JP4601287B2 - 不揮発性半導体記憶装置 - Google Patents
不揮発性半導体記憶装置 Download PDFInfo
- Publication number
- JP4601287B2 JP4601287B2 JP2003420916A JP2003420916A JP4601287B2 JP 4601287 B2 JP4601287 B2 JP 4601287B2 JP 2003420916 A JP2003420916 A JP 2003420916A JP 2003420916 A JP2003420916 A JP 2003420916A JP 4601287 B2 JP4601287 B2 JP 4601287B2
- Authority
- JP
- Japan
- Prior art keywords
- line
- memory
- potential
- semiconductor
- memory cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/681—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
- H10D64/685—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered being perpendicular to the channel plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/693—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003420916A JP4601287B2 (ja) | 2002-12-26 | 2003-12-18 | 不揮発性半導体記憶装置 |
| US10/743,783 US6972997B2 (en) | 2002-12-26 | 2003-12-24 | Nonvolatile semiconductor memory device |
| US11/251,963 US7130223B2 (en) | 2002-12-26 | 2005-10-18 | Nonvolatile semiconductor memory device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002375921 | 2002-12-26 | ||
| JP2003420916A JP4601287B2 (ja) | 2002-12-26 | 2003-12-18 | 不揮発性半導体記憶装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004221554A JP2004221554A (ja) | 2004-08-05 |
| JP2004221554A5 JP2004221554A5 (enExample) | 2007-02-08 |
| JP4601287B2 true JP4601287B2 (ja) | 2010-12-22 |
Family
ID=32828866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003420916A Expired - Fee Related JP4601287B2 (ja) | 2002-12-26 | 2003-12-18 | 不揮発性半導体記憶装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US6972997B2 (enExample) |
| JP (1) | JP4601287B2 (enExample) |
Families Citing this family (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW546840B (en) | 2001-07-27 | 2003-08-11 | Hitachi Ltd | Non-volatile semiconductor memory device |
| US6795326B2 (en) * | 2001-12-12 | 2004-09-21 | Micron Technology, Inc. | Flash array implementation with local and global bit lines |
| JP4647175B2 (ja) | 2002-04-18 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
| JP4601316B2 (ja) * | 2004-03-31 | 2010-12-22 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
| JP4664707B2 (ja) | 2004-05-27 | 2011-04-06 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
| CN100595923C (zh) * | 2004-05-27 | 2010-03-24 | 株式会社瑞萨科技 | 集成半导体非易失性存储器的控制方法 |
| JP4419699B2 (ja) * | 2004-06-16 | 2010-02-24 | ソニー株式会社 | 不揮発性半導体メモリ装置およびその動作方法 |
| JP5007017B2 (ja) * | 2004-06-30 | 2012-08-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP4758625B2 (ja) * | 2004-08-09 | 2011-08-31 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7145802B2 (en) * | 2004-08-31 | 2006-12-05 | Skymedi Corporation | Programming and manufacturing method for split gate memory cell |
| JP4881552B2 (ja) * | 2004-09-09 | 2012-02-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4649156B2 (ja) * | 2004-09-28 | 2011-03-09 | シチズンホールディングス株式会社 | 半導体装置およびそのデータ書き込み方法 |
| JP4795660B2 (ja) * | 2004-09-29 | 2011-10-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| DE102005017072A1 (de) * | 2004-12-29 | 2006-07-13 | Hynix Semiconductor Inc., Ichon | Ladungsfalle- bzw. Ladung-Trap-Isolator-Speichereinrichtung |
| KR100696766B1 (ko) * | 2004-12-29 | 2007-03-19 | 주식회사 하이닉스반도체 | 차지 트랩 인슐레이터 메모리 장치 |
