JP4621036B2 - 感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー - Google Patents

感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー Download PDF

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Publication number
JP4621036B2
JP4621036B2 JP2005031473A JP2005031473A JP4621036B2 JP 4621036 B2 JP4621036 B2 JP 4621036B2 JP 2005031473 A JP2005031473 A JP 2005031473A JP 2005031473 A JP2005031473 A JP 2005031473A JP 4621036 B2 JP4621036 B2 JP 4621036B2
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photosensitive resin
resin composition
carboxyl group
compound
meth
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Japanese (ja)
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JP2006220701A (ja
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正樹 佐々木
聖夫 有馬
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Priority to JP2005031473A priority Critical patent/JP4621036B2/ja
Priority to TW095101068A priority patent/TW200636386A/zh
Priority to KR1020060011465A priority patent/KR100736294B1/ko
Priority to CN2006100030623A priority patent/CN1818779B/zh
Publication of JP2006220701A publication Critical patent/JP2006220701A/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/285Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
    • C08F220/286Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety and containing polyethylene oxide in the alcohol moiety, e.g. methoxy polyethylene glycol (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2005031473A 2005-02-08 2005-02-08 感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー Active JP4621036B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005031473A JP4621036B2 (ja) 2005-02-08 2005-02-08 感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー
TW095101068A TW200636386A (en) 2005-02-08 2006-01-11 Photosensitive resin composition, cured material thereof and spacer for display panel comprising the cured material
KR1020060011465A KR100736294B1 (ko) 2005-02-08 2006-02-07 감광성 수지 조성물, 및 그의 경화물 및 상기 경화물로이루어지는 표시 패널용 스페이서
CN2006100030623A CN1818779B (zh) 2005-02-08 2006-02-08 感光性树脂组合物、及其固化物和由该固化物形成的显示板用间隔物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005031473A JP4621036B2 (ja) 2005-02-08 2005-02-08 感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー

Publications (2)

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JP2006220701A JP2006220701A (ja) 2006-08-24
JP4621036B2 true JP4621036B2 (ja) 2011-01-26

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JP (1) JP4621036B2 (ko)
KR (1) KR100736294B1 (ko)
CN (1) CN1818779B (ko)
TW (1) TW200636386A (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4994136B2 (ja) * 2006-07-26 2012-08-08 富士フイルム株式会社 感光性組成物、感光性樹脂転写フイルム及びフォトスペーサーの製造方法並びに液晶表示装置用基板、及び液晶表示装置
JP4806611B2 (ja) * 2006-09-22 2011-11-02 昭和電工株式会社 感光性樹脂組成物
JP5002479B2 (ja) * 2007-02-16 2012-08-15 太陽ホールディングス株式会社 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法
EP2116902A4 (en) * 2007-02-16 2011-02-02 Taiyo Ink Mfg Co Ltd COMPOSITION FOR MANUFACTURING HARDENED FILM PATTERN AND METHOD FOR MANUFACTURING HARDENED FILM PATTERN USING THE SAME
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
CN101923282B (zh) 2009-06-09 2012-01-25 清华大学 纳米压印抗蚀剂及采用该纳米压印抗蚀剂的纳米压印方法
JP5586174B2 (ja) * 2009-06-15 2014-09-10 住友化学株式会社 光学積層体およびその製造方法
TWI391418B (zh) * 2009-06-19 2013-04-01 Hon Hai Prec Ind Co Ltd 奈米壓印抗蝕劑及採用該奈米壓印抗蝕劑的奈米壓印方法
KR101208893B1 (ko) * 2009-08-04 2012-12-07 롬엔드하스전자재료코리아유한회사 초소수성 감광성 수지조성물 및 이를 이용한 블랙매트릭스
KR101992866B1 (ko) * 2013-02-06 2019-06-25 동우 화인켐 주식회사 착색 감광성 수지 조성물
CN107272342B (zh) * 2016-03-30 2021-03-05 东友精细化工有限公司 负型感光树脂组合物
KR102654596B1 (ko) * 2016-03-30 2024-04-04 동우 화인켐 주식회사 네가티브형 감광성 수지 조성물

