JP4537109B2 - 現像処理装置および現像処理方法 - Google Patents

現像処理装置および現像処理方法 Download PDF

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Publication number
JP4537109B2
JP4537109B2 JP2004121184A JP2004121184A JP4537109B2 JP 4537109 B2 JP4537109 B2 JP 4537109B2 JP 2004121184 A JP2004121184 A JP 2004121184A JP 2004121184 A JP2004121184 A JP 2004121184A JP 4537109 B2 JP4537109 B2 JP 4537109B2
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JP
Japan
Prior art keywords
substrate
nozzle
developer
developing
lcd substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004121184A
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English (en)
Japanese (ja)
Other versions
JP2005303230A (ja
Inventor
徹也 佐田
英昭 後藤
拓男 川内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004121184A priority Critical patent/JP4537109B2/ja
Priority to KR1020050031463A priority patent/KR101053016B1/ko
Publication of JP2005303230A publication Critical patent/JP2005303230A/ja
Application granted granted Critical
Publication of JP4537109B2 publication Critical patent/JP4537109B2/ja
Priority to KR1020110003962A priority patent/KR101052949B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Atmospheric Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2004121184A 2004-04-16 2004-04-16 現像処理装置および現像処理方法 Expired - Fee Related JP4537109B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004121184A JP4537109B2 (ja) 2004-04-16 2004-04-16 現像処理装置および現像処理方法
KR1020050031463A KR101053016B1 (ko) 2004-04-16 2005-04-15 현상처리장치 및 현상처리방법
KR1020110003962A KR101052949B1 (ko) 2004-04-16 2011-01-14 현상처리장치 및 현상처리방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004121184A JP4537109B2 (ja) 2004-04-16 2004-04-16 現像処理装置および現像処理方法

Publications (2)

Publication Number Publication Date
JP2005303230A JP2005303230A (ja) 2005-10-27
JP4537109B2 true JP4537109B2 (ja) 2010-09-01

Family

ID=35334334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004121184A Expired - Fee Related JP4537109B2 (ja) 2004-04-16 2004-04-16 現像処理装置および現像処理方法

Country Status (2)

Country Link
JP (1) JP4537109B2 (ko)
KR (2) KR101053016B1 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200201552Y1 (ko) * 2000-06-02 2000-11-01 송근용 화학약품용 부식 방지부재
JP4924187B2 (ja) * 2007-04-27 2012-04-25 東京エレクトロン株式会社 現像装置、現像方法及び塗布、現像装置並びに記憶媒体
JP4924186B2 (ja) * 2007-04-27 2012-04-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5449662B2 (ja) 2007-10-18 2014-03-19 株式会社Ｓｏｋｕｄｏ 現像装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR100935474B1 (ko) * 2008-02-27 2010-01-06 주식회사 케이씨텍 기판 처리장치
KR100935473B1 (ko) * 2008-02-27 2010-01-06 주식회사 케이씨텍 기판 처리장치
JP5188926B2 (ja) * 2008-10-16 2013-04-24 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN102969259B (zh) * 2011-08-31 2016-05-18 细美事有限公司 处理基板的装置
KR101308136B1 (ko) * 2011-08-31 2013-09-12 세메스 주식회사 기판 처리 장치
CN104347352B (zh) * 2013-07-31 2018-05-29 细美事有限公司 一种基板处理装置及基板处理方法
JP6390732B2 (ja) * 2013-08-05 2018-09-19 東京エレクトロン株式会社 処理液供給装置
JP6221954B2 (ja) * 2013-08-05 2017-11-01 東京エレクトロン株式会社 現像方法、現像装置及び記憶媒体
JP5668120B2 (ja) * 2013-10-01 2015-02-12 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 現像装置
KR102245499B1 (ko) * 2014-02-03 2021-04-29 삼성디스플레이 주식회사 현상 장치 및 이를 이용한 현상 방법
JP6475487B2 (ja) * 2014-12-15 2019-02-27 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 現像方法
JP7258196B2 (ja) * 2018-06-12 2023-04-14 東京エレクトロン株式会社 基板処理装置および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176949A (ja) * 1999-12-21 2001-06-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003017401A (ja) * 2001-07-05 2003-01-17 Tokyo Electron Ltd 液処理装置および液処理方法
JP2003017395A (ja) * 2001-07-03 2003-01-17 Tokyo Electron Ltd 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176949A (ja) * 1999-12-21 2001-06-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003017395A (ja) * 2001-07-03 2003-01-17 Tokyo Electron Ltd 基板処理装置
JP2003017401A (ja) * 2001-07-05 2003-01-17 Tokyo Electron Ltd 液処理装置および液処理方法

Also Published As

Publication number Publication date
JP2005303230A (ja) 2005-10-27
KR20060045764A (ko) 2006-05-17
KR20110013548A (ko) 2011-02-09
KR101053016B1 (ko) 2011-07-29
KR101052949B1 (ko) 2011-07-29

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