JP4892834B2 - 接着性の改良されたポリイミドフィルム、その製法および積層体 - Google Patents
接着性の改良されたポリイミドフィルム、その製法および積層体 Download PDFInfo
- Publication number
- JP4892834B2 JP4892834B2 JP2004375581A JP2004375581A JP4892834B2 JP 4892834 B2 JP4892834 B2 JP 4892834B2 JP 2004375581 A JP2004375581 A JP 2004375581A JP 2004375581 A JP2004375581 A JP 2004375581A JP 4892834 B2 JP4892834 B2 JP 4892834B2
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- JP
- Japan
- Prior art keywords
- polyimide film
- polyimide
- polybenzimidazole
- layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001721 polyimide Polymers 0.000 title claims description 91
- 238000000034 method Methods 0.000 title description 21
- 239000010410 layer Substances 0.000 claims description 62
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000004693 Polybenzimidazole Substances 0.000 claims description 29
- 229920002480 polybenzimidazole Polymers 0.000 claims description 29
- 239000010408 film Substances 0.000 claims description 25
- 239000004642 Polyimide Substances 0.000 claims description 22
- 238000004544 sputter deposition Methods 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 238000007740 vapor deposition Methods 0.000 claims description 14
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 10
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 9
- 238000012986 modification Methods 0.000 claims description 7
- 230000004048 modification Effects 0.000 claims description 7
- 239000002243 precursor Substances 0.000 claims description 7
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 239000002798 polar solvent Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012787 coverlay film Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000002788 crimping Methods 0.000 claims 1
- 229910052714 tellurium Inorganic materials 0.000 claims 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 29
- 239000010949 copper Substances 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000011889 copper foil Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 229920005575 poly(amic acid) Polymers 0.000 description 8
- -1 3,3 ′, 4,4′-tetraaminodiphenyl sulfide Chemical compound 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 6
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 229910018487 Ni—Cr Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001646 UPILEX Polymers 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000005001 laminate film Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 208000028659 discharge Diseases 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 2
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 2
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 2
- XWKFPIODWVPXLX-UHFFFAOYSA-N 2,5-dimethylpyridine Chemical compound CC1=CC=C(C)N=C1 XWKFPIODWVPXLX-UHFFFAOYSA-N 0.000 description 2
