JP4095731B2 - 半導体装置の製造方法及び半導体装置 - Google Patents

半導体装置の製造方法及び半導体装置 Download PDF

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Publication number
JP4095731B2
JP4095731B2 JP31723398A JP31723398A JP4095731B2 JP 4095731 B2 JP4095731 B2 JP 4095731B2 JP 31723398 A JP31723398 A JP 31723398A JP 31723398 A JP31723398 A JP 31723398A JP 4095731 B2 JP4095731 B2 JP 4095731B2
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Japan
Prior art keywords
polishing
metal layer
abrasive
acid
conductive film
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Expired - Lifetime
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JP31723398A
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English (en)
Japanese (ja)
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JP2000150435A (ja
JP2000150435A5 (https=
Inventor
喜夫 本間
誠一 近藤
憲之 佐久間
直史 大橋
俊則 今井
日出 山口
伸郎 大和田
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Renesas Technology Corp
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Renesas Technology Corp
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Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP31723398A priority Critical patent/JP4095731B2/ja
Priority to US09/361,989 priority patent/US6326299B1/en
Priority to TW088117081A priority patent/TW452877B/zh
Priority to KR1019990049144A priority patent/KR100653797B1/ko
Publication of JP2000150435A publication Critical patent/JP2000150435A/ja
Priority to US09/978,068 priority patent/US20020025605A1/en
Priority to US10/227,284 priority patent/US6638854B2/en
Publication of JP2000150435A5 publication Critical patent/JP2000150435A5/ja
Application granted granted Critical
Publication of JP4095731B2 publication Critical patent/JP4095731B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Semiconductor Memories (AREA)
JP31723398A 1998-11-09 1998-11-09 半導体装置の製造方法及び半導体装置 Expired - Lifetime JP4095731B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP31723398A JP4095731B2 (ja) 1998-11-09 1998-11-09 半導体装置の製造方法及び半導体装置
US09/361,989 US6326299B1 (en) 1998-11-09 1999-07-28 Method for manufacturing a semiconductor device
TW088117081A TW452877B (en) 1998-11-09 1999-10-04 Semiconductor device and manufacture thereof
KR1019990049144A KR100653797B1 (ko) 1998-11-09 1999-11-08 반도체 장치의 제조 방법
US09/978,068 US20020025605A1 (en) 1998-11-09 2001-10-17 Semiconductor device and method for manufacturing the same
US10/227,284 US6638854B2 (en) 1998-11-09 2002-08-26 Semiconductor device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31723398A JP4095731B2 (ja) 1998-11-09 1998-11-09 半導体装置の製造方法及び半導体装置

Publications (3)

Publication Number Publication Date
JP2000150435A JP2000150435A (ja) 2000-05-30
JP2000150435A5 JP2000150435A5 (https=) 2005-04-07
JP4095731B2 true JP4095731B2 (ja) 2008-06-04

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP31723398A Expired - Lifetime JP4095731B2 (ja) 1998-11-09 1998-11-09 半導体装置の製造方法及び半導体装置

Country Status (4)

Country Link
US (3) US6326299B1 (https=)
JP (1) JP4095731B2 (https=)
KR (1) KR100653797B1 (https=)
TW (1) TW452877B (https=)

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Also Published As

Publication number Publication date
KR20000035287A (ko) 2000-06-26
JP2000150435A (ja) 2000-05-30
KR100653797B1 (ko) 2006-12-05
US6638854B2 (en) 2003-10-28
US20030003713A1 (en) 2003-01-02
TW452877B (en) 2001-09-01
US20020025605A1 (en) 2002-02-28
US6326299B1 (en) 2001-12-04

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