20，所以密封树脂21的硬化收缩应力F1被接合材料20的硬化收缩应力F2所缓和，从而能减小因密封树脂的收缩应力F1而产生的对端子板10的影响。结果，能抑制端子板10的变形，且提高连接电极6、12的连接可靠性。另外，对于作为配线基板1的陶瓷多层基板而言，因为由于接合材料20的牵引力或密封树脂21的硬化收缩力，压缩应力向着内侧中心方向起作用，因此也加大了配线基板1自身的机械强度。
在将端子板10接合到配线基板1的状态下，配线基板1与端子板10之间介入存在多个接合材料20，在相邻的接合材料20之间产生间隙。在填充密封树脂21时若密封树脂21从该接合材料20的间隙流到外部，则有可能发生外观不良或因从外周面回流而引起的接触不良等。因此，用热硬化性树脂与无机充填料的混合树脂组成物来构成密封树脂21，调整到密封树脂21不会从接合材料20的间隙流到外部那种程度的粘度。另外，在用热硬化性树脂与无机充填料的混合树脂组成物来构成密封树脂21时，利用无机充填物的含有率不仅能调整粘度，而且也能调整耐热性、耐湿性、热膨胀系数，甚至硬化收缩应力F1。作为热硬化性树脂，可以用例如耐热性、耐湿性优良的环氧树脂、苯酚树脂、氰酸盐树脂等，作为无机充填物，可用例如氧化铝、二氧化硅、二氧化钛等。
这里参照图3、图4，说明电路模块A的制造方法。图3(a)示出准备配线基板1的状态。这里，配置连接电极6与焊盘电极7以使其朝向配线基板1的上侧。图3(b)示出在配线基板1的连接电极6上涂布焊锡糊剂20a，再从其上面配置端子板10的状态。相对于配线基板1的连接电极6，端子板10的连接电极12配置于向内侧偏移α的位置上。其后，进行回流焊接。图3(c)示出使焊锡糊剂溶融、硬化，以完成镀上焊锡的状态。在焊锡糊剂溶融、硬化之时，由于焊锡的表面张力，端子板10稳定在自动取得平衡的中央位置处。即，由于均匀的表面张力作用于配置在四周的焊锡糊剂20a上，所以端子板10相对于配线基板1不会偏向一方而实现接合。
图4(a)示出将电路元器件8安装在由端子板10包围的配线基板1的第1主面上、并由结合导线9连接电路元器件8和焊盘电极7的状态。图4(b)示出向由端子板10与配线基板1形成的空腔11中充填密封树脂21的状态。设定密封树脂21的粘度，以使其能容易地流入导线9的间隙和电路元器件8的周围，而不会从接合材料20间的间隙漏向外部。之后，使密封树脂21热硬化，但这时密封树脂21发生硬化收缩，从而产生图1所示的应力F1。然而，因为由导电性接合材料20提供与应力F1相反的应力F2，所以应力F1被应力F2所缓和，从而能抑制端子板10的变形。最后，如图4(c)所示，通过将电路元器件3连接到位于配线基板1的背面侧的连接盘电极2上，从而完成电路模块A。
图5、图6示出将电路模块A安装到母基板30上的状态。在印刷配线基板等的母基板30的正面上将多个表面电极31排列成框形，这些表面电极31与端子板10的端子电极13通过焊锡、导电性粘接剂等的导电性接合材料32进行电连接，并实现机械接合。如图6所示，表面电极31的中心相对于端子板10的端子电极13的中心向外侧方向偏移γ。本例中，端子电极13与表面电极31的形状大致相同，端子电极13的内侧缘比表面电极31的内侧缘再向内侧偏移δ。因此，接合材料32以在端子板10的内外方向上延伸的状态下进行硬化，如箭头所示，向外的硬化收缩应力F3作用于端子电极13上。
如上所述，在将电路模块A安装于母基板30的状态下，利用连接配线基板1与端子板10的接合材料20对连接电极12作用向外的应力F2，利用密封树脂21的硬化对端子板10作用向内的应力F1，而且利用接合电路模块A与母基板30的接合材料32对端子电极13作用向外的应力F3。即，由于用向外的应力F2、F3来缓和端子板10所受向内的应力F1，所以能减轻端子板10所受的应力，并抵消或抑制端子板10的变形。
上述实施形态中，虽然说明了准备子基板状态的配线基板1，并将端子板10接合到该配线基板1上的例子，但是也可以采用如下的方法，即准备集合基板状态的配线基板1，在该布线基板1上接合多个端子板10，在安装电路元器件8、充填密封树脂21后，分割成子基板。因端子板10的外形尺寸比配线基板1的外形尺寸要小，所以能在集合基板状态的配线基板1上分别安装端子板10。另外，在分割集合基板为子基板时，可以用切块机(ダィサ-)等进行切割，也可用巧克力分段机来进行分割。虽然本发明的配线基板是平板形，但是所谓平板形不只是其表面完全为平面的情况，也可以是形成有浅的凹凸部的平面的情况。例如可以如特许文献1中所示那样，在配线基板上形成浅的凹部，并将电路元器件安装于其中。在上述各实施形态中，虽然配线基板的连接电极和端子板的连接电极都配置成框形即配置在全部4边上，但是也可以将连接电极配置在相对的2边上或在3边上。这时在2边或3边中，只要使端子板的连接电极的中心比配线基板的连接中心更偏向内侧方向即可。

