JP4109543B2 - 積層体 - Google Patents
積層体 Download PDFInfo
- Publication number
- JP4109543B2 JP4109543B2 JP2002537531A JP2002537531A JP4109543B2 JP 4109543 B2 JP4109543 B2 JP 4109543B2 JP 2002537531 A JP2002537531 A JP 2002537531A JP 2002537531 A JP2002537531 A JP 2002537531A JP 4109543 B2 JP4109543 B2 JP 4109543B2
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- JP
- Japan
- Prior art keywords
- film
- adhesive
- laminate
- synthetic resin
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Description
(A−B)×100/B・・・・(1)
式(1)中、A、Bは、以下のものを表す。
A:ゲルフィルムの重量
B:ゲルフィルムを450℃で20分間加熱した後の重量
(C/D)×100/(E/F)・・・・(2)
式(2)、C、D、E、Fは以下のものを表す。
C:ゲルフィルムの1370cm-1の吸収ピーク高さ
D:ゲルフィルムの1500cm-1の吸収ピーク高さ
E:ポリイミドフィルムの1370cm-1の吸収ピーク高さ
F:ポリイミドフィルムの1500cm-1の吸収ピーク高さ
前記チタン化合物としては、下記の一般式で示されるものが好ましく、具体的にはトリ−n−ブトキシチタンモノステアレート、ジイソプロポキシチタンビス(トリエタノールアミネート)、ブチルチタネートダイマー、テトラノルマルブチルチタネート、テトラ(2ーエチルヘキシル)チタネート、チタンオクチレングリコレートなどが例示される他、ジヒドロキシビス(アンモニウムラクテート)チタニウム、ジヒドロキシチタンビスラクテートなども使用可能である。最も好ましいのはトリ−n−ブトキシチタンモノステアレートあるいはジヒドロキシチタンビスラクテートである。
m=0〜4の整数
または、C3〜C18のカルボン酸およびそのアンモニウム塩の残基
R1 :−H またはC3〜C18の炭化水素残基
R2、R3 :C3〜C18の炭化水素残基
R4 :C3〜C18の炭化水素残基、または、
R7 :C2〜C18の炭化水素残基
ODAは4,4’−ジアミノジフェニルエーテル、
p−PDAはパラフェニレンジアミン、
BAPS−Mはビス(4−(3−アミノフェノキシ)フェニル)スルフォン、
DABAは、4,4’−ジアミノベンズアニリド、
PMDAはピロメリット酸二無水物、
TMHQはp−フェニレンビス(トリメリット酸モノエステル無水物)、
ESDAは2,2−ビス(4−ヒドロキシフェニル)プロパンベンゾエート−3,3’,4,4’−テトラカルボン酸二無水物、DMFはN,N−ジメチルホルムアミドを表す。合成樹脂フィルムの引張弾性率はASTM D882の方法で測定した。
(1)セパラブルフラスコにDMFとp−PDAを1当量、およびODAを1当量をとり、ジアミン化合物が完全に溶解するまで室温でよく撹拌しその後、氷で冷却した。つぎに、TMHQを1当量を加え、40分冷却撹拌した。そして、PMDAを1当量をDMFに溶かし、徐々に加え、このあと1時間冷却撹拌し、重量平均分子量が約100,000のポリアミド酸のDMF溶液を得た。なおDMFの使用量はジアミノ化合物および芳香族テトラカルボン酸化合物のモノマー仕込濃度が、18重量%となるようにした。
チタン濃度が1000ppmのジヒドロキシチタンビスラクテート/1−ブタノール溶液を用いた他は、実施例1同様にして、表面の金属層が3μmの多層プリント配線板を得た。
珪素濃度400ppmのγ−アミノプロピルトリエトキシシラン/1−ブタノールを用いた他は、実施例1同様にして、表面の金属層が3μmの多層プリント配線板を得た。
珪素濃度3000ppmのγ−アミノプロピルトリエトキシシラン/水を用いた他は、実施例1同様にして、表面の金属層が3μmの多層プリント配線板を得た。
セパラブルフラスコにDMFとDABAを3当量、およびODAを1当量とり、ジアミン化合物が完全に溶解するまで室温でよく撹拌し、その後氷で冷却した。次に、TMHQを4当量加え、1時間冷却撹拌し、重量平均分子量が約100,000のポリアミド酸のDMF溶液を得た。なおDMFの使用量はジアミノ化合物および芳香族テトラカルボン酸化合物のモノマー仕込濃度が、18重量%となるようにした。
珪素濃度3000ppmのγ−アミノプロピルトリエトキシシラン/水溶液を用いた他は、実施例5と同様にして、表面の金属層が3μmの多層プリント配線板を得た。
(1)実施例1(1)で作製したポリイミドフィルムに、マグネトロンDCスパッタ法により20nmのニッケル層を、続いて100nmの銅層を形成した。続いて、硫酸銅めっき液を用いた電解めっき法により銅層を形成し、トータル厚さを3μmとした。前記電解銅めっきは、10%の硫酸中で30秒間予備洗浄したのち、室温中で6分間めっきして行った。このとき電流密度は2A/dm2とした。
