JP3643600B2 - 半導体ウェーハ処理接着剤およびテープ - Google Patents

半導体ウェーハ処理接着剤およびテープ Download PDF

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Publication number
JP3643600B2
JP3643600B2 JP53601196A JP53601196A JP3643600B2 JP 3643600 B2 JP3643600 B2 JP 3643600B2 JP 53601196 A JP53601196 A JP 53601196A JP 53601196 A JP53601196 A JP 53601196A JP 3643600 B2 JP3643600 B2 JP 3643600B2
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JP
Japan
Prior art keywords
tape
adhesive
wafer
semiconductor wafer
wafer processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP53601196A
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English (en)
Japanese (ja)
Other versions
JPH11508924A (ja
JPH11508924A5 (Direct
Inventor
ベネット，リチャード・イー
バード，ギアルド・シー
ネステガード，マーク・ケイ
ルディン，エリナー
Original Assignee
ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPH11508924A publication Critical patent/JPH11508924A/ja
Publication of JPH11508924A5 publication Critical patent/JPH11508924A5/ja
Application granted granted Critical
Publication of JP3643600B2 publication Critical patent/JP3643600B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10P72/7402—
    • H10P76/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/7416—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP53601196A 1995-07-11 1996-06-13 半導体ウェーハ処理接着剤およびテープ Expired - Fee Related JP3643600B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US49989695A 1995-07-11 1995-07-11
US08/499,896 1995-07-11
PCT/US1996/010336 WO1997003461A1 (en) 1995-07-11 1996-06-13 Semiconductor wafer processing adhesives and tapes

Publications (3)

Publication Number Publication Date
JPH11508924A JPH11508924A (ja) 1999-08-03
JPH11508924A5 JPH11508924A5 (Direct) 2004-07-08
JP3643600B2 true JP3643600B2 (ja) 2005-04-27

Family

ID=23987198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53601196A Expired - Fee Related JP3643600B2 (ja) 1995-07-11 1996-06-13 半導体ウェーハ処理接着剤およびテープ

Country Status (11)

Country Link
US (1) US5851664A (Direct)
EP (1) EP0838086B1 (Direct)
JP (1) JP3643600B2 (Direct)
KR (1) KR100430350B1 (Direct)
CN (1) CN1195424A (Direct)
AU (1) AU703233B2 (Direct)
CA (1) CA2224774A1 (Direct)
DE (1) DE69601942T2 (Direct)
MY (1) MY123743A (Direct)
TW (1) TW311927B (Direct)
WO (1) WO1997003461A1 (Direct)

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KR100430350B1 (ko) 2004-06-16
MX9800319A (es) 1998-07-31
EP0838086A1 (en) 1998-04-29
KR19990028881A (ko) 1999-04-15
EP0838086B1 (en) 1999-03-31
DE69601942T2 (de) 1999-11-11
CA2224774A1 (en) 1997-01-30
TW311927B (Direct) 1997-08-01
DE69601942D1 (de) 1999-05-06
US5851664A (en) 1998-12-22
MY123743A (en) 2006-06-30
CN1195424A (zh) 1998-10-07
JPH11508924A (ja) 1999-08-03

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