JP4552783B2 - 半導体センサ - Google Patents
半導体センサ Download PDFInfo
- Publication number
- JP4552783B2 JP4552783B2 JP2005197412A JP2005197412A JP4552783B2 JP 4552783 B2 JP4552783 B2 JP 4552783B2 JP 2005197412 A JP2005197412 A JP 2005197412A JP 2005197412 A JP2005197412 A JP 2005197412A JP 4552783 B2 JP4552783 B2 JP 4552783B2
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- Japan
- Prior art keywords
- resin film
- pads
- semiconductor substrate
- bonding
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
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- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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Description
また、上記図6に示される金属箔120を用いた樹脂フィルム100では、導電性部材として導電性粒子102が用いられていたが、この導電性粒子102に代えて、上記図5に示したような金属板104を用いてもよい。
30a…左側固定電極用パッド、31…センシング部としての左側固定電極、
40a…右側固定電極用パッド、41…センシング部としての右側固定電極、
100…樹脂フィルム、102…導電性部材としての導電性粒子、
104…導電性部材としての金属板、120…金属箔、200…ボンディングワイヤ。
Claims (3)
- 半導体基板(10)と、
前記半導体基板(10)の一面側に設けられたセンシング部(20、31、41)と、
前記半導体基板(10)の前記一面にて前記センシング部(20、31、41)の周囲に設けられたパッド(25a、30a、40a)と、
前記パッド(25a、30a、40a)に電気的に接続され前記センシング部(20、31、41)からの信号を取り出すためのボンディングワイヤ(200)と、
前記半導体基板(10)の一面上に配置され、前記センシング部(20、31、41)とは離間した状態で前記センシング部(20、31、41)を被覆する被覆部、および前記センシング部(20、31、41)の周囲部にて前記半導体基板(10)の前記一面に貼り付けられた貼り付け部を有する樹脂よりなる樹脂フィルム(100)とを有し、
前記樹脂フィルム(100)の前記貼り付け部は、前記半導体基板(10)の前記一面のうち前記パッド(25a、30a、40a)が設けられた領域を含み、更に前記貼り付け部に設けられ、前記パッド(25a、30a、40a)と前記ボンディングワイヤ(200)とを電気的に接続する接続手段を有し、
前記接続手段は、前記樹脂フィルム(100)内における少なくとも前記パッド(25a、30a、40a)と前記ボンディングワイヤ(200)とが電気的に接続される部分に設けられた、導電性部材(104)を含み、
前記パッド(25a、30a、40a)と前記ボンディングワイヤ(200)は、前記導電性部材(104)を介して電気的に導通しており、
前記導電性部材は、前記樹脂フィルム(100)中に埋め込まれた金属板(104)であることを特徴とする半導体センサ。 - 前記接続手段は、前記樹脂フィルム(100)に対して前記ボンディングワイヤ(200)が押しつけられることによって、前記ボンディングワイヤ(200)と前記導電性部材(104)、および、前記パッド(25a、30a、40a)と前記導電性部材(104)とが接触するように、前記樹脂フィルム(100)に形成された開口部を含むことを特徴とする請求項1に記載の半導体センサ。
- 前記樹脂フィルム(100)は、前記センシング部(20、31、41)を被覆する部位では、前記センシング部(20、31、41)から離れる方向に凸となったドーム形状をなしていることを特徴とする請求項1または2に記載の半導体センサ。
Priority Applications (4)
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JP2005197412A JP4552783B2 (ja) | 2005-07-06 | 2005-07-06 | 半導体センサ |
US11/455,919 US7373821B2 (en) | 2005-07-06 | 2006-06-20 | Semiconductor sensor and manufacturing method therefor |
DE102006031047A DE102006031047A1 (de) | 2005-07-06 | 2006-07-05 | Halbleitersensor und Herstellungsverfahren dafür |
US12/081,512 US7770452B2 (en) | 2005-07-06 | 2008-04-17 | Semiconductor sensor and manufacturing method therefor |
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JP2005197412A JP4552783B2 (ja) | 2005-07-06 | 2005-07-06 | 半導体センサ |
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JP4552783B2 true JP4552783B2 (ja) | 2010-09-29 |
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JP (1) | JP4552783B2 (ja) |
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Cited By (2)
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JP2018100950A (ja) * | 2016-12-20 | 2018-06-28 | 株式会社デンソー | 半導体装置およびその製造方法 |
WO2018116785A1 (ja) * | 2016-12-20 | 2018-06-28 | 株式会社デンソー | 半導体装置およびその製造方法 |
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DE102008040775A1 (de) | 2008-07-28 | 2010-02-04 | Robert Bosch Gmbh | Verkapselung, MEMS sowie Verfahren zum selektiven Verkapseln |
DE102008042106A1 (de) * | 2008-09-15 | 2010-03-18 | Robert Bosch Gmbh | Verkapselung, MEMS sowie Verfahren zum Verkapseln |
US20110205716A1 (en) * | 2008-11-19 | 2011-08-25 | Hiroyuki Moriwaki | Circuit substrate, display panel and display device |
DE102009029184A1 (de) * | 2009-09-03 | 2011-03-10 | Robert Bosch Gmbh | Herstellungsverfahren für ein verkapptes mikromechanisches Bauelement, entsprechendes mikromechanisches Bauelement und Kappe für ein mikromechanisches Bauelement |
JP5790297B2 (ja) * | 2011-08-17 | 2015-10-07 | セイコーエプソン株式会社 | 物理量センサー及び電子機器 |
CN102879608B (zh) * | 2012-10-26 | 2014-12-24 | 中国科学院上海微系统与信息技术研究所 | 弯折形弹性梁的电容式加速度传感器及制备方法 |
JP2014134481A (ja) * | 2013-01-11 | 2014-07-24 | Seiko Epson Corp | 物理量センサー、電子機器、及び移動体 |
WO2015068585A1 (ja) * | 2013-11-07 | 2015-05-14 | ダイセル・エボニック株式会社 | 封止部材、この封止部材で封止された封止基板及びその製造方法 |
DE102014112812B4 (de) * | 2014-09-05 | 2017-12-14 | Snaptrack, Inc. | Verfahren zur Herstellung einer Abdeckung für ein Bauelement und Bauelement mit mehreren Abdeckungen |
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- 2006-06-20 US US11/455,919 patent/US7373821B2/en not_active Expired - Fee Related
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JP2018100950A (ja) * | 2016-12-20 | 2018-06-28 | 株式会社デンソー | 半導体装置およびその製造方法 |
WO2018116785A1 (ja) * | 2016-12-20 | 2018-06-28 | 株式会社デンソー | 半導体装置およびその製造方法 |
CN110088587A (zh) * | 2016-12-20 | 2019-08-02 | 株式会社电装 | 半导体装置及其制造方法 |
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US7770452B2 (en) | 2010-08-10 |
US7373821B2 (en) | 2008-05-20 |
DE102006031047A1 (de) | 2007-01-18 |
US20080196501A1 (en) | 2008-08-21 |
US20070007607A1 (en) | 2007-01-11 |
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