JP3400051B2 - 異方性導電膜、その製造方法及びそれを使用するコネクタ - Google Patents

異方性導電膜、その製造方法及びそれを使用するコネクタ

Info

Publication number
JP3400051B2
JP3400051B2 JP30478793A JP30478793A JP3400051B2 JP 3400051 B2 JP3400051 B2 JP 3400051B2 JP 30478793 A JP30478793 A JP 30478793A JP 30478793 A JP30478793 A JP 30478793A JP 3400051 B2 JP3400051 B2 JP 3400051B2
Authority
JP
Japan
Prior art keywords
film
conductive
anisotropic conductive
silicone resin
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30478793A
Other languages
English (en)
Japanese (ja)
Other versions
JPH07161400A (ja
Inventor
龍 前田
彰 立石
俊介 田崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Priority to JP30478793A priority Critical patent/JP3400051B2/ja
Priority to TW083108071A priority patent/TW259893B/zh
Priority to KR1019940029155A priority patent/KR950015856A/ko
Priority to CN94118149A priority patent/CN1041980C/zh
Publication of JPH07161400A publication Critical patent/JPH07161400A/ja
Priority to US08/590,078 priority patent/US5624268A/en
Application granted granted Critical
Publication of JP3400051B2 publication Critical patent/JP3400051B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
JP30478793A 1993-11-10 1993-11-10 異方性導電膜、その製造方法及びそれを使用するコネクタ Expired - Fee Related JP3400051B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP30478793A JP3400051B2 (ja) 1993-11-10 1993-11-10 異方性導電膜、その製造方法及びそれを使用するコネクタ
TW083108071A TW259893B (enExample) 1993-11-10 1994-09-02
KR1019940029155A KR950015856A (ko) 1993-11-10 1994-11-08 이방성 도전막, 그 제조방법 및 그것을 사용하는 컨넥터
CN94118149A CN1041980C (zh) 1993-11-10 1994-11-10 各向异性导电膜的制造方法以及使用该膜的连接器
US08/590,078 US5624268A (en) 1993-11-10 1996-01-17 Electrical connectors using anisotropic conductive films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30478793A JP3400051B2 (ja) 1993-11-10 1993-11-10 異方性導電膜、その製造方法及びそれを使用するコネクタ

Publications (2)

Publication Number Publication Date
JPH07161400A JPH07161400A (ja) 1995-06-23
JP3400051B2 true JP3400051B2 (ja) 2003-04-28

Family

ID=17937233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30478793A Expired - Fee Related JP3400051B2 (ja) 1993-11-10 1993-11-10 異方性導電膜、その製造方法及びそれを使用するコネクタ

Country Status (5)