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JPH11133600A (ja) * 1997-10-30 1999-05-21 Jsr Corp 表示パネルスペーサー用感放射線性樹脂組成物
JP2001089533A (ja) * 1999-09-24 2001-04-03 Showa Highpolymer Co Ltd 感光性樹脂
JP2001166128A (ja) * 1999-09-30 2001-06-22 Toray Ind Inc カラーフィルター用硬化性樹脂溶液組成物、透明保護膜、カラーフィルターおよび液晶表示装置
WO2001073510A1 (fr) * 2000-03-29 2001-10-04 Kanagawa University Composition de resine photodurcissante/thermodurcissante, couche seche photosensible preparee au moyen de cette resine et procede de creation de configurations
JP2001324809A (ja) * 2000-03-08 2001-11-22 Chisso Corp 感光性樹脂組成物、スペーサーおよび液晶表示素子
JP2003345015A (ja) * 2002-05-29 2003-12-03 Sumitomo Chem Co Ltd 感光性樹脂組成物
JP2004083754A (ja) * 2002-08-27 2004-03-18 Fujifilm Arch Co Ltd 光硬化性組成物、それを用いたカラーフィルターおよびパターン形成方法
JP2006023716A (ja) * 2004-06-08 2006-01-26 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2006048012A (ja) * 2004-06-28 2006-02-16 Sumitomo Chemical Co Ltd 着色感光性樹脂組成物

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JP2001310938A (ja) * 2000-04-28 2001-11-06 Showa Denko Kk 重合性組成物、その硬化物と製造方法
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JP4153159B2 (ja) * 2000-12-18 2008-09-17 富士フイルム株式会社 ネガ型感光性熱硬化性樹脂組成物、ネガ型感光性熱硬化性樹脂層転写材料、及びネガ型耐性画像形成方法
CN1573545A (zh) * 2003-06-20 2005-02-02 富士胶片株式会社 感光性转印片、感光性层合体、图像花样的形成方法以及布线花样的形成方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11133600A (ja) * 1997-10-30 1999-05-21 Jsr Corp 表示パネルスペーサー用感放射線性樹脂組成物
JP2001089533A (ja) * 1999-09-24 2001-04-03 Showa Highpolymer Co Ltd 感光性樹脂
JP2001166128A (ja) * 1999-09-30 2001-06-22 Toray Ind Inc カラーフィルター用硬化性樹脂溶液組成物、透明保護膜、カラーフィルターおよび液晶表示装置
JP2001324809A (ja) * 2000-03-08 2001-11-22 Chisso Corp 感光性樹脂組成物、スペーサーおよび液晶表示素子
WO2001073510A1 (fr) * 2000-03-29 2001-10-04 Kanagawa University Composition de resine photodurcissante/thermodurcissante, couche seche photosensible preparee au moyen de cette resine et procede de creation de configurations
JP2003345015A (ja) * 2002-05-29 2003-12-03 Sumitomo Chem Co Ltd 感光性樹脂組成物
JP2004083754A (ja) * 2002-08-27 2004-03-18 Fujifilm Arch Co Ltd 光硬化性組成物、それを用いたカラーフィルターおよびパターン形成方法
JP2006023716A (ja) * 2004-06-08 2006-01-26 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2006048012A (ja) * 2004-06-28 2006-02-16 Sumitomo Chemical Co Ltd 着色感光性樹脂組成物

Also Published As

Publication number Publication date
TWI305867B (ko) 2009-02-01
KR20060090594A (ko) 2006-08-14
CN1818779A (zh) 2006-08-16
JP2006220701A (ja) 2006-08-24
TW200636386A (en) 2006-10-16
KR100736294B1 (ko) 2007-07-06
CN1818779B (zh) 2011-02-02

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