JP4546078B2 - 伝導材料中の構造を定義し、複製するための方法及び電極 - Google Patents

伝導材料中の構造を定義し、複製するための方法及び電極 Download PDF

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JP4546078B2
JP4546078B2 JP2003505393A JP2003505393A JP4546078B2 JP 4546078 B2 JP4546078 B2 JP 4546078B2 JP 2003505393 A JP2003505393 A JP 2003505393A JP 2003505393 A JP2003505393 A JP 2003505393A JP 4546078 B2 JP4546078 B2 JP 4546078B2
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electrode
master electrode
substrate
master
layer
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Japanese (ja)
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JP2004530050A5 (enExample
JP2004530050A (ja
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ミョーレル，パトリック
フレデンベルイ，ミカエル
ビベン−ニルソン，ペーテル
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レプリサウルス テクノロジーズ アクティエボラーグ
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Methods (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2003505393A 2001-06-15 2002-06-17 伝導材料中の構造を定義し、複製するための方法及び電極 Expired - Fee Related JP4546078B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
PCT/SE2002/001179 WO2002103085A1 (en) 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009142804A Division JP2009235578A (ja) 2001-06-15 2009-06-15 伝導材料中の構造を画定し、複製するための方法及び電極

Publications (3)

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JP2004530050A JP2004530050A (ja) 2004-09-30
JP2004530050A5 JP2004530050A5 (enExample) 2010-06-17
JP4546078B2 true JP4546078B2 (ja) 2010-09-15

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Family Applications (2)

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JP2003505393A Expired - Fee Related JP4546078B2 (ja) 2001-06-15 2002-06-17 伝導材料中の構造を定義し、複製するための方法及び電極
JP2009142804A Pending JP2009235578A (ja) 2001-06-15 2009-06-15 伝導材料中の構造を画定し、複製するための方法及び電極

Family Applications After (1)

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JP2009142804A Pending JP2009235578A (ja) 2001-06-15 2009-06-15 伝導材料中の構造を画定し、複製するための方法及び電極

Country Status (12)

Country Link
US (4) US7790009B2 (enExample)
EP (2) EP1404899B1 (enExample)
JP (2) JP4546078B2 (enExample)
KR (1) KR101250685B1 (enExample)
CN (1) CN1294296C (enExample)
CA (1) CA2462098C (enExample)
DK (1) DK1404899T3 (enExample)
ES (2) ES2397919T3 (enExample)
PT (1) PT1404899E (enExample)
RU (1) RU2296820C2 (enExample)
SE (1) SE523309E (enExample)
WO (1) WO2002103085A1 (enExample)

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KR101250685B1 (ko) 2013-04-03
US7790009B2 (en) 2010-09-07
US20070151858A1 (en) 2007-07-05
CN1294296C (zh) 2007-01-10
RU2296820C2 (ru) 2007-04-10
HK1072083A1 (en) 2005-08-12
SE0102144D0 (sv) 2001-06-15
US20110000784A1 (en) 2011-01-06
US20040154828A1 (en) 2004-08-12
SE523309E (sv) 2010-03-02
ES2397919T3 (es) 2013-03-12
CA2462098A1 (en) 2002-12-27
DK1404899T3 (da) 2013-02-04
EP1404899A1 (en) 2004-04-07
PT1404899E (pt) 2013-01-28
US8741113B2 (en) 2014-06-03
KR20040028781A (ko) 2004-04-03
US20120228128A1 (en) 2012-09-13
SE0102144L (sv) 2002-12-19
JP2004530050A (ja) 2004-09-30
EP2322694A1 (en) 2011-05-18
EP2322694B1 (en) 2017-08-02
EP1404899B1 (en) 2012-10-31
CN1555428A (zh) 2004-12-15
SE523309C2 (sv) 2004-04-13
CA2462098C (en) 2014-01-14

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