JP4652250B2 - 現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体 - Google Patents

現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体 Download PDF

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Publication number
JP4652250B2
JP4652250B2 JP2006048299A JP2006048299A JP4652250B2 JP 4652250 B2 JP4652250 B2 JP 4652250B2 JP 2006048299 A JP2006048299 A JP 2006048299A JP 2006048299 A JP2006048299 A JP 2006048299A JP 4652250 B2 JP4652250 B2 JP 4652250B2
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Japan
Prior art keywords
substrate
developer
belt
development processing
conveyor belt
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Expired - Fee Related
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JP2006048299A
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English (en)
Japanese (ja)
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JP2007227736A (ja
Inventor
貴志 竹熊
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2006048299A priority Critical patent/JP4652250B2/ja
Priority to KR1020070018142A priority patent/KR20070088370A/ko
Publication of JP2007227736A publication Critical patent/JP2007227736A/ja
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Publication of JP4652250B2 publication Critical patent/JP4652250B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2006048299A 2006-02-24 2006-02-24 現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体 Expired - Fee Related JP4652250B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006048299A JP4652250B2 (ja) 2006-02-24 2006-02-24 現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体
KR1020070018142A KR20070088370A (ko) 2006-02-24 2007-02-23 현상 처리 장치, 현상 처리 방법, 컴퓨터 판독 가능한 기억매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006048299A JP4652250B2 (ja) 2006-02-24 2006-02-24 現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
JP2007227736A JP2007227736A (ja) 2007-09-06
JP4652250B2 true JP4652250B2 (ja) 2011-03-16

Family

ID=38549234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006048299A Expired - Fee Related JP4652250B2 (ja) 2006-02-24 2006-02-24 現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体

Country Status (2)

Country Link
JP (1) JP4652250B2 (ko)
KR (1) KR20070088370A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4602390B2 (ja) * 2007-11-01 2010-12-22 Ｓｄフューチャーテクノロジー株式会社 塗布乾燥装置
JP4756076B2 (ja) * 2009-02-24 2011-08-24 東京エレクトロン株式会社 基板処理システム
WO2012073522A1 (ja) * 2010-12-03 2012-06-07 シャープ株式会社 基板処理装置及び基板処理方法
JP6418531B2 (ja) * 2015-03-05 2018-11-07 新電元工業株式会社 レジスト現像装置、レジスト現像方法及び半導体装置の製造方法
JP7023190B2 (ja) * 2018-06-15 2022-02-21 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7097759B2 (ja) * 2018-06-22 2022-07-08 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102597763B1 (ko) * 2018-10-23 2023-11-03 주식회사 케이씨텍 기판 처리 장치
CN110286531B (zh) * 2019-07-09 2021-07-23 武汉华星光电技术有限公司 显示装置及其制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024986A (ja) * 1987-10-31 1990-01-09 Dainippon Screen Mfg Co Ltd 基板の表面処理方法
JPH08115969A (ja) * 1987-10-31 1996-05-07 Dainippon Screen Mfg Co Ltd 基板の表面処理装置
JPH08115862A (ja) * 1994-10-13 1996-05-07 Hitachi Ltd 現像装置
JP2000173963A (ja) * 1998-12-03 2000-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000338684A (ja) * 1999-05-26 2000-12-08 Nagase & Co Ltd 基板表面処理装置
JP2005244022A (ja) * 2004-02-27 2005-09-08 Sharp Corp 液処理装置および液処理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024986A (ja) * 1987-10-31 1990-01-09 Dainippon Screen Mfg Co Ltd 基板の表面処理方法
JPH08115969A (ja) * 1987-10-31 1996-05-07 Dainippon Screen Mfg Co Ltd 基板の表面処理装置
JPH08115862A (ja) * 1994-10-13 1996-05-07 Hitachi Ltd 現像装置
JP2000173963A (ja) * 1998-12-03 2000-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000338684A (ja) * 1999-05-26 2000-12-08 Nagase & Co Ltd 基板表面処理装置
JP2005244022A (ja) * 2004-02-27 2005-09-08 Sharp Corp 液処理装置および液処理方法

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Publication number Publication date
KR20070088370A (ko) 2007-08-29
JP2007227736A (ja) 2007-09-06

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