JP2904124B2 - 金型クリーニング装置及び金型クリーニング方法 - Google Patents

金型クリーニング装置及び金型クリーニング方法

Info

Publication number
JP2904124B2
JP2904124B2 JP8153613A JP15361396A JP2904124B2 JP 2904124 B2 JP2904124 B2 JP 2904124B2 JP 8153613 A JP8153613 A JP 8153613A JP 15361396 A JP15361396 A JP 15361396A JP 2904124 B2 JP2904124 B2 JP 2904124B2
Authority
JP
Japan
Prior art keywords
mold
resin molded
cleaning
molded article
molded product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8153613A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10631A (ja
Inventor
光浩 谷内
幸則 本堂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8153613A priority Critical patent/JP2904124B2/ja
Priority to KR1019970024781A priority patent/KR100266526B1/ko
Priority to NL1006326A priority patent/NL1006326C2/nl
Publication of JPH10631A publication Critical patent/JPH10631A/ja
Application granted granted Critical
Publication of JP2904124B2 publication Critical patent/JP2904124B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP8153613A 1996-06-14 1996-06-14 金型クリーニング装置及び金型クリーニング方法 Expired - Fee Related JP2904124B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8153613A JP2904124B2 (ja) 1996-06-14 1996-06-14 金型クリーニング装置及び金型クリーニング方法
KR1019970024781A KR100266526B1 (ko) 1996-06-14 1997-06-14 금형 크리닝 장치 및 방법
NL1006326A NL1006326C2 (nl) 1996-06-14 1997-06-16 Inrichting en werkwijze voor het reinigen van een gietvorm.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8153613A JP2904124B2 (ja) 1996-06-14 1996-06-14 金型クリーニング装置及び金型クリーニング方法

Publications (2)

Publication Number Publication Date
JPH10631A JPH10631A (ja) 1998-01-06
JP2904124B2 true JP2904124B2 (ja) 1999-06-14

Family

ID=15566322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8153613A Expired - Fee Related JP2904124B2 (ja) 1996-06-14 1996-06-14 金型クリーニング装置及び金型クリーニング方法

Country Status (3)

Country Link
JP (1) JP2904124B2 (nl)
KR (1) KR100266526B1 (nl)
NL (1) NL1006326C2 (nl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764803B1 (ko) 2006-10-12 2007-10-08 세크론 주식회사 반도체소자용 금형 세정장치
KR100945895B1 (ko) 2008-05-21 2010-03-05 주식회사 피에스엠 반도체 몰딩 장비의 인라인 금형 세정장치 및 방법
KR101854007B1 (ko) * 2014-09-11 2018-05-03 세메스 주식회사 반도체 소자 몰딩 장치
CN109940845A (zh) * 2017-12-21 2019-06-28 重庆科美模具有限公司 注塑模具保护装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148016A (ja) * 1984-12-24 1986-07-05 Hitachi Ltd モールド装置
DE3515255A1 (de) * 1985-04-27 1986-10-30 Hartmann, Josef, 7987 Weingarten Vorrichtung zum entnehmen und weiterleiten eines spritzgussteiles bei einer spritzgiessmaschine
JPH084097B2 (ja) * 1986-09-03 1996-01-17 日本電気株式会社 半導体樹脂封止装置
DE3837257A1 (de) * 1988-11-03 1990-05-10 Krupp Gmbh Vorrichtung zum reinigen eines formwerkzeugs von kunststoffverarbeitungsmaschinen
WO1991008095A2 (en) * 1989-11-24 1991-06-13 Asm Fico Tooling B.V. Single-strip moulding apparatus
JP3502106B2 (ja) * 1991-01-14 2004-03-02 松下電器産業株式会社 モールドプレス装置
JPH0919950A (ja) * 1995-07-06 1997-01-21 Mitsubishi Materials Corp 射出成形装置

Also Published As

Publication number Publication date
KR980005917A (ko) 1998-03-30
NL1006326A1 (nl) 1997-12-17
JPH10631A (ja) 1998-01-06
KR100266526B1 (ko) 2000-09-15
NL1006326C2 (nl) 1998-05-18

Similar Documents

Publication Publication Date Title
KR0164440B1 (ko) 전자부품의 수지봉지성형방법 및 장치
TW202210268A (zh) 樹脂密封裝置及其清掃方法
JP2904124B2 (ja) 金型クリーニング装置及び金型クリーニング方法
JP7203414B2 (ja) 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置
US8419404B2 (en) Modular molding assembly for electronic devices
JP3609824B1 (ja) 樹脂封止成形装置
TWI783621B (zh) 樹脂成形裝置及樹脂成形品的製造方法
TWI845856B (zh) 成形模、樹脂成形裝置及樹脂成形品的製造方法
KR100839059B1 (ko) 자동식 회로기판 크리닝 및 칩 몰딩장치
TW202214413A (zh) 樹脂密封裝置及樹脂密封品的製造方法
US6007316A (en) Apparatus for molding resin to seal electronic parts
JPH11233555A (ja) バンプボンディング装置
JP7444452B2 (ja) 樹脂封止装置及びワーク搬送方法
JP3200211B2 (ja) 半導体封止装置
JP4162282B2 (ja) 樹脂モールド装置
JP3720132B2 (ja) 樹脂モールド装置
TWI808730B (zh) 樹脂密封裝置
KR102571950B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
JP3502106B2 (ja) モールドプレス装置
JP2666041B2 (ja) 電子部品の樹脂封止成形方法
JPH10335360A (ja) 半導体素子の樹脂封止装置
JPS63184344A (ja) 半導体製造装置
JPH0546897Y2 (nl)
NL9900013A (nl) Werkwijze en inrichting voor het vormen van hars om elektronische delen af te dichten.
JPH09187831A (ja) 樹脂封止圧縮成形装置およびその方法

Legal Events

Date Code Title Description
S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080326

Year of fee payment: 9

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090326

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090326

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100326

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100326

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110326

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110326

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120326

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130326

Year of fee payment: 14

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130326

Year of fee payment: 14

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140326

Year of fee payment: 15

LAPS Cancellation because of no payment of annual fees