JP4182002B2 - 金属および合金にセラミック被膜を形成するプロセスと装置、およびこのプロセスによって生成される被膜 - Google Patents

金属および合金にセラミック被膜を形成するプロセスと装置、およびこのプロセスによって生成される被膜 Download PDF

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Publication number
JP4182002B2
JP4182002B2 JP2003580609A JP2003580609A JP4182002B2 JP 4182002 B2 JP4182002 B2 JP 4182002B2 JP 2003580609 A JP2003580609 A JP 2003580609A JP 2003580609 A JP2003580609 A JP 2003580609A JP 4182002 B2 JP4182002 B2 JP 4182002B2
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current
pulse
coating
electrolyte
ceramic coating
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JP2003580609A
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Japanese (ja)
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JP2005521794A5 (de
JP2005521794A (ja
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シャトロフ，アレクサンデル・セルゲーヴィッチ
サムソノフ，ヴィクトル・ヨシフォヴィッチ
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アイル・コート・リミテッド
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/024—Anodisation under pulsed or modulated current or potential
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/026—Anodisation with spark discharge
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2003580609A 2002-03-27 2002-09-23 金属および合金にセラミック被膜を形成するプロセスと装置、およびこのプロセスによって生成される被膜 Expired - Lifetime JP4182002B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0207193A GB2386907B (en) 2002-03-27 2002-03-27 Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
US10/123,010 US6896785B2 (en) 2002-03-27 2002-04-15 Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
PCT/GB2002/004305 WO2003083181A2 (en) 2002-03-27 2002-09-23 Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2007243844A Division JP4722102B2 (ja) 2002-03-27 2007-09-20 金属および合金にセラミック被膜を形成するプロセスと装置
JP2008062544A Division JP2008179901A (ja) 2002-03-27 2008-03-12 金属および合金にセラミック被膜を形成するプロセスと装置、およびこのプロセスによって生成される被膜

Publications (3)

Publication Number Publication Date
JP2005521794A JP2005521794A (ja) 2005-07-21
JP2005521794A5 JP2005521794A5 (de) 2006-01-05
JP4182002B2 true JP4182002B2 (ja) 2008-11-19

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003580609A Expired - Lifetime JP4182002B2 (ja) 2002-03-27 2002-09-23 金属および合金にセラミック被膜を形成するプロセスと装置、およびこのプロセスによって生成される被膜
JP2007243844A Expired - Lifetime JP4722102B2 (ja) 2002-03-27 2007-09-20 金属および合金にセラミック被膜を形成するプロセスと装置

Family Applications After (1)

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JP2007243844A Expired - Lifetime JP4722102B2 (ja) 2002-03-27 2007-09-20 金属および合金にセラミック被膜を形成するプロセスと装置

Country Status (6)

Country Link
EP (1) EP1488024B1 (de)
JP (2) JP4182002B2 (de)
CN (1) CN100503899C (de)
AU (1) AU2002329410A1 (de)
NO (1) NO20034936L (de)
WO (1) WO2003083181A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008038256A (ja) * 2002-03-27 2008-02-21 Isle Coat Ltd 金属および合金にセラミック被膜を形成するプロセスと装置、およびこのプロセスによって生成される被膜

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WO2014175653A1 (ko) * 2013-04-23 2014-10-30 인제대학교 산학협력단 전기 화학 증착에 의한 나노 구조체의 제조 방법 및 이에 의하여 제조된 나노 구조체
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CN104562130B (zh) * 2014-08-22 2017-06-16 东莞市武华新材料有限公司 轻金属或其合金表面氧化钛基陶瓷膜层的制造方法
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Publication number Priority date Publication date Assignee Title
JP2008038256A (ja) * 2002-03-27 2008-02-21 Isle Coat Ltd 金属および合金にセラミック被膜を形成するプロセスと装置、およびこのプロセスによって生成される被膜

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Publication number Publication date
JP2005521794A (ja) 2005-07-21
JP4722102B2 (ja) 2011-07-13
EP1488024A2 (de) 2004-12-22
CN1623013A (zh) 2005-06-01
NO20034936L (no) 2004-01-09
WO2003083181A3 (en) 2004-09-10
AU2002329410A1 (en) 2003-10-13
JP2008038256A (ja) 2008-02-21
HK1059804A1 (en) 2004-07-16
WO2003083181A2 (en) 2003-10-09
EP1488024B1 (de) 2017-05-03
AU2002329410A8 (en) 2003-10-13
NO20034936D0 (no) 2003-11-06
CN100503899C (zh) 2009-06-24

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