CN100461391C - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN100461391C CN100461391C CNB2007100876843A CN200710087684A CN100461391C CN 100461391 C CN100461391 C CN 100461391C CN B2007100876843 A CNB2007100876843 A CN B2007100876843A CN 200710087684 A CN200710087684 A CN 200710087684A CN 100461391 C CN100461391 C CN 100461391C
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- Prior art keywords
- semiconductor device
- semiconductor chip
- dielectric film
- rewiring
- electrode
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- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
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- Engineering & Computer Science (AREA)
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP026808/2002 | 2002-02-04 | ||
JP2002026808 | 2002-02-04 | ||
JP117307/2002 | 2002-04-19 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038001284A Division CN100358118C (zh) | 2002-02-04 | 2003-02-03 | 半导体装置及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN101013684A CN101013684A (zh) | 2007-08-08 |
CN100461391C true CN100461391C (zh) | 2009-02-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2007100876843A Expired - Lifetime CN100461391C (zh) | 2002-02-04 | 2003-02-03 | 半导体装置 |
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Country | Link |
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CN (1) | CN100461391C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101718011B1 (ko) * | 2010-11-01 | 2017-03-21 | 삼성전자주식회사 | 반도체 패키지 및 그 제조방법 |
JP2016058655A (ja) * | 2014-09-11 | 2016-04-21 | 株式会社ジェイデバイス | 半導体装置の製造方法 |
FR3070090B1 (fr) * | 2017-08-08 | 2020-02-07 | 3Dis Technologies | Systeme electronique et procede de fabrication d'un systeme electronique par utilisation d'un element sacrificiel |
KR101933425B1 (ko) * | 2017-11-30 | 2018-12-28 | 삼성전기 주식회사 | 반도체 패키지 |
KR102588125B1 (ko) * | 2018-02-02 | 2023-10-11 | 삼성전자주식회사 | 반도체 장치 |
KR102570270B1 (ko) * | 2018-10-30 | 2023-08-24 | 삼성전자주식회사 | 반도체 패키지 |
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EP1137066A2 (en) * | 2000-03-24 | 2001-09-26 | Shinko Electric Industries Co. Ltd. | Semiconductor device and process of production of same |
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US5841193A (en) * | 1996-05-20 | 1998-11-24 | Epic Technologies, Inc. | Single chip modules, repairable multichip modules, and methods of fabrication thereof |
JP2000124354A (ja) * | 1998-10-21 | 2000-04-28 | Matsushita Electric Ind Co Ltd | チップサイズパッケージ及びその製造方法 |
JP2001168231A (ja) * | 1999-12-13 | 2001-06-22 | Matsushita Electronics Industry Corp | 半導体装置およびその製造方法 |
JP2001217381A (ja) * | 2000-01-28 | 2001-08-10 | Fujitsu Ltd | 半導体装置及び半導体装置の製造方法 |
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