JP4319188B2 - 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 - Google Patents
基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 Download PDFInfo
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- JP4319188B2 JP4319188B2 JP2005514600A JP2005514600A JP4319188B2 JP 4319188 B2 JP4319188 B2 JP 4319188B2 JP 2005514600 A JP2005514600 A JP 2005514600A JP 2005514600 A JP2005514600 A JP 2005514600A JP 4319188 B2 JP4319188 B2 JP 4319188B2
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- Prior art keywords
- substrate
- liquid
- exposure
- immersion exposure
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
- G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003349550 | 2003-10-08 | ||
| JP2003349550 | 2003-10-08 | ||
| PCT/JP2004/014855 WO2005036621A1 (ja) | 2003-10-08 | 2004-10-07 | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009013518A Division JP5079717B2 (ja) | 2003-10-08 | 2009-01-23 | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2005036621A1 JPWO2005036621A1 (ja) | 2007-11-22 |
| JP4319188B2 true JP4319188B2 (ja) | 2009-08-26 |
Family
ID=34431007
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005514600A Expired - Fee Related JP4319188B2 (ja) | 2003-10-08 | 2004-10-07 | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 |
| JP2009013518A Expired - Fee Related JP5079717B2 (ja) | 2003-10-08 | 2009-01-23 | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 |
| JP2011126741A Expired - Fee Related JP5634947B2 (ja) | 2003-10-08 | 2011-06-06 | 基板搬送装置、露光装置、基板搬送方法、及び処理方法 |
| JP2012079587A Pending JP2012138623A (ja) | 2003-10-08 | 2012-03-30 | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009013518A Expired - Fee Related JP5079717B2 (ja) | 2003-10-08 | 2009-01-23 | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 |
| JP2011126741A Expired - Fee Related JP5634947B2 (ja) | 2003-10-08 | 2011-06-06 | 基板搬送装置、露光装置、基板搬送方法、及び処理方法 |
| JP2012079587A Pending JP2012138623A (ja) | 2003-10-08 | 2012-03-30 | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US8345216B2 (enExample) |
| EP (1) | EP1672681B8 (enExample) |
| JP (4) | JP4319188B2 (enExample) |
| KR (4) | KR101203028B1 (enExample) |
| AT (1) | ATE509367T1 (enExample) |
| TW (2) | TWI620990B (enExample) |
| WO (1) | WO2005036621A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211221A (ja) * | 2003-10-08 | 2011-10-20 | Miyagi Nikon Precision Co Ltd | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 |
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| US7616383B2 (en) * | 2004-05-18 | 2009-11-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7463330B2 (en) | 2004-07-07 | 2008-12-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| TWI436403B (zh) | 2004-10-26 | 2014-05-01 | 尼康股份有限公司 | A cleaning method, a substrate processing method, an exposure apparatus, and an element manufacturing method |
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| JP2007109741A (ja) * | 2005-10-11 | 2007-04-26 | Canon Inc | 露光装置及び露光方法 |
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| JP2007264114A (ja) * | 2006-03-27 | 2007-10-11 | Nikon Corp | 液浸顕微鏡装置 |
| TW200818256A (en) * | 2006-05-22 | 2008-04-16 | Nikon Corp | Exposure method and apparatus, maintenance method, and device manufacturing method |
| JP2008066341A (ja) | 2006-09-04 | 2008-03-21 | Canon Inc | 搬送装置、露光装置及び方法 |
| US9632425B2 (en) | 2006-12-07 | 2017-04-25 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
| JP4758977B2 (ja) * | 2006-12-07 | 2011-08-31 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ投影装置、デバイス製造方法 |
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| NL2005528A (en) * | 2009-12-02 | 2011-06-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| JP2015082570A (ja) * | 2013-10-22 | 2015-04-27 | 株式会社ディスコ | ウエーハ加工システム |
| CN110520800B (zh) | 2017-04-20 | 2021-10-15 | Asml荷兰有限公司 | 对流体处理结构进行性能测试的方法 |
| TWI831656B (zh) | 2018-01-04 | 2024-02-01 | 日商東京威力科創股份有限公司 | 基板處理裝置及基板處理方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2011211221A (ja) * | 2003-10-08 | 2011-10-20 | Miyagi Nikon Precision Co Ltd | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法 |
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