TW200636386A - Photosensitive resin composition, cured material thereof and spacer for display panel comprising the cured material - Google Patents

Photosensitive resin composition, cured material thereof and spacer for display panel comprising the cured material

Info

Publication number
TW200636386A
TW200636386A TW095101068A TW95101068A TW200636386A TW 200636386 A TW200636386 A TW 200636386A TW 095101068 A TW095101068 A TW 095101068A TW 95101068 A TW95101068 A TW 95101068A TW 200636386 A TW200636386 A TW 200636386A
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
cured material
spacer
display panel
resin composition
Prior art date
Application number
TW095101068A
Other languages
English (en)
Other versions
TWI305867B (zh
Inventor
Masaki Sasaki
Masao Arima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200636386A publication Critical patent/TW200636386A/zh
Application granted granted Critical
Publication of TWI305867B publication Critical patent/TWI305867B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/285—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
    • C08F220/286—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety and containing polyethylene oxide in the alcohol moiety, e.g. methoxy polyethylene glycol (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW095101068A 2005-02-08 2006-01-11 Photosensitive resin composition, cured material thereof and spacer for display panel comprising the cured material TW200636386A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005031473A JP4621036B2 (ja) 2005-02-08 2005-02-08 感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー

Publications (2)

Publication Number Publication Date
TW200636386A true TW200636386A (en) 2006-10-16
TWI305867B TWI305867B (zh) 2009-02-01

Family

ID=36918837

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101068A TW200636386A (en) 2005-02-08 2006-01-11 Photosensitive resin composition, cured material thereof and spacer for display panel comprising the cured material

Country Status (4)

Country Link
JP (1) JP4621036B2 (zh)
KR (1) KR100736294B1 (zh)
CN (1) CN1818779B (zh)
TW (1) TW200636386A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391418B (zh) * 2009-06-19 2013-04-01 Hon Hai Prec Ind Co Ltd 奈米壓印抗蝕劑及採用該奈米壓印抗蝕劑的奈米壓印方法
US8574822B2 (en) 2009-06-09 2013-11-05 Tsinghua University Nanoimprint resist

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4994136B2 (ja) * 2006-07-26 2012-08-08 富士フイルム株式会社 感光性組成物、感光性樹脂転写フイルム及びフォトスペーサーの製造方法並びに液晶表示装置用基板、及び液晶表示装置
JP4806611B2 (ja) * 2006-09-22 2011-11-02 昭和電工株式会社 感光性樹脂組成物
JP5002479B2 (ja) * 2007-02-16 2012-08-15 太陽ホールディングス株式会社 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法
EP2116902A4 (en) * 2007-02-16 2011-02-02 Taiyo Ink Mfg Co Ltd COMPOSITION FOR MANUFACTURING HARDENED FILM PATTERN AND METHOD FOR MANUFACTURING HARDENED FILM PATTERN USING THE SAME
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
JP5586174B2 (ja) * 2009-06-15 2014-09-10 住友化学株式会社 光学積層体およびその製造方法
KR101208893B1 (ko) * 2009-08-04 2012-12-07 롬엔드하스전자재료코리아유한회사 초소수성 감광성 수지조성물 및 이를 이용한 블랙매트릭스
KR101992866B1 (ko) * 2013-02-06 2019-06-25 동우 화인켐 주식회사 착색 감광성 수지 조성물
CN107272342B (zh) * 2016-03-30 2021-03-05 东友精细化工有限公司 负型感光树脂组合物
KR102654596B1 (ko) * 2016-03-30 2024-04-04 동우 화인켐 주식회사 네가티브형 감광성 수지 조성물

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JPH11133600A (ja) * 1997-10-30 1999-05-21 Jsr Corp 表示パネルスペーサー用感放射線性樹脂組成物
CN1332266C (zh) 1999-03-03 2007-08-15 日立化成工业株式会社 光敏树脂组合物、使用光敏树脂组合物的感光性元件、蚀刻图形的制法及印刷线路板的制法
JP2001114827A (ja) * 1999-08-11 2001-04-24 Dainippon Printing Co Ltd 高安定性樹脂、硬化性樹脂組成物、それらの製造方法、カラーフィルター及び液晶パネル
JP3688949B2 (ja) * 1999-09-24 2005-08-31 昭和高分子株式会社 感光性樹脂
JP2001166128A (ja) * 1999-09-30 2001-06-22 Toray Ind Inc カラーフィルター用硬化性樹脂溶液組成物、透明保護膜、カラーフィルターおよび液晶表示装置
JP3786181B2 (ja) * 2000-03-08 2006-06-14 チッソ株式会社 感光性樹脂組成物、スペーサーおよび液晶表示素子
JP4606684B2 (ja) * 2000-03-29 2011-01-05 学校法人神奈川大学 光硬化性・熱硬化性樹脂組成物、その感光性ドライフィルム及びそれを用いたパターン形成方法
JP2001310938A (ja) * 2000-04-28 2001-11-06 Showa Denko Kk 重合性組成物、その硬化物と製造方法
JP4382978B2 (ja) * 2000-12-04 2009-12-16 学校法人神奈川大学 光硬化性・熱硬化性樹脂組成物
JP4153159B2 (ja) * 2000-12-18 2008-09-17 富士フイルム株式会社 ネガ型感光性熱硬化性樹脂組成物、ネガ型感光性熱硬化性樹脂層転写材料、及びネガ型耐性画像形成方法
JP2003345015A (ja) * 2002-05-29 2003-12-03 Sumitomo Chem Co Ltd 感光性樹脂組成物
JP2004083754A (ja) * 2002-08-27 2004-03-18 Fujifilm Arch Co Ltd 光硬化性組成物、それを用いたカラーフィルターおよびパターン形成方法
CN1573545A (zh) * 2003-06-20 2005-02-02 富士胶片株式会社 感光性转印片、感光性层合体、图像花样的形成方法以及布线花样的形成方法
JP2006023716A (ja) * 2004-06-08 2006-01-26 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP4720318B2 (ja) * 2004-06-28 2011-07-13 住友化学株式会社 着色感光性樹脂組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8574822B2 (en) 2009-06-09 2013-11-05 Tsinghua University Nanoimprint resist
US9120265B2 (en) 2009-06-09 2015-09-01 Tsinghua University Nanoimprint resist, nanoimprint mold and nanoimprint lithography
TWI391418B (zh) * 2009-06-19 2013-04-01 Hon Hai Prec Ind Co Ltd 奈米壓印抗蝕劑及採用該奈米壓印抗蝕劑的奈米壓印方法

Also Published As

Publication number Publication date
JP4621036B2 (ja) 2011-01-26
TWI305867B (zh) 2009-02-01
KR20060090594A (ko) 2006-08-14
CN1818779A (zh) 2006-08-16
JP2006220701A (ja) 2006-08-24
KR100736294B1 (ko) 2007-07-06
CN1818779B (zh) 2011-02-02

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