DE10013067B4 - Verfahren zum Herstellen von einer Halbleitervorrichtung durch Chipvereinzelung und Wafer-Lösevorrichtung - Google Patents

Verfahren zum Herstellen von einer Halbleitervorrichtung durch Chipvereinzelung und Wafer-Lösevorrichtung Download PDF

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Publication number
DE10013067B4
DE10013067B4 DE10013067A DE10013067A DE10013067B4 DE 10013067 B4 DE10013067 B4 DE 10013067B4 DE 10013067 A DE10013067 A DE 10013067A DE 10013067 A DE10013067 A DE 10013067A DE 10013067 B4 DE10013067 B4 DE 10013067B4
Authority
DE
Germany
Prior art keywords
protective layer
mounting device
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10013067A
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German (de)
English (en)
Other versions
DE10013067A1 (de
Inventor
Tetsuo Kariya Fujii
Tsuyoshi Kariya Fukada
Hiroshi Kariya Muto
Kenichi Kariya Ao
Shinji Kariya Yoshihara
Sumitomo Kariya Inomata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE10013067A1 publication Critical patent/DE10013067A1/de
Application granted granted Critical
Publication of DE10013067B4 publication Critical patent/DE10013067B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P72/7402—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00888—Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
    • B81C2201/053—Depositing a protective layers
    • H10P72/7416—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/884—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dicing (AREA)
  • Micromachines (AREA)
DE10013067A 1999-03-19 2000-03-17 Verfahren zum Herstellen von einer Halbleitervorrichtung durch Chipvereinzelung und Wafer-Lösevorrichtung Expired - Fee Related DE10013067B4 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7656699 1999-03-19
JP11-76566 1999-03-19
JP11-196345 1999-07-09
JP19634599A JP4151164B2 (ja) 1999-03-19 1999-07-09 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE10013067A1 DE10013067A1 (de) 2000-09-21
DE10013067B4 true DE10013067B4 (de) 2008-10-16

Family

ID=26417706

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10013067A Expired - Fee Related DE10013067B4 (de) 1999-03-19 2000-03-17 Verfahren zum Herstellen von einer Halbleitervorrichtung durch Chipvereinzelung und Wafer-Lösevorrichtung

Country Status (3)

Country Link
US (4) US6429506B1 (enExample)
JP (1) JP4151164B2 (enExample)
DE (1) DE10013067B4 (enExample)

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JP7408291B2 (ja) * 2019-03-29 2024-01-05 三井化学東セロ株式会社 電子装置の製造方法
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Also Published As

Publication number Publication date
US20050156309A1 (en) 2005-07-21
US6787866B2 (en) 2004-09-07
US20040259330A1 (en) 2004-12-23
US7091109B2 (en) 2006-08-15
US7298022B2 (en) 2007-11-20
DE10013067A1 (de) 2000-09-21
US6429506B1 (en) 2002-08-06
US20020093076A1 (en) 2002-07-18
JP2000340526A (ja) 2000-12-08
JP4151164B2 (ja) 2008-09-17

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