CN1294296C - 确定与复制导电材料中的结构的方法与电极 - Google Patents

确定与复制导电材料中的结构的方法与电极 Download PDF

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Publication number
CN1294296C
CN1294296C CNB028119266A CN02811926A CN1294296C CN 1294296 C CN1294296 C CN 1294296C CN B028119266 A CNB028119266 A CN B028119266A CN 02811926 A CN02811926 A CN 02811926A CN 1294296 C CN1294296 C CN 1294296C
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CN
China
Prior art keywords
main electrode
electrode
etching
substrate
layer
Prior art date
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Expired - Fee Related
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CNB028119266A
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English (en)
Chinese (zh)
Other versions
CN1555428A (zh
Inventor
P·莫勒
M·弗雷登贝里
P·维文－尼尔松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nobel Venture Capital Finance Second
Nvf Investments Ltd
Replisaurus Group Sas
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REPLISAURUS HB
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Publication date
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Application filed by REPLISAURUS HB filed Critical REPLISAURUS HB
Publication of CN1555428A publication Critical patent/CN1555428A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Printing Methods (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • ing And Chemical Polishing (AREA)
CNB028119266A 2001-06-15 2002-06-17 确定与复制导电材料中的结构的方法与电极 Expired - Fee Related CN1294296C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
SE01021443 2001-06-15

Publications (2)

Publication Number Publication Date
CN1555428A CN1555428A (zh) 2004-12-15
CN1294296C true CN1294296C (zh) 2007-01-10

Family

ID=20284507

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028119266A Expired - Fee Related CN1294296C (zh) 2001-06-15 2002-06-17 确定与复制导电材料中的结构的方法与电极

Country Status (12)

Country Link
US (4) US7790009B2 (enExample)
EP (2) EP2322694B1 (enExample)
JP (2) JP4546078B2 (enExample)
KR (1) KR101250685B1 (enExample)
CN (1) CN1294296C (enExample)
CA (1) CA2462098C (enExample)
DK (1) DK1404899T3 (enExample)
ES (2) ES2397919T3 (enExample)
PT (1) PT1404899E (enExample)
RU (1) RU2296820C2 (enExample)
SE (1) SE523309E (enExample)
WO (1) WO2002103085A1 (enExample)

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JP4546078B2 (ja) 2010-09-15
ES2397919T3 (es) 2013-03-12
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SE0102144D0 (sv) 2001-06-15
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US7790009B2 (en) 2010-09-07
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EP1404899A1 (en) 2004-04-07
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US20070151858A1 (en) 2007-07-05
WO2002103085A1 (en) 2002-12-27
US20040154828A1 (en) 2004-08-12
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