Claims (8)

1.一种电路模块，其特征在于，
包括将多个连接电极配置于第1主面的周边部的平板形基板和将对应于所述连接电极的多个连接电极配置于第1主面上的框形基板，
通过导电性接合材料分别连接所述平板形基板的多个连接电极与所述框形基板的多个连接电极，
将电路元器件收纳于由所述框形基板的内侧面与所述平板形基板的所述第1主面构成的空腔内，
向所述空腔充填密封树脂并使其硬化以覆盖所述电路元器件的电路模块，在该电路模块中，
所述框形基板的连接电极的中心比所述平板形基板的连接电极的中心更偏向所述框形基板的内侧方向。
2.如权利要求1所述的电路模块，其特征在于，
所述框形基板的连接电极的内侧缘比所述平板形基板的连接电极的内侧缘更偏向所述框形基板的内侧方向。
3.如权利要求1或2所述的电路模块，其特征在于，
在所述平板形基板的所述第1主面的周边部上将所述多个连接电极排列成框形，
在所述框形基板的所述第1主面上将多个连接电极排列成框形，
所述框形基板的各连接电极的中心分别比所述平板形基板的各连接电极的中心更偏向所述框形基板的中心方向。
4.如权利要求1至2中任一项所述的电路模块，其特征在于，
所述平板形基板是陶瓷基板，所述框形基板是树脂基板。
5.如权利要求1至2中任一项所述的电路模块，其特征在于，
在所述平板形基板的与所述第1主面相对的第2主面上，安装其他电路元器件。
6.如权利要求1至2中任一项所述的电路模块，其特征在于，
在所述框形基板的与所述第1主面相对的第2主面上，形成通过层间连接导体与所述连接电极连接的端子电极。
7.一种电路装置，其特征在于，
是通过导电性接合材料将权利要求6所述的电路模块安装于母基板主面上而得到的电路装置，
在所述母基板的主面上，设置与所述框形基板的端子电极对应的表面电极，
所述框形基板的端子电极的中心比所述母基板的表面电极的中心更偏向所述框形基板的内侧方向。
8.如权利要求7所述的电路装置，其特征在于，
在所述框形基板的所述第2主面上将多个端子电极排列成框形，
在所述母基板的主面上将多个表面电极排列成框形，
所述框形基板的各端子电极的中心分别比所述母基板的各表面电极的中心更偏向所述框形基板的中心方向。
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DE112006002635T5 (de) 2008-08-28
KR100952171B1 (ko) 2010-04-09
JP4655092B2 (ja) 2011-03-23
WO2007046197A1 (ja) 2007-04-26
US20080180926A1 (en) 2008-07-31

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