JP4513170B2 - 感光性重合体組成物 - Google Patents

感光性重合体組成物 Download PDF

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Publication number
JP4513170B2
JP4513170B2 JP2000146224A JP2000146224A JP4513170B2 JP 4513170 B2 JP4513170 B2 JP 4513170B2 JP 2000146224 A JP2000146224 A JP 2000146224A JP 2000146224 A JP2000146224 A JP 2000146224A JP 4513170 B2 JP4513170 B2 JP 4513170B2
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JP
Japan
Prior art keywords
pattern
bis
film
photosensitive polymer
polymer composition
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Expired - Fee Related
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JP2000146224A
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English (en)
Japanese (ja)
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JP2001330962A5 (enExample
JP2001330962A (ja
Inventor
健一 霞
智之 弓場
康二 藤本
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP2000146224A priority Critical patent/JP4513170B2/ja
Publication of JP2001330962A publication Critical patent/JP2001330962A/ja
Publication of JP2001330962A5 publication Critical patent/JP2001330962A5/ja
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Publication of JP4513170B2 publication Critical patent/JP4513170B2/ja
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  • Formation Of Insulating Films (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2000146224A 2000-05-18 2000-05-18 感光性重合体組成物 Expired - Fee Related JP4513170B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000146224A JP4513170B2 (ja) 2000-05-18 2000-05-18 感光性重合体組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000146224A JP4513170B2 (ja) 2000-05-18 2000-05-18 感光性重合体組成物

Publications (3)

Publication Number Publication Date
JP2001330962A JP2001330962A (ja) 2001-11-30
JP2001330962A5 JP2001330962A5 (enExample) 2007-06-28
JP4513170B2 true JP4513170B2 (ja) 2010-07-28

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Family Applications (1)

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JP2000146224A Expired - Fee Related JP4513170B2 (ja) 2000-05-18 2000-05-18 感光性重合体組成物

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JP (1) JP4513170B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006059392A1 (ja) 2004-12-03 2006-06-08 Tokyo Ohka Kogyo Co., Ltd. 化学増幅型ホトレジスト組成物、ホトレジスト層積層体、ホトレジスト組成物製造方法、ホトレジストパターンの製造方法及び接続端子の製造方法
JP4925732B2 (ja) * 2005-06-07 2012-05-09 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
JP5061435B2 (ja) * 2005-08-01 2012-10-31 東レ株式会社 耐熱樹脂前駆体組成物およびそれを用いた半導体装置
JP2007078812A (ja) * 2005-09-12 2007-03-29 Sumitomo Bakelite Co Ltd 感光性樹脂組成物、それを用いた半導体装置、表示素子
WO2008123233A1 (ja) * 2007-03-30 2008-10-16 Zeon Corporation 感放射線樹脂組成物、アクティブマトリックス基板及びその製造方法
JP5747437B2 (ja) * 2009-04-14 2015-07-15 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物及びこれを用いた回路形成用基板
JP2011084637A (ja) * 2009-10-15 2011-04-28 Asahi Kasei E-Materials Corp ポリイミド樹脂組成物、及びポリイミド金属積層板
JP6048257B2 (ja) * 2013-03-25 2016-12-21 東レ株式会社 耐熱性樹脂及びその前駆体組成物
JP6390165B2 (ja) * 2014-05-21 2018-09-19 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
JP7035632B2 (ja) * 2018-03-05 2022-03-15 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
TWI797986B (zh) 2019-07-29 2023-04-01 日商旭化成股份有限公司 負型感光性樹脂組合物、聚醯亞胺之製造方法、硬化浮凸圖案之製造方法、及半導體裝置
JP2023023196A (ja) * 2021-08-04 2023-02-16 旭化成株式会社 感光性樹脂組成物、ポリイミドの製造方法、硬化レリーフパターンの製造方法、及び半導体装置
JPWO2024048296A1 (enExample) * 2022-08-29 2024-03-07

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2844219B2 (ja) * 1988-08-24 1999-01-06 旭化成工業株式会社 低応力ポリイミド前駆体、及びポリイミド複合成形体の製造方法
JPH06118645A (ja) * 1992-10-02 1994-04-28 Japan Synthetic Rubber Co Ltd 感光性樹脂組成物
DE59403359D1 (de) * 1993-05-14 1997-08-21 Ocg Microelectronic Materials Verfahren zur Herstellung von Reliefstrukturen durch i-Linien-Bestrahlung
US5856065A (en) * 1996-03-27 1999-01-05 Olin Microelectronic Chemicals, Inc. Negative working photoresist composition based on polyimide primers
JPH11160880A (ja) * 1997-11-28 1999-06-18 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性フィルム

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JP2001330962A (ja) 2001-11-30

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