ES2645700T3 - Procedimiento para definir y reproducir estructuras en materiales conductores - Google Patents

Procedimiento para definir y reproducir estructuras en materiales conductores Download PDF

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Publication number
ES2645700T3
ES2645700T3 ES10182946.3T ES10182946T ES2645700T3 ES 2645700 T3 ES2645700 T3 ES 2645700T3 ES 10182946 T ES10182946 T ES 10182946T ES 2645700 T3 ES2645700 T3 ES 2645700T3
Authority
ES
Spain
Prior art keywords
pattern
substrate
master electrode
define
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES10182946.3T
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English (en)
Inventor
Patrik Méller
Mikael Fredenberg
Peter Wiwen-Nilsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luxembourg Institute of Science and Technology LIST
Original Assignee
Luxembourg Institute of Science and Technology LIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Application filed by Luxembourg Institute of Science and Technology LIST filed Critical Luxembourg Institute of Science and Technology LIST
Application granted granted Critical
Publication of ES2645700T3 publication Critical patent/ES2645700T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
  • Printing Methods (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Un procedimiento de reproducción de un patrón electromecánico para la producción de micro o nanoestructuras de un material electroconductor en un sustrato (9), a través del cual se reproduce un patrón de grabado, definido por un material con un patrón aislante eléctricamente, comprendiendo dicho procedimiento el uso de un proceso electroquímico para transferir dicho patrón en el sustrato (9), dicho proceso electroquímico que comprende la disolución de un material en una superficie anódica y la deposición del material en una superficie catódica caracterizado por colocar un electrodo maestro (8) que comprende una paca de contraelectrodo (1) y una capa aislante de patrón (3) del material aislante del patrón, en estrecha colaboración con el sustrato (9) de forma que el patrón queda definido por el uso del electrodo maestro (8), y dicha disolución y deposición de material se realiza en las celdas locales de grabado (12, 14) que se forma en las cavidades, delimitado por la capa aislante de patrón (3) del electrodo maestro (8) y el sustrato (9), siendo el sustrato (9) dicha superficie anódica y siendo el electrodo maestro (8) dicha superficie catódica y siendo las celdas locales de grabado dichas cavidades (12).

Description

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Claims (1)

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ES10182946.3T 2001-06-15 2002-06-17 Procedimiento para definir y reproducir estructuras en materiales conductores Expired - Lifetime ES2645700T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
SE0102144 2001-06-15

Publications (1)

Publication Number Publication Date
ES2645700T3 true ES2645700T3 (es) 2017-12-07

Family

ID=20284507

Family Applications (2)

Application Number Title Priority Date Filing Date
ES02739042T Expired - Lifetime ES2397919T3 (es) 2001-06-15 2002-06-17 Procedimiento y electrodo para definir y reproducir estructuras en materiales conductores
ES10182946.3T Expired - Lifetime ES2645700T3 (es) 2001-06-15 2002-06-17 Procedimiento para definir y reproducir estructuras en materiales conductores

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES02739042T Expired - Lifetime ES2397919T3 (es) 2001-06-15 2002-06-17 Procedimiento y electrodo para definir y reproducir estructuras en materiales conductores

Country Status (13)

Country Link
US (4) US7790009B2 (es)
EP (2) EP1404899B1 (es)
JP (2) JP4546078B2 (es)
KR (1) KR101250685B1 (es)
CN (1) CN1294296C (es)
CA (1) CA2462098C (es)
DK (1) DK1404899T3 (es)
ES (2) ES2397919T3 (es)
HK (1) HK1072083A1 (es)
PT (1) PT1404899E (es)
RU (1) RU2296820C2 (es)
SE (1) SE523309E (es)
WO (1) WO2002103085A1 (es)

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KR20010105994A (ko) * 2000-05-20 2001-11-29 구자홍 디스크 드라이버의 트레이

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RU2296820C2 (ru) 2007-04-10
JP2009235578A (ja) 2009-10-15
US20120228128A1 (en) 2012-09-13
SE0102144L (sv) 2002-12-19
EP1404899A1 (en) 2004-04-07
CA2462098A1 (en) 2002-12-27
US8741113B2 (en) 2014-06-03
SE523309C2 (sv) 2004-04-13
KR101250685B1 (ko) 2013-04-03
EP2322694A1 (en) 2011-05-18
HK1072083A1 (en) 2005-08-12
ES2397919T3 (es) 2013-03-12
US20110000784A1 (en) 2011-01-06
KR20040028781A (ko) 2004-04-03
EP1404899B1 (en) 2012-10-31
EP2322694B1 (en) 2017-08-02
US20040154828A1 (en) 2004-08-12
JP4546078B2 (ja) 2010-09-15
SE0102144D0 (sv) 2001-06-15
JP2004530050A (ja) 2004-09-30
CN1294296C (zh) 2007-01-10
DK1404899T3 (da) 2013-02-04
CA2462098C (en) 2014-01-14
WO2002103085A1 (en) 2002-12-27
CN1555428A (zh) 2004-12-15
US7790009B2 (en) 2010-09-07
PT1404899E (pt) 2013-01-28

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