- NURQLCJSMXZBPC-UHFFFAOYSA-N 3,4-dimethylpyridine Chemical compound CC1=CC=NC=C1C NURQLCJSMXZBPC-UHFFFAOYSA-N 0.000 description 2
- HWWYDZCSSYKIAD-UHFFFAOYSA-N 3,5-dimethylpyridine Chemical compound CC1=CN=CC(C)=C1 HWWYDZCSSYKIAD-UHFFFAOYSA-N 0.000 description 2
- KSSJBGNOJJETTC-UHFFFAOYSA-N COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC Chemical compound COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC KSSJBGNOJJETTC-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- XFEGRFIENDJTCK-UHFFFAOYSA-N 2-phenyl-2,3-dihydroindene-1,1-dicarboxylic acid Chemical compound C1C2=CC=CC=C2C(C(=O)O)(C(O)=O)C1C1=CC=CC=C1 XFEGRFIENDJTCK-UHFFFAOYSA-N 0.000 description 1
- HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical group C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 1
- JKETWUADWJKEKN-UHFFFAOYSA-N 4-(3,4-diaminophenyl)sulfonylbenzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(N)=C1 JKETWUADWJKEKN-UHFFFAOYSA-N 0.000 description 1
- CCLXSPAANCVXQJ-UHFFFAOYSA-N 4-(3-aminophenyl)cyclohexa-3,5-diene-1,1,2-triamine Chemical group C1=CC(N)(N)C(N)C=C1C1=CC=CC(N)=C1 CCLXSPAANCVXQJ-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- ILPWTQGYOZFLBN-UHFFFAOYSA-N 4-[(3,4-diaminophenyl)methyl]benzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1CC1=CC=C(N)C(N)=C1 ILPWTQGYOZFLBN-UHFFFAOYSA-N 0.000 description 1
- JAWZAONCXMJLFT-UHFFFAOYSA-N 4-propylpyridine Chemical compound CCCC1=CC=NC=C1 JAWZAONCXMJLFT-UHFFFAOYSA-N 0.000 description 1
- RWXZXCZBMQPOBF-UHFFFAOYSA-N 5-methyl-1H-benzimidazole Chemical compound CC1=CC=C2N=CNC2=C1 RWXZXCZBMQPOBF-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BXQPCGFPJPDYMZ-UHFFFAOYSA-N OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O.OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O.OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O BXQPCGFPJPDYMZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- ANUAIBBBDSEVKN-UHFFFAOYSA-N benzene-1,2,4,5-tetramine Chemical compound NC1=CC(N)=C(N)C=C1N ANUAIBBBDSEVKN-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- UIMPSNPKHVULAQ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetramine Chemical compound NC1=C(N)C=CC2=C(N)C(N)=CC=C21 UIMPSNPKHVULAQ-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
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Description
このポリイミドフィルムの有する低い接着性を改良するために種々の試みがなされている。例えば、錫、ビスマスまたはアンチモニ−の化合物を0.02−1重量%含んでいる接着性を改良したポリイミド フィルムが報告されている。(特許文献1,2,3)しかし、これらのポリイミド フィルムは電気絶縁性などの電気特性が低下する恐れがある。
また、プラズマ放電処理によるポリイミドフィルムの接着性改良技術が報告されている。(特許文献4,5)しかし、この放電処理では、ポリイミド フィルムの接着性改良効果が不十分な場合があり、かつ複雑な後処理工程が必要で生産性が低い。
また、この発明は、上記の接着性を改良したポリイミドフィルム上にカバ−レイフィルム用接着剤を積層したカバ−レイフィルムに関する。
