JP3689414B2 - 弾性表面波デバイスの製造方法 - Google Patents

弾性表面波デバイスの製造方法 Download PDF

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Publication number
JP3689414B2
JP3689414B2 JP2003157888A JP2003157888A JP3689414B2 JP 3689414 B2 JP3689414 B2 JP 3689414B2 JP 2003157888 A JP2003157888 A JP 2003157888A JP 2003157888 A JP2003157888 A JP 2003157888A JP 3689414 B2 JP3689414 B2 JP 3689414B2
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Japan
Prior art keywords
saw
resin sheet
chip
saw chip
manufacturing
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Expired - Fee Related
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JP2003157888A
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English (en)
Japanese (ja)
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JP2004363770A (ja
JP2004363770A5 (enExample
Inventor
達也 安齋
祐史 小川
康秀 小野澤
Original Assignee
東洋通信機株式会社
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Application filed by 東洋通信機株式会社 filed Critical 東洋通信機株式会社
Priority to JP2003157888A priority Critical patent/JP3689414B2/ja
Priority to US10/559,238 priority patent/US7183125B2/en
Priority to CN2004800154502A priority patent/CN1799194B/zh
Priority to PCT/JP2004/007900 priority patent/WO2004109912A1/ja
Publication of JP2004363770A publication Critical patent/JP2004363770A/ja
Application granted granted Critical
Publication of JP3689414B2 publication Critical patent/JP3689414B2/ja
Publication of JP2004363770A5 publication Critical patent/JP2004363770A5/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2003157888A 2003-06-03 2003-06-03 弾性表面波デバイスの製造方法 Expired - Fee Related JP3689414B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003157888A JP3689414B2 (ja) 2003-06-03 2003-06-03 弾性表面波デバイスの製造方法
US10/559,238 US7183125B2 (en) 2003-06-03 2004-06-01 Method for manufacturing surface acoustic wave device
CN2004800154502A CN1799194B (zh) 2003-06-03 2004-06-01 制造表面声波器件的方法
PCT/JP2004/007900 WO2004109912A1 (ja) 2003-06-03 2004-06-01 Ｓａｗデバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003157888A JP3689414B2 (ja) 2003-06-03 2003-06-03 弾性表面波デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2004363770A JP2004363770A (ja) 2004-12-24
JP3689414B2 true JP3689414B2 (ja) 2005-08-31
JP2004363770A5 JP2004363770A5 (enExample) 2005-09-02

Family

ID=33508407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003157888A Expired - Fee Related JP3689414B2 (ja) 2003-06-03 2003-06-03 弾性表面波デバイスの製造方法

Country Status (4)

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US (1) US7183125B2 (enExample)
JP (1) JP3689414B2 (enExample)
CN (1) CN1799194B (enExample)
WO (1) WO2004109912A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004201285A (ja) * 2002-12-06 2004-07-15 Murata Mfg Co Ltd 圧電部品の製造方法および圧電部品
JP2006217225A (ja) * 2005-02-03 2006-08-17 Matsushita Electric Ind Co Ltd 弾性表面波デバイスの製造方法
JP2006229632A (ja) * 2005-02-17 2006-08-31 Epson Toyocom Corp 弾性表面波デバイス
KR100691160B1 (ko) * 2005-05-06 2007-03-09 삼성전기주식회사 적층형 표면탄성파 패키지 및 그 제조방법
US7514769B1 (en) * 2005-08-13 2009-04-07 National Semiconductor Corporation Micro surface mount die package and method
JP2009010942A (ja) * 2007-05-29 2009-01-15 Nippon Dempa Kogyo Co Ltd 圧電部品及びその製造方法
JP5264281B2 (ja) * 2008-05-09 2013-08-14 日本電波工業株式会社 圧電部品の製造方法
JP5177516B2 (ja) * 2008-06-02 2013-04-03 太陽誘電株式会社 電子部品
JP2010103647A (ja) * 2008-10-21 2010-05-06 Fujitsu Media Device Kk 弾性表面波デバイス
US9270251B2 (en) * 2013-03-15 2016-02-23 Adaptive Methods, Inc. Carrier for mounting a piezoelectric device on a circuit board and method for mounting a piezoelectric device on a circuit board
JP2014183096A (ja) * 2013-03-18 2014-09-29 Nitto Denko Corp 貼着装置および電子装置の製造方法
JP2015076553A (ja) * 2013-10-10 2015-04-20 日東電工株式会社 電子デバイスパッケージの製造方法及び電子デバイスの封止方法
WO2016042972A1 (ja) * 2014-09-16 2016-03-24 株式会社村田製作所 電子部品及び樹脂モールド型電子部品装置
JP6077717B1 (ja) * 2015-03-24 2017-02-08 技術研究組合次世代３Ｄ積層造形技術総合開発機構 ３次元造形システム、３次元造形物の製造方法、情報処理装置、３次元造形物の収縮抑制構造生成方法および３次元造形物の収縮抑制構造生成プログラム
US11685102B2 (en) * 2017-11-08 2023-06-27 Hytech Worldwide, Inc. Three dimensional thermoforming and lamination
JP7291052B2 (ja) * 2019-09-26 2023-06-14 京セラ株式会社 電子デバイス
CN113927810B (zh) * 2021-09-22 2022-08-02 大同机械科技(江苏)有限公司 一种气压型注塑机
US20240006564A1 (en) * 2022-07-04 2024-01-04 Stroke Precision Advanced Engineering Co., Ltd. Device configured to bond an electronic component, method for bonding an electronic component, and method for manufacturing a light-emitting diode display

