JP4151164B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4151164B2
JP4151164B2 JP19634599A JP19634599A JP4151164B2 JP 4151164 B2 JP4151164 B2 JP 4151164B2 JP 19634599 A JP19634599 A JP 19634599A JP 19634599 A JP19634599 A JP 19634599A JP 4151164 B2 JP4151164 B2 JP 4151164B2
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JP
Japan
Prior art keywords
protective sheet
jig
semiconductor wafer
manufacturing
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19634599A
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English (en)
Japanese (ja)
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JP2000340526A5 (enExample
JP2000340526A (ja
Inventor
哲夫 藤井
毅 深田
建一 青
晋二 吉原
純朋 猪俣
浩司 武藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP19634599A priority Critical patent/JP4151164B2/ja
Priority to US09/525,514 priority patent/US6429506B1/en
Priority to DE10013067A priority patent/DE10013067B4/de
Publication of JP2000340526A publication Critical patent/JP2000340526A/ja
Priority to US10/091,497 priority patent/US6787866B2/en
Priority to US10/896,042 priority patent/US7091109B2/en
Priority to US11/075,881 priority patent/US7298022B2/en
Publication of JP2000340526A5 publication Critical patent/JP2000340526A5/ja
Application granted granted Critical
Publication of JP4151164B2 publication Critical patent/JP4151164B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10P72/7402—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00888—Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
    • B81C2201/053—Depositing a protective layers
    • H10P72/7416—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/884—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dicing (AREA)
  • Micromachines (AREA)
JP19634599A 1999-03-19 1999-07-09 半導体装置の製造方法 Expired - Fee Related JP4151164B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP19634599A JP4151164B2 (ja) 1999-03-19 1999-07-09 半導体装置の製造方法
US09/525,514 US6429506B1 (en) 1999-03-19 2000-03-15 Semiconductor device produced by dicing
DE10013067A DE10013067B4 (de) 1999-03-19 2000-03-17 Verfahren zum Herstellen von einer Halbleitervorrichtung durch Chipvereinzelung und Wafer-Lösevorrichtung
US10/091,497 US6787866B2 (en) 1999-03-19 2002-03-07 Semiconductor device having a moveable member therein and a protective member disposed thereon
US10/896,042 US7091109B2 (en) 1999-03-19 2004-07-22 Semiconductor device and method for producing the same by dicing
US11/075,881 US7298022B2 (en) 1999-03-19 2005-03-10 Semiconductor sensor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7656699 1999-03-19
JP11-76566 1999-03-19
JP19634599A JP4151164B2 (ja) 1999-03-19 1999-07-09 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008054386A Division JP4636096B2 (ja) 1999-03-19 2008-03-05 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2000340526A JP2000340526A (ja) 2000-12-08
JP2000340526A5 JP2000340526A5 (enExample) 2005-10-27
JP4151164B2 true JP4151164B2 (ja) 2008-09-17

Family

ID=26417706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19634599A Expired - Fee Related JP4151164B2 (ja) 1999-03-19 1999-07-09 半導体装置の製造方法

Country Status (3)

Country Link
US (4) US6429506B1 (enExample)
JP (1) JP4151164B2 (enExample)
DE (1) DE10013067B4 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020167276A (ja) * 2019-03-29 2020-10-08 三井化学東セロ株式会社 電子装置の製造方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020167276A (ja) * 2019-03-29 2020-10-08 三井化学東セロ株式会社 電子装置の製造方法
JP7408291B2 (ja) 2019-03-29 2024-01-05 三井化学東セロ株式会社 電子装置の製造方法

Also Published As

Publication number Publication date
US20050156309A1 (en) 2005-07-21
US6787866B2 (en) 2004-09-07
US20040259330A1 (en) 2004-12-23
US7091109B2 (en) 2006-08-15
US7298022B2 (en) 2007-11-20
DE10013067A1 (de) 2000-09-21
DE10013067B4 (de) 2008-10-16
US6429506B1 (en) 2002-08-06
US20020093076A1 (en) 2002-07-18
JP2000340526A (ja) 2000-12-08

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