また、この発明の方法によれば、簡単な操作でしかもベ−スの芳香族ポリイミドフィルムの特性を保持したまま、接着性、スパッタリング性や金属蒸着性が良好なポリイミドフィルムを得ることができる。
また、この発明の積層体は、ベ−スのポリイミドフィルムと金属層とが大きな接着強度で積層されている。
この発明のベ−スのポリイミドは、好適には3,3’,4,4’−ビフェニルテトラカルボン酸二無水物(以下単にs−BPDAと略記することもある。)とパラフェニレンジアミン(以下単にPPDと略記することもある。)と場合によりさらに4,4’−ジアミノジフェニルエ−テル(以下単にDADEと略記することもある。)とから製造される。この場合PPD/DADE(モル比)は100/0〜85/15であることが好ましい。
ポリイミド用の原料ド−プ〔3,3’,4,4’−ビフェニルテトラカルボン酸二無水物/p−フェニレンジアミン、18重量%のポリアミック酸濃度、有機溶媒:ジメチルアセトアミド の条件で得た溶液に、ポリアミック酸に対して0.05倍当量の1,2−ジメチルイミダゾ−ルを添加して調製〕をステンレス基板上に流延塗布し、135℃で12分間乾燥した後、ステンレス基板より剥離して、溶媒含有率が30から35重量%の自己支持性フィルムを得た。このフィルムに、2質量%に希釈した表面改質用ポリベンズイミダゾ−ル溶液(クラリアントジャパン株式会社製、PBI MRS0810H)を10g/m2の塗工量で塗布し、180℃で1分間、320℃で3分間、450℃で3分間熱処理し、表面にポリベンズイミダゾ−ル層(約0.2μm)が被って(積層して)なる2層ポリイミドフィルム(全体の厚みは12.5μm)を作成した。この2層ポリイミドフィルムは、ベ−スのポリイミドフィルムの特長である低線膨張係数、高弾性率、高強度を保持したままで表面接着性が次に示すように改良されている。
圧延銅箔(日鉱マテリアル株式会社製、BHY−13H−T、厚み18μm)にアクリル系接着剤(デュポン株式会社製、パイララックスLF−0100、厚み25μm)をのせて、2層フィルムの改質面と重ね合わせ、30Kg/cm2 の圧力で180℃にて5分間圧着した。その後180℃の熱風オ−ブン中で60分間熱処理して銅箔ラミネ−トフィルムを得た。このピ−ル強度(T剥離、25℃)を測定したところ、1.5kから1.75kgf/cmであった。
市販のポリイミドフィルム(宇部興産株式会社製、ユ−ピレックス12.5S:厚み12.5μm)を用い、前記と同じ条件で接着剤を用いた銅箔ラミネ−トフィルムを作製した。この銅箔ラミネ−トフィルムのピ−ル強度(T剥離、25℃)を測定したところ、約0.25kgf/cmであった。
(2層または3層ポリイミドフィルムの作製)
表面改質用ポリベンズイミダゾ−ル溶液の塗布厚みを変えた(実施例2)か、両面に塗布した(実施例3)他は実施例1と同様に実施して、表面改質ポリベンズイミダゾ−ル層の厚みが0.15μm(実施例2)、各0.2μm(両面)(実施例3)で、表面が均一で透明性も良好な2−3層ポリイミドフィルムを得た。この2−3層ポリイミドフィルムは、ベ−スのポリイミドフィルムの特長である低線膨張係数、高弾性率、高強度を保持したままで表面接着性が次に示すように改良されている。
(2層ポリイミドフィルムの作製)2層ポリイミドフィルム全体の厚みを変えた他は実施例1と同様に実施して、2層ポリイミドフィルム全体の厚みが25μmで、表面が均一で透明性も良好な2層ポリイミドフィルムを得た。この2層ポリイミドフィルムは、ベ−スのポリイミドフィルムの特長である低線膨張係数、高弾性率、高強度を保持したままで表面接着性が次に示すように改良されている。
市販のポリイミドフィルム(宇部興産株式会社製、ユ−ピレックス25S:厚み25μm)を用い、前記と同じ条件で接着剤を用いた銅箔ラミネ−トフィルムを作製した。この銅箔ラミネ−トフィルムのピ−ル強度(T剥離、25℃)を測定したところ、約0.5kgf/cmであった。
金属層の形成については、スパッタリング法により約0.5μmのニッケル−クロム、その上に約0.4μmの銅を形成し、さらに電解メッキによって約10μmの銅を形成する。剥離強度は必要に応じてプラズマ処理、コロナ処理などの電気処理や、物理、化学処理によって、さらに向上させる事が可能である。しかしながら本発明では全く処理を施さない状態で、上記方法により測定した値を剥離強度と定義する。この値はポリイミドフィルムが本質的に有する剥離強度を的確に再現する。具体的には以下の条件で実験を行った。
Arガス圧:2mTorr
Arガス流量:50sccm
RFパワ−:100W
時間:30秒
Arガス圧:3.7mTorr
Arガス流量:50sccm
DCパワ−:150W
NiCr成膜時間:5秒(50Å)
Cu成膜時間:4分40秒(4000Å)
基板温度は室温(冷却水循環)にした。
実施例1と同様にして表面にポリベンズイミダゾ−ル層(約0.2μm)が被って(積層して)なる2層ポリイミドフィルム(全体の厚みは12.5μm)を作成した。スパッタリング法により約0.5μmのニッケル−クロム、その上に約0.4μmの銅を形成し、さらに電解メッキによって約10μmの銅を形成し、ピ−ル強度(T剥離、25℃)を測定したところ、約0.5kgf/cmであった。
実施例1と同様にして表面にポリベンズイミダゾ−ル層(約0.2μm)が被って(積層して)なる2層ポリイミドフィルム(全体の厚みは35μm)を作成した。スパッタリング法により約0.5μmのニッケル−クロム、その上に約0.4μmの銅を形成し、さらに電解メッキによって約10μmの銅を形成し、ピ−ル強度(T剥離、25℃)を測定したところ、約0.6kgf/cmであった。
市販のポリイミドフィルム(宇部興産株式会社製、ユ−ピレックス12.5SN:厚み12.5μm)を用い、スパッタリング法により約0.5μmのニッケル−クロム、その上に約0.4μmの銅を形成し、さらに電解メッキによって約10μmの銅を形成し、ピ−ル強度(T剥離、25℃)を測定したところ、約0.2kgf/cmであった。
市販のポリイミドフィルム(宇部興産株式会社製、ユ−ピレックス25S:厚み25μm)を用い、スパッタリング法により約0.5μmのニッケル−クロム、その上に約0.4μmの銅を形成し、さらに電解メッキによって約10μmの銅を形成し、ピ−ル強度(T剥離、25℃)を測定したところ、約0.25kgf/cmであった。
Claims (8)