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693427A (ja) * 1992-09-14 1994-04-05 Fuji Electric Co Ltd 真空成膜方法
JP3710560B2 (ja) * 1996-07-02 2005-10-26 沖電気工業株式会社 表面弾性波デバイスの実装構造及び実装方法
JPH10215142A (ja) * 1997-01-30 1998-08-11 Kyocera Corp 弾性表面波装置
JP2943764B2 (ja) 1997-05-16 1999-08-30 日本電気株式会社 フリップチップ実装型半導体素子の樹脂封止構造
JP3339450B2 (ja) * 1999-03-02 2002-10-28 株式会社村田製作所 表面波装置の製造方法
JP2002151531A (ja) * 2000-11-15 2002-05-24 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2002184884A (ja) 2000-12-18 2002-06-28 Tdk Corp 電子装置およびその製造方法
JP2002217220A (ja) 2001-01-23 2002-08-02 Tdk Corp 電子装置の製造方法
JP2002217219A (ja) 2001-01-23 2002-08-02 Tdk Corp 電子装置の製造方法
WO2002061943A1 (en) * 2001-01-30 2002-08-08 Matsushita Electric Industrial Co., Ltd. Saw device and method for manufacture thereof
JP2002314234A (ja) 2001-04-13 2002-10-25 Tdk Corp 電子装置およびその製造方法
JP2002334954A (ja) 2001-05-08 2002-11-22 Tdk Corp 電子装置およびその製造方法ならびに電子部品保護用キャップおよびその製造方法
JP5035580B2 (ja) 2001-06-28 2012-09-26 ナガセケムテックス株式会社 弾性表面波デバイスおよびその製法
JP2003032061A (ja) * 2001-07-16 2003-01-31 Toshiba Corp 弾性表面波装置の製造方法
WO2003032484A1 (de) * 2001-09-28 2003-04-17 Epcos Ag Verfahren zur verkapselung eines elektrischen bauelementes und damit verkapseltes oberflächenwellenbauelement
JP4130314B2 (ja) * 2001-11-21 2008-08-06 株式会社東芝 弾性表面波装置の製造方法
KR100431181B1 (ko) * 2001-12-07 2004-05-12 삼성전기주식회사 표면 탄성파 필터 패키지 제조방법
JP3702961B2 (ja) * 2002-10-04 2005-10-05 東洋通信機株式会社 表面実装型ｓａｗデバイスの製造方法

Also Published As

Publication number Publication date
CN1799194B (zh) 2011-06-08
US7183125B2 (en) 2007-02-27
WO2004109912A1 (ja) 2004-12-16
JP2004363770A (ja) 2004-12-24
CN1799194A (zh) 2006-07-05
US20060150381A1 (en) 2006-07-13

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