KR101250685B1 - 전도 재료의 구조를 정의하고 복제하는 방법 및 전극 - Google Patents

전도 재료의 구조를 정의하고 복제하는 방법 및 전극 Download PDF

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Publication number
KR101250685B1
KR101250685B1 KR1020037016336A KR20037016336A KR101250685B1 KR 101250685 B1 KR101250685 B1 KR 101250685B1 KR 1020037016336 A KR1020037016336 A KR 1020037016336A KR 20037016336 A KR20037016336 A KR 20037016336A KR 101250685 B1 KR101250685 B1 KR 101250685B1
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KR
South Korea
Prior art keywords
master electrode
substrate
etching
electrode
pattern
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Expired - Fee Related
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KR1020037016336A
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English (en)
Korean (ko)
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KR20040028781A (ko
Inventor
묄러파트릭
프레덴베르크미카엘
비벤-닐슨페터
Original Assignee
레플리서러스 그룹 에스에이에스
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Printing Methods (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • ing And Chemical Polishing (AREA)
KR1020037016336A 2001-06-15 2002-06-17 전도 재료의 구조를 정의하고 복제하는 방법 및 전극 Expired - Fee Related KR101250685B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0102144-3 2001-06-15
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
PCT/SE2002/001179 WO2002103085A1 (en) 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials

Publications (2)

Publication Number Publication Date
KR20040028781A KR20040028781A (ko) 2004-04-03
KR101250685B1 true KR101250685B1 (ko) 2013-04-03

Family

ID=20284507

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037016336A Expired - Fee Related KR101250685B1 (ko) 2001-06-15 2002-06-17 전도 재료의 구조를 정의하고 복제하는 방법 및 전극

Country Status (12)

Country Link
US (4) US7790009B2 (enExample)
EP (2) EP2322694B1 (enExample)
JP (2) JP4546078B2 (enExample)
KR (1) KR101250685B1 (enExample)
CN (1) CN1294296C (enExample)
CA (1) CA2462098C (enExample)
DK (1) DK1404899T3 (enExample)
ES (2) ES2397919T3 (enExample)
PT (1) PT1404899E (enExample)
RU (1) RU2296820C2 (enExample)
SE (1) SE523309E (enExample)
WO (1) WO2002103085A1 (enExample)

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ES2397919T3 (es) 2013-03-12
SE523309E (sv) 2010-03-02
SE0102144D0 (sv) 2001-06-15
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US7790009B2 (en) 2010-09-07
SE0102144L (sv) 2002-12-19
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EP1404899A1 (en) 2004-04-07
RU2296820C2 (ru) 2007-04-10
US20070151858A1 (en) 2007-07-05
WO2002103085A1 (en) 2002-12-27
US20040154828A1 (en) 2004-08-12
US20120228128A1 (en) 2012-09-13
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RU2003136088A (ru) 2005-05-10
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