実施例5で作製したポリイミドフィルムを用いた他は、実施例7同様にして、表面の金属層が3μmの多層プリント配線板を得た。
厚さ3μmに変わって厚さ9μmの電解銅箔を用いること以外は実施例1と同様にして表面の金属層が9μmの多層プリント配線板を得た。得られた多層プリント配線板表面の銅箔を感光性樹脂のエッチングレジストを用いてパターニングし、ライン アンド スペースが 25μmアンド25μmの回路の形成を試みたが、線幅が安定せず、短絡、断線が生じた。
ゲルフィルムをチタン濃度400ppmのジヒドロキシチタンビスラクテート/1−ブタノール溶液に10秒間浸漬し、次いで余分な液滴を除去するという一連の操作を省略した以外は実施例1と同様の方法で多層プリント配線板を得た。
Claims (6)
- 合成樹脂フィルムの片面に金属層を、他方の面に接着剤層を設けてなる金属積層体において、前記金属層がキャリア付き金属箔を用いてなる5ミクロン以下の金属箔であり、前記接着剤が熱硬化性樹脂および熱可塑性ポリイミド樹脂を含むものであり、配線パターンが形成されたプリント配線板の表面に前記積層体を接着剤層と配線パターンが接するように積層し、220℃以下の温度で加熱および加圧することにより、前記接着剤が溶融、流動し、前記配線パターンが前記接着剤に埋め込まれた形で固定される多層プリント配線板作製用積層体。
- 前記合成樹脂フィルムと前記金属層が接着剤を介して接着される請求項1記載の積層体。
- 合成樹脂フィルムがポリイミドフィルムである請求項1または2記載の積層体。
- 前記ポリイミドフィルムの厚さが50ミクロン以下であり、引張弾性率が4GPa以上、線膨張係数が20ppm以下である請求項3記載の積層体。
- 前記合成樹脂フィルムが、部分的にイミド化または部分的に乾燥したポリアミド酸フィルムを、シリコン、チタン、マンガン、鉄、コバルト、銅、亜鉛、スズ、アンチモン、鉛、ビスマスおよびパラジウムからなる群から選択される少なくとも1種の元素を含む化合物の溶液に浸漬または該溶液を塗布したのちに、前記ポリアミド酸フィルムを完全に乾燥し、かつイミド化して得られた前記、少なくとも1種の元素を含むポリイミドフィルムである請求項1、2、3または4記載の積層体。
- 合成樹脂フィルムの片面に5μm以下の厚さの金属層を、他方の面に接着剤層を設けてなる金属積層体であって、前記接着剤層が熱硬化性樹脂および熱可塑性ポリイミド樹脂を含むものであり、配線パターンが形成されたプリント配線板の表面に前記積層体を接着剤層と配線パターンが接するように積層し、220℃以下の温度で加熱および加圧することにより、前記接着剤が溶融、流動し、前記配線パターンが前記接着剤に埋め込まれた形で固定される多層プリント配線板作製用積層体であって、前記合成樹脂フィルムが部分的にイミド化または部分的に乾燥したポリアミド酸フィルムを、シリコン、チタン、マンガン、鉄、コバルト、銅、亜鉛、スズ、アンチモン、鉛、ビスマスおよびパラジウムからなる群から選択される少なくとも1種の元素を含む化合物の溶液に浸漬または該溶液を塗布したのちに、前記ポリアミド酸フィルムを完全に乾燥し、かつイミド化して得られた前記、少なくとも1種の元素を含むポリイミドフィルムであり、かつ前記金属層がスパッタリング、イオンプレーティング、エレクトロンビーム蒸着、抵抗加熱蒸着、化学めっき、電気めっきからなる群から選択される方法で直接前記合成樹脂フィルム上に形成された積層体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000328125 | 2000-10-27 | ||
JP2000328125 | 2000-10-27 | ||
PCT/JP2001/009427 WO2002034509A1 (fr) | 2000-10-27 | 2001-10-26 | Lamine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2002034509A1 JPWO2002034509A1 (ja) | 2004-03-04 |
JP4109543B2 true JP4109543B2 (ja) | 2008-07-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002537531A Expired - Lifetime JP4109543B2 (ja) | 2000-10-27 | 2001-10-26 | 積層体 |
Country Status (4)
Country | Link |
---|---|
US (2) | US6911265B2 (ja) |
JP (1) | JP4109543B2 (ja) |
TW (1) | TWI295966B (ja) |
WO (1) | WO2002034509A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0888063A (ja) * | 1994-09-16 | 1996-04-02 | Yamaichi Electron Co Ltd | Icソケットの接触構造 |