| US7200045B2 (en) * | 2004-12-30 | 2007-04-03 | Macronix International Company, Ltd. | Method for programming a charge-trapping nonvolatile memory cell by raised-Vs channel initialed secondary electron injection (CHISEL) |
| JP4683494B2 (ja) * | 2005-02-10 | 2011-05-18 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体メモリ及び半導体装置 |
| US7144777B2 (en) * | 2005-02-25 | 2006-12-05 | United Microelectronics Corp. | Non-volatile memory and manufacturing method thereof |
| JP5116987B2 (ja) * | 2005-05-23 | 2013-01-09 | ルネサスエレクトロニクス株式会社 | 集積半導体不揮発性記憶装置 |
| JP5014591B2 (ja) * | 2005-05-24 | 2012-08-29 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| JP4659527B2 (ja) * | 2005-06-20 | 2011-03-30 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| TWI287868B (en) * | 2005-11-17 | 2007-10-01 | Ememory Technology Inc | Single-poly non-volatile memory device |
| TWI311796B (en) * | 2005-11-17 | 2009-07-01 | Ememory Technology Inc | Semiconductor device and manufacturing method thereof |
| JP4646837B2 (ja) * | 2006-03-13 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| TWI333691B (en) * | 2006-05-23 | 2010-11-21 | Ememory Technology Inc | Nonvolatile memory with twin gate and method of operating the same |
| JP4856488B2 (ja) * | 2006-07-27 | 2012-01-18 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7416945B1 (en) * | 2007-02-19 | 2008-08-26 | Freescale Semiconductor, Inc. | Method for forming a split gate memory device |
| CN101652816B (zh) | 2007-04-05 | 2013-10-09 | Nxp股份有限公司 | 存储器单元、存储器阵列和对存储器单元进行编程的方法 |
| JP2009076188A (ja) * | 2007-08-24 | 2009-04-09 | Renesas Technology Corp | 不揮発性半導体記憶装置 |
| US8320191B2 (en) | 2007-08-30 | 2012-11-27 | Infineon Technologies Ag | Memory cell arrangement, method for controlling a memory cell, memory array and electronic device |
| JP5313487B2 (ja) * | 2007-11-21 | 2013-10-09 | 株式会社Genusion | 不揮発性半導体記憶素子および不揮発性半導体記憶装置 |
| US8492826B2 (en) | 2007-10-09 | 2013-07-23 | Genusion, Inc. | Non-volatile semiconductor memory device and manufacturing method thereof |
| JP2009146497A (ja) * | 2007-12-13 | 2009-07-02 | Renesas Technology Corp | 半導体装置 |
| US8189385B2 (en) * | 2007-12-26 | 2012-05-29 | Semiconductor Components Industries, Llc | Nonvolatile semiconductor memory device, method for manufacturing the same, and nonvolatile memory array |
| US7843730B2 (en) * | 2008-01-16 | 2010-11-30 | Freescale Semiconductor, Inc. | Non-volatile memory with reduced charge fluence |
| US8274829B2 (en) * | 2008-06-09 | 2012-09-25 | Aplus Flash Technology, Inc. | Row-decoder and source-decoder structures suitable for erase in unit of page, sector and chip of a NOR-type flash operating below +/− 10V BVDS |
| US8289775B2 (en) * | 2008-06-20 | 2012-10-16 | Aplus Flash Technology, Inc. | Apparatus and method for inhibiting excess leakage current in unselected nonvolatile memory cells in an array |
| TWI406397B (zh) * | 2008-11-12 | 2013-08-21 | Ememory Technology Inc | 非揮發性記憶體 |
| JP5519154B2 (ja) * | 2009-01-09 | 2014-06-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5300773B2 (ja) * | 2010-03-29 | 2013-09-25 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
| FR2959349B1 (fr) | 2010-04-22 | 2012-09-21 | Commissariat Energie Atomique | Fabrication d'une memoire a deux grilles independantes auto-alignees |
| FR2968453B1 (fr) | 2010-12-02 | 2013-01-11 | Commissariat Energie Atomique | Cellule memoire electronique a double grille et dispositif a cellules memoires electroniques a double grille |