- ポリイミドフィルムの片面または両面に積層したポリベンズイミダゾール表面に、蒸着法またはスパッタリング法によって金属薄層を直接設けるため、又は圧着により接着剤を直接設けるために用いる、ポリイミドフィルムの片面または両面にポリベンズイミダゾールを積層した接着性の改良されたポリイミドフィルム。
- 接着性の改良されたポリイミドフィルムは、ポリイミド前駆体の有機極性溶媒溶液を支持体に流延・乾燥した自己支持性フィルムの片面または両面に、ポリベンズイミダゾールを含む有機極性溶媒溶液を塗布または粉霧した後、加熱処理を完了してなるベース用ポリイミド層と表面改質用ポリベンズイミダゾ−ル薄層とが一体化した多層ポリイミドフィルムであることを特徴とする請求項1に記載の接着性の改良されたポリイミドフィルム。
- ポリイミドは、
1)3,3’,4,4’−ビフェニルテトラカルボン酸二無水物と、パラフェニレンジアミンと4,4’−ジアミノジフェニルエ−テル(但しパラフェニレンジアミンと4,4’−ジアミノジフェニルエ−テルのモル比は100/0〜85/15)とから製造されるポリイミド、
2)3,3’,4,4’−ビフェニルテトラカルボン酸二無水物とピロメリット酸二無水物と、パラフェニレンジアミンと4,4’−ジアミノジフェニルエ−テルとから製造されるポリイミド、
3)ピロメリット酸二無水物とパラフェニレンジアミンおよび4,4’−ジアミノジフェニルエ−テルとから製造されるポリイミド
又は、4)3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物およびピロメリット酸二無水物とパラフェニレンジアミンおよび4,4’−ジアミノジフェニルエ−テルとから製造されるポリイミドであることを特徴とする請求項1又は請求項2に記載の接着性の改良されたポリイミドフィルム。 - ポリベンズイミダゾール層の厚さが0.01−3.0μmである請求項1〜3のいずれかに記載の接着性の改良されたポリイミドフィルム。
- ポリベンズイミダゾール表面に、蒸着法またはスパッタリング法などによって設ける金属薄層は、クロム、チタン、パラジウム、亜鉛、モリブデン、ニッケル、コバルト、ジルコニウム、鉄の少なくとも1種であることを特徴とする請求項1〜4のいずれかに記載の接着性の改良されたポリイミドフィルム。
- 請求項1〜5のいずれかに記載の接着性を改良したポリイミドフィルムのポリベンズイミダゾール表面に直接圧着により接着剤を積層したカバーレイフィルム。
- 請求項1〜5のいずれかに記載の接着性を改良したポリイミドフィルムのポリベンズイミダゾール表面に、直接圧着により接着剤を介して金属箔を積層してなる積層体。
- 請求項1〜5のいずれかに記載の接着性の改良されたポリイミドフィルムの片面または両面のポリベンズイミダゾール表面に、直接蒸着法またはスパッタリング法などによって金属薄層を設け、次いで金属をメッキして金属層を設けた積層体。
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JPH073055A (ja) * | 1991-01-25 | 1995-01-06 | Toyo Cloth Kk | ポリイミドフィルムの表面処理方法 |
JP3295952B2 (ja) * | 1991-11-07 | 2002-06-24 | 東レ株式会社 | フレキシブル配線基板の製造方法 |
JP3217452B2 (ja) * | 1992-06-09 | 2001-10-09 | クラリアント インターナショナル リミテッド | ポリベンズイミダゾール被膜の形成方法 |
US5516874A (en) * | 1994-06-30 | 1996-05-14 | Ibm Corporation | Poly(aryl ether benzimidazoles) |
JP2000044681A (ja) * | 1998-07-30 | 2000-02-15 | Mitsui Chemicals Inc | 保存安定性の優れた高接着性芳香族ポリイミド前駆体の製造方法 |
JP3786157B2 (ja) * | 1998-07-31 | 2006-06-14 | 宇部興産株式会社 | 接着性の改良されたポリイミドフィルム、その製法および積層体 |
EP1407879A4 (en) * | 2001-05-24 | 2006-04-12 | Toray Industries | RESISTANT PLASTIC FILM WITH METAL AND WIRE JOINT COVERS, MANUFACTURING METHOD |
US20030049487A1 (en) * | 2001-06-04 | 2003-03-13 | Shozo Katsuki | Process for preparing metal-coated aromatic polyimide film |
JP2003174247A (ja) * | 2001-09-28 | 2003-06-20 | Ube Ind Ltd | カバーレイフィルムおよび該フィルムを用いた回路基板 |
JP2004299312A (ja) * | 2003-03-31 | 2004-10-28 | Nippon Steel Chem Co Ltd | 金属−ポリイミド積層体 |
-
2004
- 2004-12-27 JP JP2004375581A patent/JP4892834B2/ja active Active
-
2005
- 2005-08-31 US US11/216,748 patent/US20060141273A1/en not_active Abandoned
-
2008
- 2008-06-30 US US12/164,203 patent/US20080292878A1/en not_active Abandoned
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US20080292878A1 (en) | 2008-11-27 |
US20060141273A1 (en) | 2006-06-29 |
JP2006181769A (ja) | 2006-07-13 |
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