US7556507B2 (en) | 2005-03-10 | 2009-07-07 | Yamaichi Electronics Co., Ltd. | Cartridge for contact terminals and semiconductor device socket provided with the same |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100599544B1 (ko) * | 2000-04-12 | 2006-07-13 | 가부시키가이샤 가네카 | 적층체 및 그것을 사용한 다층 배선판 |
JPWO2003097725A1 (ja) * | 2002-05-21 | 2005-09-15 | 株式会社カネカ | ポリイミドフィルムおよびその製造方法、並びにポリイミドフィルムを用いたポリイミド/金属積層体 |
WO2004045846A1 (ja) * | 2002-11-20 | 2004-06-03 | Tomoegawa Paper Co., Ltd. | フレキシブル金属積層体及び耐熱性接着剤組成物 |
CN1720351A (zh) * | 2002-12-03 | 2006-01-11 | 古河电气工业株式会社 | 用于电气或电子部件的金属材料 |
US20070202255A1 (en) * | 2003-09-29 | 2007-08-30 | Tomoyuki Shinoda | Titanium Or Titanium Alloy Adhesive Resin Composition Prepreg And Composite Material |
KR100981852B1 (ko) * | 2004-09-24 | 2010-09-13 | 가부시키가이샤 가네카 | 높은 접착성을 갖는 폴리이미드 필름의 제조 방법 |
JP2006188025A (ja) * | 2005-01-07 | 2006-07-20 | Ube Ind Ltd | 銅張積層板 |
KR101244589B1 (ko) * | 2005-01-18 | 2013-03-25 | 가부시키가이샤 가네카 | 접착성이 개량된 신규 폴리이미드 필름 |
CN101146848B (zh) * | 2005-03-29 | 2011-07-06 | 日产化学工业株式会社 | 聚酰胺酸、聚酰亚胺及其制备方法 |
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2001
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- 2001-10-26 US US10/169,327 patent/US6911265B2/en not_active Expired - Lifetime
- 2001-10-26 WO PCT/JP2001/009427 patent/WO2002034509A1/ja active Application Filing
- 2001-10-26 JP JP2002537531A patent/JP4109543B2/ja not_active Expired - Lifetime
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Cited By (2)
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JPH0888063A (ja) * | 1994-09-16 | 1996-04-02 | Yamaichi Electron Co Ltd | Icソケットの接触構造 |
US7556507B2 (en) | 2005-03-10 | 2009-07-07 | Yamaichi Electronics Co., Ltd. | Cartridge for contact terminals and semiconductor device socket provided with the same |
Also Published As
Publication number | Publication date |
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JPWO2002034509A1 (ja) | 2004-03-04 |
TWI295966B (ja) | 2008-04-21 |
US6911265B2 (en) | 2005-06-28 |
US20030113521A1 (en) | 2003-06-19 |
US7101619B2 (en) | 2006-09-05 |
US20050221080A1 (en) | 2005-10-06 |
WO2002034509A1 (fr) | 2002-05-02 |
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