JP2844316B2 - 半導体装置およびその実装構造 - Google Patents

半導体装置およびその実装構造

Info

Publication number
JP2844316B2
JP2844316B2 JP6288793A JP28879394A JP2844316B2 JP 2844316 B2 JP2844316 B2 JP 2844316B2 JP 6288793 A JP6288793 A JP 6288793A JP 28879394 A JP28879394 A JP 28879394A JP 2844316 B2 JP2844316 B2 JP 2844316B2
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor device
bumper
pellet
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6288793A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08130273A (ja
Inventor
邦治 武藤
篤志 錦沢
純一 土屋
俊幸 波多
信也 小池
一男 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd filed Critical Hitachi Ltd
Priority to JP6288793A priority Critical patent/JP2844316B2/ja
Priority to TW084110800A priority patent/TW319905B/zh
Priority to KR1019950037133A priority patent/KR100390094B1/ko
Priority to US08/547,774 priority patent/US5808359A/en
Publication of JPH08130273A publication Critical patent/JPH08130273A/ja
Application granted granted Critical
Publication of JP2844316B2 publication Critical patent/JP2844316B2/ja
Priority to US09/299,663 priority patent/US6104085A/en
Priority to US09/500,536 priority patent/US6320270B1/en
Priority to KR1020000060125A priority patent/KR100392713B1/ko
Priority to US09/794,040 priority patent/US6392308B2/en
Priority to US10/103,988 priority patent/US6492739B2/en
Priority to KR1020020056855A priority patent/KR100396130B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W40/778—
    • H10W72/071—
    • H10W70/421—
    • H10W74/016—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/884—
    • H10W72/932—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6288793A 1994-10-28 1994-10-28 半導体装置およびその実装構造 Expired - Lifetime JP2844316B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP6288793A JP2844316B2 (ja) 1994-10-28 1994-10-28 半導体装置およびその実装構造
TW084110800A TW319905B (enExample) 1994-10-28 1995-10-14
US08/547,774 US5808359A (en) 1994-10-28 1995-10-25 Semiconductor device having a heat sink with bumpers for protecting outer leads
KR1019950037133A KR100390094B1 (ko) 1994-10-28 1995-10-25 반도체장치 및 그 제조방법
US09/299,663 US6104085A (en) 1994-10-28 1999-04-27 Semiconductor device and method of producing the same
US09/500,536 US6320270B1 (en) 1994-10-28 2000-02-09 Semiconductor device and method of producing the same
KR1020000060125A KR100392713B1 (ko) 1994-10-28 2000-10-12 전자장치
US09/794,040 US6392308B2 (en) 1994-10-28 2001-02-28 Semiconductor device having bumper portions integral with a heat sink
US10/103,988 US6492739B2 (en) 1994-10-28 2002-03-25 Semiconductor device having bumper portions integral with a heat sink
KR1020020056855A KR100396130B1 (ko) 1994-10-28 2002-09-18 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6288793A JP2844316B2 (ja) 1994-10-28 1994-10-28 半導体装置およびその実装構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP19808698A Division JP3599566B2 (ja) 1998-06-30 1998-06-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH08130273A JPH08130273A (ja) 1996-05-21
JP2844316B2 true JP2844316B2 (ja) 1999-01-06

Family

ID=17734806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6288793A Expired - Lifetime JP2844316B2 (ja) 1994-10-28 1994-10-28 半導体装置およびその実装構造

Country Status (4)

Country Link
US (5) US5808359A (enExample)
JP (1) JP2844316B2 (enExample)
KR (3) KR100390094B1 (enExample)
TW (1) TW319905B (enExample)

