JP4090247B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP4090247B2
JP4090247B2 JP2002034129A JP2002034129A JP4090247B2 JP 4090247 B2 JP4090247 B2 JP 4090247B2 JP 2002034129 A JP2002034129 A JP 2002034129A JP 2002034129 A JP2002034129 A JP 2002034129A JP 4090247 B2 JP4090247 B2 JP 4090247B2
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JP
Japan
Prior art keywords
polishing
substrate
film
wafer
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002034129A
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English (en)
Japanese (ja)
Other versions
JP2003234314A (ja
JP2003234314A5 (enExample
Inventor
遊 石井
正行 中西
賢朗 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
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Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Priority to JP2002034129A priority Critical patent/JP4090247B2/ja
Priority to US10/364,359 priority patent/US7367873B2/en
Publication of JP2003234314A publication Critical patent/JP2003234314A/ja
Publication of JP2003234314A5 publication Critical patent/JP2003234314A5/ja
Priority to US12/078,560 priority patent/US20080188167A1/en
Application granted granted Critical
Publication of JP4090247B2 publication Critical patent/JP4090247B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2002034129A 2002-02-12 2002-02-12 基板処理装置 Expired - Fee Related JP4090247B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002034129A JP4090247B2 (ja) 2002-02-12 2002-02-12 基板処理装置
US10/364,359 US7367873B2 (en) 2002-02-12 2003-02-12 Substrate processing apparatus
US12/078,560 US20080188167A1 (en) 2002-02-12 2008-04-01 Substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002034129A JP4090247B2 (ja) 2002-02-12 2002-02-12 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007246720A Division JP2008042220A (ja) 2007-09-25 2007-09-25 基板処理方法及び装置

Publications (3)

Publication Number Publication Date
JP2003234314A JP2003234314A (ja) 2003-08-22
JP2003234314A5 JP2003234314A5 (enExample) 2005-08-04
JP4090247B2 true JP4090247B2 (ja) 2008-05-28

Family

ID=27776726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002034129A Expired - Fee Related JP4090247B2 (ja) 2002-02-12 2002-02-12 基板処理装置

Country Status (2)

Country Link
US (2) US7367873B2 (enExample)
JP (1) JP4090247B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101444578B1 (ko) * 2013-01-22 2014-09-24 주식회사 엘지실트론 웨이퍼 에지 연마 장치
US9586303B2 (en) 2014-09-12 2017-03-07 Kabushiki Kaisha Toshiba Polishing device and method for polishing semiconductor wafer

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JP4125148B2 (ja) 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
WO2005081301A1 (en) 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP4116583B2 (ja) 2004-03-24 2008-07-09 株式会社東芝 基板処理方法
JP4284215B2 (ja) 2004-03-24 2009-06-24 株式会社東芝 基板処理方法
TWI352645B (en) 2004-05-28 2011-11-21 Ebara Corp Apparatus for inspecting and polishing substrate r
US7682653B1 (en) * 2004-06-17 2010-03-23 Seagate Technology Llc Magnetic disk with uniform lubricant thickness distribution
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KR101249430B1 (ko) * 2004-10-15 2013-04-03 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치 및 폴리싱방법
JP5196709B2 (ja) * 2005-04-19 2013-05-15 株式会社荏原製作所 半導体ウエハ周縁研磨装置及び方法
CN101877305B (zh) * 2005-04-19 2012-01-11 株式会社荏原制作所 基底处理设备
JP2007012943A (ja) * 2005-06-30 2007-01-18 Toshiba Corp 基板処理方法
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US20120125256A1 (en) * 2007-10-06 2012-05-24 Solexel, Inc. Apparatus and method for repeatedly fabricating thin film semiconductor substrates using a template
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JP5393039B2 (ja) 2008-03-06 2014-01-22 株式会社荏原製作所 研磨装置
JP5211835B2 (ja) * 2008-04-30 2013-06-12 ソニー株式会社 ウエハ研磨装置およびウエハ研磨方法
JP2009285774A (ja) * 2008-05-29 2009-12-10 Showa Denko Kk 表面加工方法及び装置
US20100105291A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate
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TWI407587B (zh) * 2009-01-21 2013-09-01 Lumitek Corp 發光二極體晶圓之研磨方法
JP5519256B2 (ja) * 2009-12-03 2014-06-11 株式会社荏原製作所 裏面が研削された基板を研磨する方法および装置
JP5649417B2 (ja) 2010-11-26 2015-01-07 株式会社荏原製作所 固定砥粒を有する研磨テープを用いた基板の研磨方法
JP5886602B2 (ja) * 2011-03-25 2016-03-16 株式会社荏原製作所 研磨装置および研磨方法
US20130137244A1 (en) * 2011-05-26 2013-05-30 Solexel, Inc. Method and apparatus for reconditioning a carrier wafer for reuse
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JP6113960B2 (ja) 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
US9339912B2 (en) 2013-01-31 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer polishing tool using abrasive tape
JP6100002B2 (ja) * 2013-02-01 2017-03-22 株式会社荏原製作所 基板裏面の研磨方法および基板処理装置
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JP6223873B2 (ja) * 2014-03-14 2017-11-01 株式会社荏原製作所 研磨装置及び研磨方法
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US10249518B2 (en) * 2015-03-04 2019-04-02 Toshiba Memory Corporation Polishing device and polishing method
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP2019091746A (ja) * 2017-11-13 2019-06-13 株式会社荏原製作所 基板の表面を処理する装置および方法
JP7129166B2 (ja) * 2018-01-11 2022-09-01 株式会社荏原製作所 基板処理装置及び制御方法
WO2020235205A1 (ja) * 2019-05-17 2020-11-26 住友電気工業株式会社 炭化珪素基板
JP7663336B2 (ja) * 2020-10-12 2025-04-16 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
JP7682638B2 (ja) * 2021-02-12 2025-05-26 株式会社荏原製作所 研磨装置および研磨方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101444578B1 (ko) * 2013-01-22 2014-09-24 주식회사 엘지실트론 웨이퍼 에지 연마 장치
US9586303B2 (en) 2014-09-12 2017-03-07 Kabushiki Kaisha Toshiba Polishing device and method for polishing semiconductor wafer

Also Published As

Publication number Publication date
US7367873B2 (en) 2008-05-06
US20080188167A1 (en) 2008-08-07
JP2003234314A (ja) 2003-08-22
US20040106363A1 (en) 2004-06-03

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