DK2655698T3 - Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denne - Google Patents
Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denneInfo
- Publication number
- DK2655698T3 DK2655698T3 DK10793274.1T DK10793274T DK2655698T3 DK 2655698 T3 DK2655698 T3 DK 2655698T3 DK 10793274 T DK10793274 T DK 10793274T DK 2655698 T3 DK2655698 T3 DK 2655698T3
- Authority
- DK
- Denmark
- Prior art keywords
- ecpr
- procedures
- manufacturing
- main electrode
- electrode
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Secondary Cells (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2010/070644 WO2012084045A1 (en) | 2010-12-23 | 2010-12-23 | Master electrode for ecpr and manufacturing methods thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
DK2655698T3 true DK2655698T3 (da) | 2019-08-12 |
Family
ID=43799694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK10793274.1T DK2655698T3 (da) | 2010-12-23 | 2010-12-23 | Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denne |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2655698B1 (da) |
DK (1) | DK2655698T3 (da) |
WO (1) | WO2012084045A1 (da) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5722933B2 (ja) * | 2013-02-04 | 2015-05-27 | 株式会社豊田中央研究所 | 積層電極 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57154829A (en) * | 1981-03-20 | 1982-09-24 | Internatl Rectifier Corp Japan Ltd | Forming method for electrode metal of semiconductor device |
SE523309E (sv) | 2001-06-15 | 2009-10-26 | Replisaurus Technologies Ab | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
US6787450B2 (en) * | 2002-05-29 | 2004-09-07 | Micron Technology, Inc. | High aspect ratio fill method and resulting structure |
JP2009516388A (ja) * | 2005-11-18 | 2009-04-16 | レプリソールス テクノロジーズ アーベー | 多層構造の形成方法 |
-
2010
- 2010-12-23 DK DK10793274.1T patent/DK2655698T3/da active
- 2010-12-23 WO PCT/EP2010/070644 patent/WO2012084045A1/en active Application Filing
- 2010-12-23 EP EP10793274.1A patent/EP2655698B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2655698B1 (en) | 2019-05-15 |
WO2012084045A1 (en) | 2012-06-28 |
EP2655698A1 (en) | 2013-10-30 |
WO2012084045A8 (en) | 2019-02-07 |
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