JP3914842B2 - 有機被膜の除去方法および除去装置 - Google Patents
有機被膜の除去方法および除去装置 Download PDFInfo
- Publication number
- JP3914842B2 JP3914842B2 JP2002229394A JP2002229394A JP3914842B2 JP 3914842 B2 JP3914842 B2 JP 3914842B2 JP 2002229394 A JP2002229394 A JP 2002229394A JP 2002229394 A JP2002229394 A JP 2002229394A JP 3914842 B2 JP3914842 B2 JP 3914842B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- ozone
- treatment
- film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/61—Electrolytic etching
- H10P50/613—Electrolytic etching of Group IV materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002229394A JP3914842B2 (ja) | 2001-10-23 | 2002-08-07 | 有機被膜の除去方法および除去装置 |
| TW091124051A TW584893B (en) | 2001-10-23 | 2002-10-18 | Method and apparatus for removing organic films |
| US10/274,153 US6696228B2 (en) | 2001-10-23 | 2002-10-21 | Method and apparatus for removing organic films |
| CNB021471231A CN1286154C (zh) | 2001-10-23 | 2002-10-22 | 除去有机薄膜的方法和设备 |
| KR1020020064786A KR100882988B1 (ko) | 2001-10-23 | 2002-10-23 | 유기 피막의 제거 방법 |
| US10/683,288 US6851873B2 (en) | 2001-10-23 | 2003-10-14 | Method and apparatus for removing organic films |
| KR1020050111295A KR100806476B1 (ko) | 2001-10-23 | 2005-11-21 | 유기 피막의 제거 장치 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-325516 | 2001-10-23 | ||
| JP2001325516 | 2001-10-23 | ||
| JP2002061096 | 2002-03-06 | ||
| JP2002-61096 | 2002-03-06 | ||
| JP2002229394A JP3914842B2 (ja) | 2001-10-23 | 2002-08-07 | 有機被膜の除去方法および除去装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003330206A JP2003330206A (ja) | 2003-11-19 |
| JP2003330206A5 JP2003330206A5 (https=) | 2005-07-07 |
| JP3914842B2 true JP3914842B2 (ja) | 2007-05-16 |
Family
ID=27347717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002229394A Expired - Fee Related JP3914842B2 (ja) | 2001-10-23 | 2002-08-07 | 有機被膜の除去方法および除去装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6696228B2 (https=) |
| JP (1) | JP3914842B2 (https=) |
| KR (2) | KR100882988B1 (https=) |
| CN (1) | CN1286154C (https=) |
| TW (1) | TW584893B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150037719A (ko) | 2012-06-26 | 2015-04-08 | 노무라마이크로사이엔스가부시키가이샤 | 레지스트 박리제 |
Families Citing this family (84)
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| AU2003268622A1 (en) * | 2002-09-06 | 2004-03-29 | Basf Corporation | Method of removing coatings from plastic articles |
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| US6977215B2 (en) * | 2003-10-28 | 2005-12-20 | Nec Electronics America, Inc. | Tungsten plug corrosion prevention method using gas sparged water |
| US7052992B2 (en) * | 2003-10-28 | 2006-05-30 | Nec Electronics America, Inc. | Tungsten plug corrosion prevention method using ionized air |
| DE10351689A1 (de) * | 2003-11-06 | 2005-06-16 | Khs Maschinen- Und Anlagenbau Ag | Verfahren zum Betreiben einer Pasteurisierungsanlage |
| US7202175B2 (en) * | 2003-11-07 | 2007-04-10 | Industrial Technology Research Institute | Method and apparatus for treating a substrate surface by bubbling |
| JP2005169287A (ja) * | 2003-12-11 | 2005-06-30 | Nomura Micro Sci Co Ltd | 有機被膜洗浄液の再生装置及び再生方法並びに有機被膜の洗浄装置及び洗浄方法 |
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| KR100625486B1 (ko) * | 2004-11-04 | 2006-09-20 | 주식회사 디엠에스 | 평판 디스플레이용 기판처리장치 및 기판처리방법 |
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| US5350489A (en) | 1990-10-19 | 1994-09-27 | Purex Co., Ltd. | Treatment method of cleaning surface of plastic molded item |
| US6007970A (en) * | 1992-02-07 | 1999-12-28 | Canon Kabushiki Kaisha | Lithographic developer containing surfactant |
| JP3150509B2 (ja) * | 1992-11-27 | 2001-03-26 | 株式会社日立製作所 | 有機物除去方法及びその方法を使用するための装置 |
| KR970053127A (ko) * | 1995-12-30 | 1997-07-29 | 김주용 | 반도체 기판의 세정방법 |
| US6277753B1 (en) * | 1998-09-28 | 2001-08-21 | Supercritical Systems Inc. | Removal of CMP residue from semiconductors using supercritical carbon dioxide process |
| JP3728945B2 (ja) | 1998-10-30 | 2005-12-21 | オルガノ株式会社 | フォトレジスト現像廃液からの現像液の回収再利用方法及び装置 |
| JP3869566B2 (ja) * | 1998-11-13 | 2007-01-17 | 三菱電機株式会社 | フォトレジスト膜除去方法および装置 |
| US6758938B1 (en) * | 1999-08-31 | 2004-07-06 | Micron Technology, Inc. | Delivery of dissolved ozone |
| JP2001194806A (ja) * | 1999-10-25 | 2001-07-19 | Toray Ind Inc | レジスト剥離方法 |
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| JP4695026B2 (ja) * | 2006-06-20 | 2011-06-08 | ヤンマー株式会社 | コンバイン |
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2002
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- 2002-10-23 KR KR1020020064786A patent/KR100882988B1/ko not_active Expired - Fee Related
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150037719A (ko) | 2012-06-26 | 2015-04-08 | 노무라마이크로사이엔스가부시키가이샤 | 레지스트 박리제 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003330206A (ja) | 2003-11-19 |
| CN1414610A (zh) | 2003-04-30 |
| US20040076912A1 (en) | 2004-04-22 |
| US20030108823A1 (en) | 2003-06-12 |
| US6696228B2 (en) | 2004-02-24 |
| KR100882988B1 (ko) | 2009-02-12 |
| KR20050115844A (ko) | 2005-12-08 |
| CN1286154C (zh) | 2006-11-22 |
| TW584893B (en) | 2004-04-21 |
| KR100806476B1 (ko) | 2008-02-21 |
| KR20030033988A (ko) | 2003-05-01 |
| US6851873B2 (en) | 2005-02-08 |
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