JP2026074140A5 - - Google Patents

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Publication number
JP2026074140A5
JP2026074140A5 JP2026015976A JP2026015976A JP2026074140A5 JP 2026074140 A5 JP2026074140 A5 JP 2026074140A5 JP 2026015976 A JP2026015976 A JP 2026015976A JP 2026015976 A JP2026015976 A JP 2026015976A JP 2026074140 A5 JP2026074140 A5 JP 2026074140A5
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Japan
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transistor
region
conductive layer
layer
channel formation
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Pending
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JP2026015976A
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English (en)
Japanese (ja)
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JP2026074140A (ja
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Priority claimed from JP2021007058A external-priority patent/JP7111851B2/ja
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Publication of JP2026074140A publication Critical patent/JP2026074140A/ja
Publication of JP2026074140A5 publication Critical patent/JP2026074140A5/ja
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JP2026015976A 2014-12-02 2026-02-03 半導体装置 Pending JP2026074140A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2014244302 2014-12-02
JP2014244302 2014-12-02
JP2021007058A JP7111851B2 (ja) 2014-12-02 2021-01-20 表示装置
JP2022116430A JP7165838B2 (ja) 2014-12-02 2022-07-21 半導体装置
JP2022169642A JP7502392B2 (ja) 2014-12-02 2022-10-24 半導体装置
JP2023171121A JP7610671B2 (ja) 2014-12-02 2023-10-02 半導体装置
JP2024225223A JP7814484B2 (ja) 2014-12-02 2024-12-20 半導体装置

Related Parent Applications (1)

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JP2024225223A Division JP7814484B2 (ja) 2014-12-02 2024-12-20 半導体装置

Publications (2)

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JP2026074140A JP2026074140A (ja) 2026-05-01
JP2026074140A5 true JP2026074140A5 (enExample) 2026-05-18

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ID=56079679

Family Applications (8)

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JP2015228423A Active JP6613116B2 (ja) 2014-12-02 2015-11-24 半導体装置、及び半導体装置の作製方法
JP2019199656A Active JP6828119B2 (ja) 2014-12-02 2019-11-01 表示装置
JP2021007058A Active JP7111851B2 (ja) 2014-12-02 2021-01-20 表示装置
JP2022116430A Active JP7165838B2 (ja) 2014-12-02 2022-07-21 半導体装置
JP2022169642A Active JP7502392B2 (ja) 2014-12-02 2022-10-24 半導体装置
JP2023171121A Active JP7610671B2 (ja) 2014-12-02 2023-10-02 半導体装置
JP2024225223A Active JP7814484B2 (ja) 2014-12-02 2024-12-20 半導体装置
JP2026015976A Pending JP2026074140A (ja) 2014-12-02 2026-02-03 半導体装置

Family Applications Before (7)

Application Number Title Priority Date Filing Date
JP2015228423A Active JP6613116B2 (ja) 2014-12-02 2015-11-24 半導体装置、及び半導体装置の作製方法
JP2019199656A Active JP6828119B2 (ja) 2014-12-02 2019-11-01 表示装置
JP2021007058A Active JP7111851B2 (ja) 2014-12-02 2021-01-20 表示装置
JP2022116430A Active JP7165838B2 (ja) 2014-12-02 2022-07-21 半導体装置
JP2022169642A Active JP7502392B2 (ja) 2014-12-02 2022-10-24 半導体装置
JP2023171121A Active JP7610671B2 (ja) 2014-12-02 2023-10-02 半導体装置
JP2024225223A Active JP7814484B2 (ja) 2014-12-02 2024-12-20 半導体装置

Country Status (3)

Country Link
US (3) US20160155849A1 (enExample)
JP (8) JP6613116B2 (enExample)
KR (4) KR102436265B1 (enExample)

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