JP4646357B2 - 熱伝導性シリコーンゴム組成物 - Google Patents

熱伝導性シリコーンゴム組成物 Download PDF

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Publication number
JP4646357B2
JP4646357B2 JP2000171477A JP2000171477A JP4646357B2 JP 4646357 B2 JP4646357 B2 JP 4646357B2 JP 2000171477 A JP2000171477 A JP 2000171477A JP 2000171477 A JP2000171477 A JP 2000171477A JP 4646357 B2 JP4646357 B2 JP 4646357B2
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JP
Japan
Prior art keywords
group
component
weight
parts
silicone rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000171477A
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English (en)
Japanese (ja)
Other versions
JP2001348483A (ja
JP2001348483A5 (enExample
Inventor
博司 江南
正之 大西
直 大川
雅章 尼子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2000171477A priority Critical patent/JP4646357B2/ja
Priority to US09/871,258 priority patent/US20020010245A1/en
Priority to KR1020010031772A priority patent/KR20010111026A/ko
Priority to EP01304972A priority patent/EP1162239A3/en
Publication of JP2001348483A publication Critical patent/JP2001348483A/ja
Publication of JP2001348483A5 publication Critical patent/JP2001348483A5/ja
Application granted granted Critical
Publication of JP4646357B2 publication Critical patent/JP4646357B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2000171477A 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物 Expired - Fee Related JP4646357B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000171477A JP4646357B2 (ja) 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物
US09/871,258 US20020010245A1 (en) 2000-06-08 2001-05-31 Thermally conductive silicone rubber composition
KR1020010031772A KR20010111026A (ko) 2000-06-08 2001-06-07 열전도성 실리콘 고무 조성물
EP01304972A EP1162239A3 (en) 2000-06-08 2001-06-07 Thermally conductive silicone rubber composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000171477A JP4646357B2 (ja) 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物

Publications (3)

Publication Number Publication Date
JP2001348483A JP2001348483A (ja) 2001-12-18
JP2001348483A5 JP2001348483A5 (enExample) 2007-06-28
JP4646357B2 true JP4646357B2 (ja) 2011-03-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000171477A Expired - Fee Related JP4646357B2 (ja) 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物

Country Status (4)

Country Link
US (1) US20020010245A1 (enExample)
EP (1) EP1162239A3 (enExample)
JP (1) JP4646357B2 (enExample)
KR (1) KR20010111026A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12037460B2 (en) 2019-03-29 2024-07-16 Dow Toray Co., Ltd. Multi-component type thermally conductive silicone-gel composition, thermally conductive material and heat-emission structure

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JP4255287B2 (ja) * 2001-05-14 2009-04-15 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP3807995B2 (ja) 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
JP3904469B2 (ja) * 2002-04-23 2007-04-11 信越化学工業株式会社 流動性を有する硬化性オルガノポリシロキサン組成物
JP2005042096A (ja) * 2003-07-04 2005-02-17 Fuji Polymer Industries Co Ltd 熱伝導性組成物及びこれを用いたパテ状放熱シートと放熱構造体
US7692032B2 (en) 2003-09-29 2010-04-06 Momentive Performance Materials Japan Llc Thermal conductive silicone composition
TWI345576B (en) 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5154010B2 (ja) * 2005-10-27 2013-02-27 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性シリコーンゴム組成物
TWI419931B (zh) * 2006-06-16 2013-12-21 信越化學工業股份有限公司 導熱聚矽氧潤滑脂組成物
JP2007332104A (ja) * 2006-06-16 2007-12-27 Shin Etsu Chem Co Ltd 有機ケイ素化合物
JP4514058B2 (ja) * 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2008150439A (ja) * 2006-12-14 2008-07-03 Momentive Performance Materials Japan Kk 熱伝導性シリコーン組成物及びそれを用いた塗布装置
US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
JP2009203373A (ja) * 2008-02-28 2009-09-10 Momentive Performance Materials Inc 熱伝導性シリコーン組成物
JP4656340B2 (ja) * 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP5103364B2 (ja) * 2008-11-17 2012-12-19 日東電工株式会社 熱伝導性シートの製造方法
JP5606104B2 (ja) * 2009-03-23 2014-10-15 株式会社アドマテックス 紫外線反射組成物及び紫外線反射成形品
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US8431220B2 (en) * 2009-06-05 2013-04-30 Xerox Corporation Hydrophobic coatings and their processes
US8329301B2 (en) 2009-07-29 2012-12-11 Xerox Corporation Fluoroelastomer containing intermediate transfer members
EP2752101A1 (en) * 2011-08-29 2014-07-09 Koninklijke Philips N.V. A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer
CN104024722B (zh) * 2012-01-03 2018-03-06 飞利浦照明控股有限公司 照明组件、光源和灯具
JP6440615B2 (ja) * 2012-07-30 2018-12-19 ダウ シリコーンズ コーポレーション 熱伝導性縮合反応硬化型ポリオルガノシロキサン組成物、並びに該組成物の調製及び使用のための方法
KR101688407B1 (ko) * 2013-10-17 2016-12-22 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 광 반도체 장치
WO2015056725A1 (ja) * 2013-10-17 2015-04-23 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および光半導体装置
JP6314797B2 (ja) * 2013-11-15 2018-04-25 信越化学工業株式会社 熱伝導性複合シート
JP6784676B2 (ja) * 2014-12-19 2020-11-11 ダウ シリコーンズ コーポレーション 縮合架橋粒子の調製方法
EP3325540B1 (en) * 2015-07-20 2025-07-02 Momentive Performance Materials GmbH Asymmetrically substituted polyorganosiloxane derivatives
TWI738743B (zh) * 2016-03-23 2021-09-11 美商道康寧公司 金屬-聚有機矽氧烷
KR20190020776A (ko) * 2016-06-24 2019-03-04 다우 코닝 도레이 캄파니 리미티드 화장료용 분체의 처리제, 화장료용 분체 및 이를 배합한 화장료
JP6302145B1 (ja) * 2016-07-22 2018-03-28 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性ポリオルガノシロキサン組成物
US11555118B2 (en) 2016-09-01 2023-01-17 Dow Toray Co., Ltd. Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts
EP3645642A1 (en) 2017-06-26 2020-05-06 Dow Silicones Corporation Silicone-polyether copolymer composition, method of preparing same, and sealant
EP3660101B1 (en) * 2017-07-24 2024-10-02 Dow Toray Co., Ltd. Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure
KR102813023B1 (ko) 2018-12-21 2025-05-28 다우 실리콘즈 코포레이션 실리콘-폴리아크릴레이트 공중합체, 이를 포함하는 밀봉제 및 관련된 방법
CN113272362B (zh) 2018-12-21 2022-06-17 美国陶氏有机硅公司 硅酮-聚酯共聚物、包括硅酮-聚酯共聚物的密封剂和相关方法
KR102811805B1 (ko) 2018-12-21 2025-05-27 다우 실리콘즈 코포레이션 실리콘-유기 공중합체, 이를 포함하는 밀봉제 및 관련된 방법
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12037460B2 (en) 2019-03-29 2024-07-16 Dow Toray Co., Ltd. Multi-component type thermally conductive silicone-gel composition, thermally conductive material and heat-emission structure

Also Published As

Publication number Publication date
KR20010111026A (ko) 2001-12-15
EP1162239A2 (en) 2001-12-12
JP2001348483A (ja) 2001-12-18
US20020010245A1 (en) 2002-01-24
EP1162239A3 (en) 2002-03-27

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