| JP2011171755A (ja) * | 2011-04-15 | 2011-09-01 | Renesas Electronics Corp | 半導体装置 |
| FR2985593B1 (fr) | 2012-01-09 | 2014-02-21 | Commissariat Energie Atomique | Procede de fabrication d'une cellule memoire non volatile a double grille |
| FR2985592B1 (fr) * | 2012-01-09 | 2014-02-21 | Commissariat Energie Atomique | Procede de fabrication d'une cellule memoire non volatile a double grille |
| FR2988896B1 (fr) | 2012-03-29 | 2014-04-25 | Commissariat Energie Atomique | Cellule memoire electronique a double grille et procede de fabrication d'une telle cellule |
| US20140167141A1 (en) | 2012-12-14 | 2014-06-19 | Spansion Llc | Charge Trapping Split Gate Embedded Flash Memory and Associated Methods |
| US8822289B2 (en) | 2012-12-14 | 2014-09-02 | Spansion Llc | High voltage gate formation |
| US8816438B2 (en) | 2012-12-14 | 2014-08-26 | Spansion Llc | Process charging protection for split gate charge trapping flash |
| US20140167142A1 (en) | 2012-12-14 | 2014-06-19 | Spansion Llc | Use Disposable Gate Cap to Form Transistors, and Split Gate Charge Trapping Memory Cells |
| US10014380B2 (en) | 2012-12-14 | 2018-07-03 | Cypress Semiconductor Corporation | Memory first process flow and device |
| US9209197B2 (en) | 2012-12-14 | 2015-12-08 | Cypress Semiconductor Corporation | Memory gate landing pad made from dummy features |
| US9368606B2 (en) | 2012-12-14 | 2016-06-14 | Cypress Semiconductor Corporation | Memory first process flow and device |
| US20140167220A1 (en) * | 2012-12-14 | 2014-06-19 | Spansion Llc | Three dimensional capacitor |
| US8836006B2 (en) | 2012-12-14 | 2014-09-16 | Spansion Llc | Integrated circuits with non-volatile memory and methods for manufacture |
| US9966477B2 (en) | 2012-12-14 | 2018-05-08 | Cypress Semiconductor Corporation | Charge trapping split gate device and method of fabricating same |
| US20140210012A1 (en) | 2013-01-31 | 2014-07-31 | Spansion Llc | Manufacturing of FET Devices Having Lightly Doped Drain and Source Regions |
| KR102065114B1 (ko) * | 2013-03-14 | 2020-01-10 | 삼성전자주식회사 | 파워 소자의 전류 붕괴를 감소시키는 구동방법 |
| FR3008229B1 (fr) | 2013-07-05 | 2016-12-09 | Commissariat Energie Atomique | Procede de fabrication d'une cellule memoire electronique a double grille et cellule memoire associee |
| US8895397B1 (en) * | 2013-10-15 | 2014-11-25 | Globalfoundries Singapore Pte. Ltd. | Methods for forming thin film storage memory cells |
| JP6274826B2 (ja) | 2013-11-14 | 2018-02-07 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US11308383B2 (en) | 2016-05-17 | 2022-04-19 | Silicon Storage Technology, Inc. | Deep learning neural network classifier using non-volatile memory array |
| US10074438B2 (en) | 2016-06-10 | 2018-09-11 | Cypress Semiconductor Corporation | Methods and devices for reducing program disturb in non-volatile memory cell arrays |
| US9997253B1 (en) | 2016-12-08 | 2018-06-12 | Cypress Semiconductor Corporation | Non-volatile memory array with memory gate line and source line scrambling |
| WO2018201060A1 (en) * | 2017-04-27 | 2018-11-01 | The Regents Of The University Of California | Mixed signal neuromorphic computing with nonvolatile memory devices |
| US10699779B2 (en) | 2017-11-29 | 2020-06-30 | Silicon Storage Technology, Inc. | Neural network classifier using array of two-gate non-volatile memory cells |