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JP2844316B2 (ja) * 1994-10-28 1999-01-06 株式会社日立製作所 半導体装置およびその実装構造
JPH11145364A (ja) * 1997-11-12 1999-05-28 Denso Corp 樹脂封止型半導体装置及びその製造方法
US5981310A (en) * 1998-01-22 1999-11-09 International Business Machines Corporation Multi-chip heat-sink cap assembly
US6114190A (en) 1998-04-14 2000-09-05 Micron Technology, Inc. Method of forming heat sink and semiconductor chip assemblies
JP3839178B2 (ja) 1999-01-29 2006-11-01 株式会社ルネサステクノロジ 半導体装置
US6252772B1 (en) 1999-02-10 2001-06-26 Micron Technology, Inc. Removable heat sink bumpers on a quad flat package
JP3403699B2 (ja) * 2000-05-31 2003-05-06 宮崎沖電気株式会社 半導体装置および半導体装置の製造方法
DE10232788B4 (de) * 2001-07-18 2010-01-14 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip auf einem Systemträger, Systemträger und Verfahren zur Herstellung eines elektronischen Bauteils
US7135768B2 (en) * 2001-09-06 2006-11-14 Silicon Bandwidth Inc. Hermetic seal
US7485952B1 (en) * 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US20080169541A1 (en) * 2001-09-19 2008-07-17 Jeffrey Alan Miks Enhanced durability multimedia card
EP1318544A1 (en) * 2001-12-06 2003-06-11 STMicroelectronics S.r.l. Method for manufacturing semiconductor device packages
TW544894B (en) * 2002-04-10 2003-08-01 Siliconware Precision Industries Co Ltd Chip carrier with dam bar
US6910635B1 (en) 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
KR100555495B1 (ko) * 2003-02-08 2006-03-03 삼성전자주식회사 칩 어레이 몰딩용 몰드 다이, 그것을 포함하는 몰딩 장치및 칩 어레이 몰딩 방법
KR100893974B1 (ko) * 2003-02-19 2009-04-20 허니웰 인터내셔날 인코포레이티드 열적 상호접속 시스템, 그 제조 방법 및 사용법
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US7863730B2 (en) * 2003-08-28 2011-01-04 St Assembly Test Services Ltd. Array-molded package heat spreader and fabrication method therefor
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7149088B2 (en) * 2004-06-18 2006-12-12 International Rectifier Corporation Half-bridge power module with insert molded heatsinks
JP2006041238A (ja) * 2004-07-28 2006-02-09 Toshiba Corp 配線基板及び配線基板の製造方法
CN100342530C (zh) * 2004-07-30 2007-10-10 奇鋐科技股份有限公司 具有导引风管及风罩的散热模组
US20060037995A1 (en) * 2004-08-20 2006-02-23 Texas Instruments Incorporated Heatslug to leadframe attachment
US7201327B1 (en) 2004-10-18 2007-04-10 Amkor Technology, Inc. Memory card and its manufacturing method
US7193305B1 (en) 2004-11-03 2007-03-20 Amkor Technology, Inc. Memory card ESC substrate insert
DE102004062939B4 (de) * 2004-12-28 2019-02-21 Volkswagen Ag Verfahren und Vorrichtung zum optimierten Starten eines Verbrennungsmotors
US20060170080A1 (en) * 2005-02-03 2006-08-03 Zuniga-Ortiz Edgar R Semiconductor device having directly attached heat spreader
US7220915B1 (en) 2005-02-17 2007-05-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7112875B1 (en) 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US20090021921A1 (en) * 2005-04-26 2009-01-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
TWI269414B (en) * 2005-06-20 2006-12-21 Via Tech Inc Package substrate with improved structure for thermal dissipation and electronic device using the same
US7375975B1 (en) 2005-10-31 2008-05-20 Amkor Technology, Inc. Enhanced durability memory card
US7837120B1 (en) 2005-11-29 2010-11-23 Amkor Technology, Inc. Modular memory card and method of making same
US7359204B1 (en) 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
JP2007281146A (ja) * 2006-04-05 2007-10-25 Sharp Corp 半導体発光装置
US20070270040A1 (en) * 2006-05-05 2007-11-22 Jang Sang J Chamfered Memory Card
US20070290303A1 (en) * 2006-06-07 2007-12-20 Texas Instruments Deutschland Gmbh Dual leadframe semiconductor device package
US7655527B2 (en) * 2006-11-07 2010-02-02 Infineon Technologies Austria Ag Semiconductor element and process of manufacturing semiconductor element
US20080230880A1 (en) * 2007-03-21 2008-09-25 Kazuaki Ano Leadframe Array with Riveted Heat Sinks
US7902644B2 (en) * 2007-12-07 2011-03-08 Stats Chippac Ltd. Integrated circuit package system for electromagnetic isolation
JP2010118577A (ja) * 2008-11-14 2010-05-27 Sumitomo Electric Ind Ltd 樹脂封止型半導体装置およびその製造方法
JP5378781B2 (ja) * 2008-12-26 2013-12-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
CN101936708B (zh) * 2010-08-13 2012-05-23 河海大学常州校区 Qfp芯片的定位检测方法
CN103531551A (zh) * 2013-09-26 2014-01-22 杰群电子科技（东莞）有限公司 一种半导体封装结构及其成型方法
JP2016076640A (ja) * 2014-10-08 2016-05-12 カルソニックカンセイ株式会社 半導体冷却構造
JP6695156B2 (ja) * 2016-02-02 2020-05-20 エイブリック株式会社 樹脂封止型半導体装置
CN108022899B (zh) * 2016-10-28 2020-02-11 台达电子工业股份有限公司 具有引线部件的电源模块及其制造方法

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JP3286558B2 (ja) 1997-04-24 2002-05-27 三洋電機株式会社 空気清浄器

Also Published As

Publication number Publication date
TW319905B (enExample) 1997-11-11
US6104085A (en) 2000-08-15
KR100392713B1 (ko) 2003-07-28
JPH08130273A (ja) 1996-05-21
US5808359A (en) 1998-09-15
US20010006259A1 (en) 2001-07-05
US6320270B1 (en) 2001-11-20
US6492739B2 (en) 2002-12-10
US20020096791A1 (en) 2002-07-25
KR100396130B1 (ko) 2003-08-27
KR100390094B1 (ko) 2003-09-26
US6392308B2 (en) 2002-05-21
KR960015827A (ko) 1996-05-22

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