Country Link
US (1) US5624268A (enExample)
JP (1) JP3400051B2 (enExample)
KR (1) KR950015856A (enExample)
CN (1) CN1041980C (enExample)
TW (1) TW259893B (enExample)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6271482B1 (en) * 1994-08-23 2001-08-07 Thomas & Betts International, Inc. Conductive elastomer interconnect
US5807767A (en) * 1996-01-02 1998-09-15 Micron Technology, Inc. Technique for attaching die to leads
JP3116273B2 (ja) * 1996-04-26 2000-12-11 日本特殊陶業株式会社 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体
JP3145331B2 (ja) * 1996-04-26 2001-03-12 日本特殊陶業株式会社 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体および中継基板と取付基板の接続体の製造方法
JP3284262B2 (ja) * 1996-09-05 2002-05-20 セイコーエプソン株式会社 液晶表示装置及びそれを用いた電子機器
US5902438A (en) * 1997-08-13 1999-05-11 Fry's Metals, Inc. Process for the formation of anisotropic conducting material
US6172878B1 (en) * 1997-12-27 2001-01-09 Canon Kabushiki Kaisha Multi-element module and production process thereof
US5975922A (en) * 1998-03-09 1999-11-02 Lucent Technologies Inc. Device containing directionally conductive composite medium
JP3876953B2 (ja) 1998-03-27 2007-02-07 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6194782B1 (en) * 1998-06-24 2001-02-27 Nortel Networks Limited Mechanically-stabilized area-array device package
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US6188582B1 (en) * 1998-12-18 2001-02-13 Geoffrey Peter Flexible interconnection between integrated circuit chip and substrate or printed circuit board
US6345989B1 (en) * 1999-01-06 2002-02-12 Thomas & Betts International, Inc. Circuit board side interconnect
JP2000207943A (ja) * 1999-01-11 2000-07-28 Sony Corp 異方性導電膜及び異方性導電膜を用いた電気的接続装置
US6174175B1 (en) * 1999-04-29 2001-01-16 International Business Machines Corporation High density Z-axis connector
EP1204988A2 (en) * 1999-08-02 2002-05-15 Gryphics, Inc. Controlled compliance fine pitch interconnect
US6360431B1 (en) * 2000-09-29 2002-03-26 Intel Corporation Processor power delivery system
US6703566B1 (en) 2000-10-25 2004-03-09 Sae Magnetics (H.K.), Ltd. Bonding structure for a hard disk drive suspension using anisotropic conductive film
US6776859B1 (en) 2000-11-27 2004-08-17 Saturn Electronics & Engineering, Inc. Anisotropic bonding system and method using dynamic feedback
KR100365519B1 (ko) * 2000-12-14 2002-12-18 삼성에스디아이 주식회사 유기 전계발광 디바이스 및 이의 제조 방법
US6910897B2 (en) 2001-01-12 2005-06-28 Litton Systems, Inc. Interconnection system
US6979202B2 (en) * 2001-01-12 2005-12-27 Litton Systems, Inc. High-speed electrical connector
US6532654B2 (en) * 2001-01-12 2003-03-18 International Business Machines Corporation Method of forming an electrical connector
US6843657B2 (en) * 2001-01-12 2005-01-18 Litton Systems Inc. High speed, high density interconnect system for differential and single-ended transmission applications
US6465084B1 (en) * 2001-04-12 2002-10-15 International Business Machines Corporation Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
JP3616031B2 (ja) 2001-05-10 2005-02-02 富士通株式会社 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置
US6545226B2 (en) * 2001-05-31 2003-04-08 International Business Machines Corporation Printed wiring board interposer sub-assembly
KR100793725B1 (ko) * 2001-07-31 2008-01-10 삼성전자주식회사 연성 필름 케이블
TW531868B (en) * 2001-08-21 2003-05-11 Au Optronics Corp Soldering type anisotropic conductive film
US6692264B2 (en) * 2001-11-13 2004-02-17 General Motors Corporation Elastomeric connector for fuel cell stack cell voltage monitor
KR100913686B1 (ko) * 2001-11-28 2009-08-24 다우 코닝 도레이 캄파니 리미티드 이방성 전기 전도성 접착 필름, 이의 제조방법 및 이를 포함하는 반도체 장치
US6799977B2 (en) * 2002-07-11 2004-10-05 Hewlett-Packard Development Company, L.P. Socket having foam metal contacts
JP2004051755A (ja) * 2002-07-18 2004-02-19 Ricoh Co Ltd 弾性導電樹脂及び弾性導電接合構造
TWI276252B (en) * 2002-08-27 2007-03-11 Jsr Corp Anisotropic conductive plate and manufacturing method and applications thereof
ATE447248T1 (de) * 2002-10-24 2009-11-15 Ibm Herstellung eines land grid array mittels elastomerkern und leitender metallhülle oder - gitter
US6796810B2 (en) 2002-12-10 2004-09-28 Tyco Electronics Corporation Conductive elastomeric contact system
US6790057B2 (en) 2002-12-10 2004-09-14 Tyco Electronics Corporation Conductive elastomeric contact system with anti-overstress columns