| US11500442B2 (en) | 2019-01-18 | 2022-11-15 | Silicon Storage Technology, Inc. | System for converting neuron current into neuron current-based time pulses in an analog neural memory in a deep learning artificial neural network |
| US11023559B2 (en) | 2019-01-25 | 2021-06-01 | Microsemi Soc Corp. | Apparatus and method for combining analog neural net with FPGA routing in a monolithic integrated circuit |
| US11270771B2 (en) | 2019-01-29 | 2022-03-08 | Silicon Storage Technology, Inc. | Neural network classifier using array of stacked gate non-volatile memory cells |
| US11423979B2 (en) | 2019-04-29 | 2022-08-23 | Silicon Storage Technology, Inc. | Decoding system and physical layout for analog neural memory in deep learning artificial neural network |
| CN110854119A (zh) * | 2019-11-12 | 2020-02-28 | 上海华力微电子有限公司 | 一种1.5t sonos存储器结构及制造方法 |
| CN111129017B (zh) * | 2019-12-26 | 2022-06-07 | 华虹半导体(无锡)有限公司 | Otp存储器及其制造方法 |
| CN113013256B (zh) * | 2021-02-04 | 2024-06-14 | 上海华力集成电路制造有限公司 | 分栅monos闪存及其制造方法 |
| CN113921065B (zh) * | 2021-09-30 | 2024-08-02 | 中天弘宇集成电路有限责任公司 | 存储器的编程方法 |
| WO2023199474A1 (ja) * | 2022-04-14 | 2023-10-19 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体素子を用いたメモリ装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995024057A2 (en) * | 1994-03-03 | 1995-09-08 | Rohm Corporation | Low voltage one transistor flash eeprom cell using fowler-nordheim programming and erase |
| EP0690452A3 (en) * | 1994-06-28 | 1999-01-07 | Advanced Micro Devices, Inc. | Electrically erasable memory and method of erasure |
| US6330190B1 (en) * | 1996-05-30 | 2001-12-11 | Hyundai Electronics America | Semiconductor structure for flash memory enabling low operating potentials |
| US5969383A (en) * | 1997-06-16 | 1999-10-19 | Motorola, Inc. | Split-gate memory device and method for accessing the same |
| US6051860A (en) * | 1998-01-16 | 2000-04-18 | Matsushita Electric Industrial Co., Ltd. | Nonvolatile semiconductor memory device and method for fabricating the same and semiconductor integrated circuit |
| US5991204A (en) * | 1998-04-15 | 1999-11-23 | Chang; Ming-Bing | Flash eeprom device employing polysilicon sidewall spacer as an erase gate |
| US5943261A (en) * | 1998-08-07 | 1999-08-24 | Winbond Electronics Corporation | Method for programming a flash memory |
| US6255166B1 (en) | 1999-08-05 | 2001-07-03 | Aalo Lsi Design & Device Technology, Inc. | Nonvolatile memory cell, method of programming the same and nonvolatile memory array |
| US6426898B1 (en) * | 2001-03-05 | 2002-07-30 | Micron Technology, Inc. | Method of reducing trapped holes induced by erase operations in the tunnel oxide of flash memory cells |
| JP4647175B2 (ja) * | 2002-04-18 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
-
2003
- 2003-12-18 JP JP2003420916A patent/JP4601287B2/ja not_active Expired - Fee Related
- 2003-12-24 US US10/743,783 patent/US6972997B2/en not_active Expired - Lifetime
-
2005
- 2005-10-18 US US11/251,963 patent/US7130223B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20040155234A1 (en) | 2004-08-12 |
| US6972997B2 (en) | 2005-12-06 |
| US20060050557A1 (en) | 2006-03-09 |
| US7130223B2 (en) | 2006-10-31 |
| JP2004221554A (ja) | 2004-08-05 |
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