JP2006501659A5 - - Google Patents

Claims (29)

Organic a film (1,3,6,7,8,9) that has at least one device is created using a semiconductor technology, the device comprises a plurality of layers, layers of said plurality of electrical In a film (1, 3, 6, 7, 8, 9) containing a functional layer,
One or more layers of the device are provided with a spatial structure by thermal transfer or UV transfer, and the functional layer is partly completely excised in the region of the spatial structure (1, 3, 6, 7, 8, 9).   The film (1, 3, 6, 7, 8, 9) according to claim 1, wherein the film is an embossed film or a laminated film. The mold press film or laminated film, the carrier film (11,61,71,81), at least one layer comprising an organic semiconductor materials (16,67,76,88), at least one layer comprising an electrically insulating material (15, 65, 75, 87) and two or more layers (14, 17, 19, 64, 66, 74, 77, 86, which are shaped into a pattern in a region and contain a conductive material) 89. A film (1, 3, 6, 7, 8, 9) according to claim 2, characterized in that it has 89). The film of claim 3 conductive layer (14,17,19,64,66,74,77,86,89) is characterized by comprising an organic conductive material (1, 3, 6, 7, 8, 9). A film according to claim 3 or 4, wherein the electrically insulating layer (15,65,75,87) is characterized in that it comprises an organic insulating materials (1,3,6,7,8,9). 6. The embossed film having a carrier film (11) and a transfer layer portion (2) detachably provided on the carrier film (11). The film according to (1,3,6,7,8,9). The type push film according to claim 6, wherein the Turkey of having a release layer (12,62,72,82) and adhesive layer (20,69,79,97) film (1,3, 6, 7, 8, 9). The embossed film or laminated film has one or more lacquer layers (13, 18, 63, 68, 73, 78, 84, 90) adjacent to the functional polymer layer. The film (1, 3, 6, 7, 8, 9) according to any one of claims 2 to 7 .   The film (1, 3, 6, 7, 8, 9) according to claim 3, wherein the conductive layer, the layer containing a semiconductor material and the layer containing an electrically insulating material are transparent. It said film, a layer containing an organic semiconductor materials (16), a layer containing an electrically insulating material (15) and includes a conductive material, shaped into a pattern shape in the area shape, two or more layers ( A film (2) according to claim 1, characterized in that it is a film element (2) having 14, 17, 19). The film of claim 10 wherein the film (2), characterized in that a film element which is worn on a substrate using a mold press film or laminated film (1). A film according to any one of claims 1 to 11, the electrical functionality, characterized in that it is combined with the optical properties (8). The film is shaped between the layers of the film, while the electronic device layer (46) created using organic semiconductor technology is structured into a pattern shape, and on the other hand, it produces a light diffraction effect as an optical feature. The film (8) according to claim 12 , characterized in that it has a spatial structure (47). The spatial structure (47) is formed by superposition of a giant structure and a microstructure, and the giant structure is useful for structuring with a pattern of the layer (46) of the electronic device created using organic semiconductor technology, the microstructure The film of claim 13 , which helps to generate the optical features. It said film according to any one of claims 1 to 14, characterized in that it comprises a holographic optical layers or diffractive layer (83,84,90,91) film (8). 16. A film (8) according to any one of the preceding claims, characterized in that the film has a thin film layer system (94, 95) in sequence. A film according to any one of claims 1 16, wherein the film is characterized by having a decorative layer. The film (8) has two or more mutually overlapping layers (83, 84, 90, 91, 94, 95) that create an optical security mark and is made using organic semiconductor technology one of claims 1 17, wherein the one or more functional layers of the electronic device (86,87,88,89) is arranged between such optically active layer being The film (8) according to crab.   The film according to claim 1, wherein the film is used as a security element.   A process for making a film (1, 3, 6, 7, 8, 9) according to claim 1, wherein one or more layers of at least one device made using organic semiconductor technology. Process characterized in that the structuring of (43, 49, 50) is carried out by thermal transfer or UV transfer.   A spatial structure whose structure depth is greater than or equal to the thickness of the layer (42) to be transferred is transferred to the layer (42) to be transferred, so that the layer to be transferred is partially completed by the transfer operation. 21. Process according to claim 20, characterized in that an electrical functional layer (43) is formed, which is cut out and structured in a pattern shape according to the spatial structure.   The process of claim 21, wherein the spatial structure is transferred to an electrode layer comprising a conductive material, and then an electrical functional layer comprising a non-conductive material or a semiconductor material is applied to the electrode layer.   21. Process according to claim 20, characterized in that a spatial structure whose structure depth is smaller than the thickness of the layer (42) to be transferred is transferred to the layer (42) to be transferred.   An electrical functional layer (49) of a material that undergoes a predetermined volume reduction upon curing is applied to the transfer layer (46), and the material has a functional layer structured in a pattern shape according to the transfer structure. 24. Process according to claim 23, characterized in that it is applied to the transfer layer (46) in the amount of deposit remaining due to the volume shrinkage upon curing.   The process of claim 24, wherein the functional layer comprises a UV curable material.   The electrical functional layer (50) is applied to the transfer layer (46) and then the electrical functional layer is deep enough to leave a functional layer (50) structured in a pattern according to the transfer structure, 24. Process according to claim 23, characterized in that it is removed, in particular by etching.   27. Any one of claims 23 to 26, wherein the spatial structure is transferred to an electrical functional layer comprising a non-conductive material or a semiconductor material, and then an electrode layer comprising a conductive material is deposited on the electrical functional layer. The process described in A process for making a film according to claim 1, wherein all or one or more electrode layers, insulating layers and semiconductors necessary for the function of at least one device made using organic semiconductor technology. features and to pulp process that a layer is introduced into the film structure over a portion of the total surface area or surface area by a printing process. Process according to any one of claims 20 to 28 which electrically functional及 beauty optical functionality, characterized in that it is made by the transfer operation.