CA2522239C (en) * 2003-03-31 2011-01-04 Sumitomo Electric Industries, Ltd. Anisotropic conductive film and manufacturing method thereof
EP1515399B1 (en) * 2003-09-09 2008-12-31 Nitto Denko Corporation Anisotropic conductive film, production method thereof and method of use thereof
DE10343257B4 (de) * 2003-09-17 2009-06-10 Qimonda Ag Verfahren zur Herstellung von Zwischenverbindungen bei Chip-Sandwich-Anordnungen
US20050082160A1 (en) * 2003-10-15 2005-04-21 Sharper Image Corporation Electro-kinetic air transporter and conditioner devices with a mesh collector electrode
TW200540430A (en) * 2004-04-27 2005-12-16 Jsr Corp Sheet-like probe, method of producing the probe, and application of the probe
KR101030360B1 (ko) * 2004-07-15 2011-04-20 제이에스알 가부시끼가이샤 이방 도전성 커넥터 장치 및 회로 장치의 검사 장치
JP2006048939A (ja) * 2004-07-30 2006-02-16 Jst Mfg Co Ltd 異方導電性シート
US7121841B2 (en) * 2004-11-10 2006-10-17 Intel Corporation Electrical socket with compressible domed contacts
KR20060062824A (ko) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 반도체 패키지 테스트용 실리콘 커넥터
JP2006294527A (ja) * 2005-04-14 2006-10-26 Nec Corp コネクタ及びその製造方法
CN1747258A (zh) * 2005-08-24 2006-03-15 番禺得意精密电子工业有限公司 一种导电元件及使用这种导电元件的电连接器
US7821283B2 (en) * 2005-12-22 2010-10-26 Jsr Corporation Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus
US7453139B2 (en) * 2005-12-27 2008-11-18 Tessera, Inc. Compliant terminal mountings with vented spaces and methods
US7448883B2 (en) * 2007-02-05 2008-11-11 Tyco Electronics Corporation Connector with metalized coated polymer contact
JP2008235556A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 配線板モジュール及び該配線板モジュールの製造方法
JP5043617B2 (ja) * 2007-03-27 2012-10-10 富士フイルム株式会社 異方導電性部材およびその製造方法
US7726976B2 (en) * 2007-11-09 2010-06-01 Tyco Electronics Corporation Shielded electrical interconnect
CN101726641B (zh) * 2008-11-03 2011-05-18 京元电子股份有限公司 导电弹性体的制造方法
KR100930287B1 (ko) 2009-02-25 2009-12-08 넥스디 주식회사 커넥터 모듈의 접점부 수리방법
WO2010101125A1 (ja) * 2009-03-05 2010-09-10 ポリマテック株式会社 弾性コネクタ及び弾性コネクタの製造方法並びに導通接続具
US8098079B2 (en) 2009-04-17 2012-01-17 Oracle America, Inc. Receive circuit for connectors with variable complex impedance
US8476749B2 (en) 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
KR101043956B1 (ko) * 2009-07-31 2011-06-24 전자부품연구원 비등방성 입자배열체 및 그 제조 방법
CN102208390B (zh) * 2011-05-19 2013-03-06 中国科学院微电子研究所 一种高密度凸点基板及其制造方法
CN102866438B (zh) * 2011-07-06 2015-06-03 奇景光电股份有限公司 湿蚀刻基板的方法
KR101339166B1 (ko) * 2012-06-18 2013-12-09 주식회사 아이에스시 관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
IT201700100522A1 (it) * 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
US11482801B2 (en) * 2017-10-19 2022-10-25 Shin-Etsu Polymer Co., Ltd. Electric connector and method for manufacturing the same
KR102110150B1 (ko) * 2019-01-08 2020-06-08 (주)티에스이 신호 전송 커넥터용 도전부 보호부재 및 그 제조방법과, 이를 갖는 신호 전송 커넥터 및 그 제조방법
SG10202006996QA (en) * 2019-07-23 2021-02-25 Casey Michael Silicone contact element
JP7226415B2 (ja) * 2020-03-18 2023-02-21 カシオ計算機株式会社 表示装置及び時計
EP4379479A3 (en) 2020-03-18 2024-10-16 Casio Computer Co., Ltd. Display device and timepiece
CN113035829B (zh) * 2021-03-04 2022-11-25 复旦大学 Tsv无源转接板及其制造方法
CN118645867B (zh) * 2024-07-23 2025-09-23 广东工业大学 一种高压电缆软接头导体的连接方法及高压电缆

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
US3880486A (en) * 1973-03-05 1975-04-29 Epis Corp Apparatus and system for interconnecting circuits and electronic components
US4548451A (en) * 1984-04-27 1985-10-22 International Business Machines Corporation Pinless connector interposer and method for making the same
JPH03289010A (ja) * 1990-04-05 1991-12-19 Ricoh Co Ltd 異方性導電膜の製造方法
JPH0451476A (ja) * 1990-06-18 1992-02-19 Casio Comput Co Ltd 電気的結合用シート及びその電気的接続方法
JP3027171B2 (ja) * 1990-08-29 2000-03-27 キヤノン株式会社 電気回路部材
US5163834A (en) * 1990-12-17 1992-11-17 International Business Machines Corporation High density connector
US5265329A (en) * 1991-06-12 1993-11-30 Amp Incorporated Fiber-filled elastomeric connector attachment method and product

Also Published As

Publication number Publication date
TW259893B (enExample) 1995-10-11
US5624268A (en) 1997-04-29
JPH07161400A (ja) 1995-06-23
KR950015856A (ko) 1995-06-17
CN1106580A (zh) 1995-08-09
CN1041980C (zh) 1999-02-03

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