JP4481759B2 - 薄膜トランジスタ表示板及びその製造方法 - Google Patents
薄膜トランジスタ表示板及びその製造方法 Download PDFInfo
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- JP4481759B2 JP4481759B2 JP2004222423A JP2004222423A JP4481759B2 JP 4481759 B2 JP4481759 B2 JP 4481759B2 JP 2004222423 A JP2004222423 A JP 2004222423A JP 2004222423 A JP2004222423 A JP 2004222423A JP 4481759 B2 JP4481759 B2 JP 4481759B2
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- 239000010409 thin film Substances 0.000 title claims description 86
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000010408 film Substances 0.000 claims description 152
- 230000001681 protective effect Effects 0.000 claims description 48
- 239000004065 semiconductor Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 32
- 239000010410 layer Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000013459 approach Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims 2
- 239000004973 liquid crystal related substance Substances 0.000 description 27
- 239000003990 capacitor Substances 0.000 description 23
- 238000003860 storage Methods 0.000 description 22
- 239000004020 conductor Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229910021417 amorphous silicon Inorganic materials 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000011651 chromium Substances 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910001182 Mo alloy Inorganic materials 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
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- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 150000002751 molybdenum Chemical class 0.000 description 2
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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Description
・複数の信号線、
・前記信号線と連結されている薄膜トランジスタ、
・前記信号線及び薄膜トランジスタの上に形成されている保護膜、
・前記保護膜上に形成され、前記薄膜トランジスタに連結されている画素電極。
・基板上にゲート電極を有するゲート線を形成する段階、
・前記基板上にゲート絶縁膜を積層する段階、
・前記ゲート絶縁膜の上部に半導体層を形成する段階、
・前記半導体層と接するソース電極を有するデータ線及びドレーン電極を形成する段階、
・前記半導体層を覆い、外部との連結のための前記ゲート線または前記データ線の接触部を露出する接触孔を有し、所定の膜厚を有する第1部分、前記第1部分より膜厚の厚い第2部分、前記第1部分と前記第2部分との間に位置し、45度以下の傾斜角を有するテーパ構造に形成される第3部分を含む保護膜を形成する段階、
・前記ドレーン電極と連結される画素電極を形成する段階。
121 ゲート線
124 ゲート電極
127 拡張部
140 ゲート絶縁膜
151 半導体
161、165 抵抗性接触部材
163 突出部
171 データ線
175 ドレーン電極
173 ソース電極
177 維持蓄電器用導電体
180 保護膜
182、185、187、181 接触孔
190 画素電極
400 連結部
500 マスク
Claims (21)
- 複数の信号線、
前記信号線と連結されている薄膜トランジスタ、
前記信号線及び薄膜トランジスタの上に形成されている保護膜、
前記保護膜上に形成され、前記薄膜トランジスタに連結されている画素電極を含み、
前記各信号線は外部と連結するための接触部を有し、
前記保護膜は、前記接触部上において所定の膜厚を有する第1部分と、前記第1部分より膜厚の厚い第2部分と、前記第1部分と前記第2部分との間に位置し、45度以下の傾斜角を有するテーパ構造に形成されている第3部分と、を含む薄膜トランジスタ表示板。 - 前記傾斜角は5−10度の範囲である、請求項1に記載の薄膜トランジスタ表示板。
- 前記保護膜の薄くなる部分の幅は10−40μmの範囲である、請求項1に記載の薄膜トランジスタ表示板。
- 前記画素電極の周縁は、前記保護膜を隔てて前記信号線と重なっている、請求項1に記載の薄膜トランジスタ表示板。
- 前記保護膜は有機絶縁物質からなる、請求項1に記載の薄膜トランジスタ表示板。
- 前記保護膜は前記接触部を露出する接触孔を有する、請求項1に記載の薄膜トランジスタ表示板。
- 前記画素電極と同一層に形成され、前記接触孔を通じて前記接触部と連結されている接触部材をさらに含む、請求項6に記載の薄膜トランジスタ表示板。
- 前記接触孔は、前記接触部の境界を露出する、請求項6に記載の薄膜トランジスタ表示板。
- 前記信号線は互いに交差するゲート線とデータ線を含む、請求項1に記載の薄膜トランジスタ表示板。
- 前記薄膜トランジスタは、前記ゲート線の一部であるゲート電極と、前記データ線の一部であるソース電極と、前記画素電極と連結されたドレーン電極と、前記ソース電極及び前記ドレーン電極と前記ゲート電極との間に配置されている半導体とを含む、請求項9に記載の薄膜トランジスタ表示板。
- 前記半導体は、前記データ線に沿って延長されている、請求項10に記載の薄膜トランジスタ表示板。
- 前記ソース電極と前記ドレーン電極の間を除く前記半導体は、前記データ線と前記ドレーン電極と同じ平面パターンを有する、請求項11に記載の薄膜トランジスタ表示板。
- 前記画素電極はIZOまたはITOからなる、請求項1に記載の薄膜トランジスタ表示板。
- 基板上にゲート電極を有するゲート線を形成する段階、
前記基板上にゲート絶縁膜を積層する段階、
前記ゲート絶縁膜の上部に半導体層を形成する段階、
前記半導体層と接するソース電極を有するデータ線及びドレーン電極を形成する段階、
前記半導体層を覆い、外部との連結のための前記ゲート線または前記データ線の接触部を露出する接触孔を有し、所定の膜厚を有する第1部分、前記第1部分より膜厚の厚い第2部分、前記第1部分と前記第2部分との間に位置し、45度以下の傾斜角を有するテーパ構造に形成される第3部分を含む保護膜を形成する段階、
前記ドレーン電極と連結される画素電極を形成する段階、
を含む、薄膜トランジスタ表示板の製造方法。 - 前記第3部分の傾斜角を5−10度の範囲に形成する、請求項14に記載の薄膜トランジスタ表示板の製造方法。
- 前記保護膜の形成段階は、マスクを用いた写真エッチング工程によって形成され、
前記マスクは、前記第1部分のうち接触孔以外の部分及び第3部分に対応して光の一部のみ透過させる第1領域、前記接触孔に対応して光のほとんどを透過させる第2領域、前記第2部分に対応して光のほとんどを遮断する第3領域、を含む、請求項14に記載の薄膜トランジスタ表示板の製造方法。 - 前記マスクの前記第1領域には、スリットまたは格子パターンが形成されている、請求項16に記載の薄膜トランジスタ表示板の製造方法。
- 前記第3領域に近づくほど前記第1領域のスリットまたは格子パターンの幅もしくは間隔が変化する、請求項16に記載の薄膜トランジスタ表示板の製造方法。
- 前記第1部分に対応する前記第1領域のスリットの幅は一定であり、前記第3領域に近づくほど、前記スリットの間隔が次第に狭くなる、請求項18に記載の薄膜トランジスタ表示板の製造方法。
- 前記保護膜は、有機絶縁物質で形成される、請求項14に記載の薄膜トランジスタ表示板の製造方法。
- 前記画素電極は、IZOまたはITOで形成される、請求項14に記載の薄膜トランジスタ表示板の製造方法。
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