JP4376388B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4376388B2
JP4376388B2 JP35275799A JP35275799A JP4376388B2 JP 4376388 B2 JP4376388 B2 JP 4376388B2 JP 35275799 A JP35275799 A JP 35275799A JP 35275799 A JP35275799 A JP 35275799A JP 4376388 B2 JP4376388 B2 JP 4376388B2
Authority
JP
Japan
Prior art keywords
layer
semiconductor
insulating layer
semiconductor device
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP35275799A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001168231A (ja
JP2001168231A5 (enExample
Inventor
隆一 佐原
憲幸 戒能
望 下石坂
嘉文 中村
隆博 隈川
和美 渡瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP35275799A priority Critical patent/JP4376388B2/ja
Publication of JP2001168231A publication Critical patent/JP2001168231A/ja
Publication of JP2001168231A5 publication Critical patent/JP2001168231A5/ja
Application granted granted Critical
Publication of JP4376388B2 publication Critical patent/JP4376388B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector

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  • Wire Bonding (AREA)
JP35275799A 1999-12-13 1999-12-13 半導体装置 Expired - Lifetime JP4376388B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35275799A JP4376388B2 (ja) 1999-12-13 1999-12-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35275799A JP4376388B2 (ja) 1999-12-13 1999-12-13 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008270224A Division JP2009016882A (ja) 2008-10-20 2008-10-20 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2001168231A JP2001168231A (ja) 2001-06-22
JP2001168231A5 JP2001168231A5 (enExample) 2007-01-18
JP4376388B2 true JP4376388B2 (ja) 2009-12-02

Family

ID=18426242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35275799A Expired - Lifetime JP4376388B2 (ja) 1999-12-13 1999-12-13 半導体装置

Country Status (1)

Country Link
JP (1) JP4376388B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4754105B2 (ja) * 2001-07-04 2011-08-24 パナソニック株式会社 半導体装置およびその製造方法
DE10137184B4 (de) * 2001-07-31 2007-09-06 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauteils mit einem Kuststoffgehäuse und elektronisches Bauteil
JP2003068736A (ja) * 2001-08-24 2003-03-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
CN100461391C (zh) * 2002-02-04 2009-02-11 卡西欧计算机株式会社 半导体装置
TW577160B (en) 2002-02-04 2004-02-21 Casio Computer Co Ltd Semiconductor device and manufacturing method thereof
EP1527480A2 (en) 2002-08-09 2005-05-04 Casio Computer Co., Ltd. Semiconductor device and method of manufacturing the same
US7187060B2 (en) 2003-03-13 2007-03-06 Sanyo Electric Co., Ltd. Semiconductor device with shield
JP4346333B2 (ja) * 2003-03-26 2009-10-21 新光電気工業株式会社 半導体素子を内蔵した多層回路基板の製造方法
JP3929966B2 (ja) 2003-11-25 2007-06-13 新光電気工業株式会社 半導体装置及びその製造方法
JP2006032598A (ja) * 2004-07-15 2006-02-02 Renesas Technology Corp 半導体装置の製造方法および半導体装置
WO2006008795A1 (ja) * 2004-07-16 2006-01-26 Shinko Electric Industries Co., Ltd. 半導体装置の製造方法
JP4607531B2 (ja) * 2004-09-29 2011-01-05 カシオマイクロニクス株式会社 半導体装置の製造方法
KR100700395B1 (ko) * 2005-04-25 2007-03-28 신꼬오덴기 고교 가부시키가이샤 반도체 장치의 제조 방법
JP2006339189A (ja) * 2005-05-31 2006-12-14 Oki Electric Ind Co Ltd 半導体ウェハおよびそれにより形成した半導体装置
CN101847611B (zh) 2005-06-29 2012-05-23 罗姆股份有限公司 半导体装置
JP2007012756A (ja) * 2005-06-29 2007-01-18 Rohm Co Ltd 半導体装置
JP5266009B2 (ja) * 2008-10-14 2013-08-21 株式会社フジクラ 部品内蔵形回路配線基板
JP5175803B2 (ja) 2009-07-01 2013-04-03 新光電気工業株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2001168231A (ja) 2001-06-22

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