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Priority to MYPI20034732ApriorityCriticalpatent/MY146541A/en
Publication of MY146541ApublicationCriticalpatent/MY146541A/en
THE PRESENT INVENTION CONCERNS AN ELECTROCHEMICAL PATTERN REPLICATION METHOD, ECPR, AND A CONSTRUCTION OF A CONDUCTIVE ELECTRODE FOR PRODUCTION OF APPLICATIONS INVOLVING MICRO AND NANO STRUCTURES. AN ETCHING OR PLATING PATTERN, WHICH IS DEFINED BY A CONDUCTIVE ELECTRODE, A MASTER ELECTRODE (8), IS REPLICATED ON AN ELECTRICALLY CONDUCTIVE MATERIAL, A SUBSTRATE (9). THE MASTER ELECTRODE (8) IS PUT IN CLOSE CONTACT WITH THE SUBSTRATE (9) AND THE ETCHING/PLATING PATTERN IS DIRECTLY TRANSFERRED ONTO THE SUBSTRATE (9) BY USING A CONTACT ETCHING/PLATING PROCESS. THE CONTACT ETCHING/PLATING PROCESS IS PERFORMED IN LOCAL ETCHING/PLATING CELLS (12, 14), THAT ARE FORMED IN CLOSED OR OPEN CAVITIES BETWEEN THE MASTER ELECTRODE (8) AND THE SUBSTRATE (9).
MYPI20034732A2003-12-102003-12-10Method and electrode for defining and replicating structures in conducting materials
MY146541A
(en)
PARTICLES CONSISTING OF NON-CONDUCTIVE OR SEMICONDUCTIVE COREES COATED WITH A CONDUCTIVE HYBRID LAYER AND THEIR PRODUCTION PROCESS AND USES IN ELECTROCHEMICAL DEVICES
Process for producing a high-resolution surface pattern, multi-layer body having a substrate layer and a pattern layer and apparatus for producing a high-resolution surface pattern on a substrate