JP2024096290A5 - - Google Patents
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- Publication number
- JP2024096290A5 JP2024096290A5 JP2024073979A JP2024073979A JP2024096290A5 JP 2024096290 A5 JP2024096290 A5 JP 2024096290A5 JP 2024073979 A JP2024073979 A JP 2024073979A JP 2024073979 A JP2024073979 A JP 2024073979A JP 2024096290 A5 JP2024096290 A5 JP 2024096290A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- molding resin
- composition according
- inorganic filler
- titanate particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 26
- 239000011342 resin composition Substances 0.000 claims 26
- 239000002245 particle Substances 0.000 claims 17
- 239000011256 inorganic filler Substances 0.000 claims 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims 12
- 239000003822 epoxy resin Substances 0.000 claims 11
- 229920000647 polyepoxide Polymers 0.000 claims 11
- 125000000217 alkyl group Chemical group 0.000 claims 9
- 125000004432 carbon atom Chemical group C* 0.000 claims 9
- -1 ester compound Chemical class 0.000 claims 9
- 150000002790 naphthalenes Chemical group 0.000 claims 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 9
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims 7
- 239000003795 chemical substances by application Substances 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 3
- 150000001555 benzenes Chemical group 0.000 claims 3
- 125000006267 biphenyl group Chemical group 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 3
- 125000001624 naphthyl group Chemical group 0.000 claims 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 3
- 239000004848 polyfunctional curative Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 2
- 235000010290 biphenyl Nutrition 0.000 claims 2
- 239000004305 biphenyl Substances 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 229910052749 magnesium Inorganic materials 0.000 claims 2
- 239000011777 magnesium Substances 0.000 claims 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 229910000505 Al2TiO5 Inorganic materials 0.000 claims 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 1
- 229910002113 barium titanate Inorganic materials 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims 1
- 229910052744 lithium Inorganic materials 0.000 claims 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims 1
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 claims 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPPCT/JP2020/046412 | 2020-12-11 | ||
| PCT/JP2020/046412 WO2022123792A1 (ja) | 2020-12-11 | 2020-12-11 | 成形用樹脂組成物及び電子部品装置 |
| PCT/JP2021/017047 WO2022123807A1 (ja) | 2020-12-11 | 2021-04-28 | 成形用樹脂組成物及び電子部品装置 |
| JPPCT/JP2021/017047 | 2021-04-28 | ||
| PCT/JP2021/045521 WO2022124396A1 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
| JP2022568346A JP7485088B2 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022568346A Division JP7485088B2 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024096290A JP2024096290A (ja) | 2024-07-12 |
| JP2024096290A5 true JP2024096290A5 (https=) | 2024-12-05 |
Family
ID=81974328
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022568346A Active JP7485088B2 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
| JP2024073979A Pending JP2024096290A (ja) | 2020-12-11 | 2024-04-30 | 成形用樹脂組成物及び電子部品装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022568346A Active JP7485088B2 (ja) | 2020-12-11 | 2021-12-10 | 成形用樹脂組成物及び電子部品装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240034833A1 (https=) |
| EP (1) | EP4242268A4 (https=) |
| JP (2) | JP7485088B2 (https=) |
| KR (1) | KR20230118098A (https=) |
| CN (1) | CN116529315A (https=) |
| TW (1) | TWI911350B (https=) |
| WO (3) | WO2022123792A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023189965A1 (ja) * | 2022-03-30 | 2023-10-05 | デンカ株式会社 | 球状チタン酸カルシウム粉末及びそれを用いた樹脂組成物 |
| EP4642852A1 (en) * | 2022-12-27 | 2025-11-05 | 3M Innovative Properties Company | Dielectric curable composition and dielectric curable composition component |
| CN121079271A (zh) * | 2023-05-29 | 2025-12-05 | 株式会社雅都玛科技 | 钛酸钙粒子材料、其制造方法、浆料组合物、树脂组合物 |
| JP2025076889A (ja) * | 2023-11-02 | 2025-05-16 | 株式会社レゾナック | 成形用樹脂組成物及び電子部品装置 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH079609A (ja) * | 1993-06-24 | 1995-01-13 | Hitachi Chem Co Ltd | 高誘電率積層板 |
| JPH10158472A (ja) * | 1996-11-28 | 1998-06-16 | Hitachi Chem Co Ltd | エポキシ樹脂組成物、エポキシ樹脂ワニス、エポキシ樹脂プリプレグ及びこのエポキシ樹脂プリプレグを接着用プリプレグとした多層プリント配線板 |
| JP2001192536A (ja) * | 2000-01-11 | 2001-07-17 | Mitsubishi Gas Chem Co Inc | 高比誘電率ｂステージシート、それを用いたプリント配線板 |
| JP2001345212A (ja) * | 2000-05-31 | 2001-12-14 | Tdk Corp | 積層電子部品 |
| JP2003147171A (ja) * | 2001-11-15 | 2003-05-21 | Hitachi Chem Co Ltd | 絶縁樹脂組成物の製造方法、絶縁樹脂組成物、該絶縁樹脂組成物を用いた銅箔付き絶縁材及び銅張積層板 |
| JP4109500B2 (ja) * | 2002-07-08 | 2008-07-02 | 株式会社カネカ | 熱硬化性樹脂組成物、熱硬化性樹脂溶液、および熱硬化性樹脂シート |
| JP3947464B2 (ja) * | 2002-12-27 | 2007-07-18 | Ｔｄｋ株式会社 | 樹脂組成物、樹脂硬化物、シート状樹脂硬化物及び積層体 |
| JP4622413B2 (ja) * | 2004-09-21 | 2011-02-02 | 株式会社村田製作所 | 樹脂組成物、樹脂硬化物、および積層型電子部品 |
| JP2006225484A (ja) * | 2005-02-16 | 2006-08-31 | Murata Mfg Co Ltd | 複合誘電体材料及び電子部品 |
| JP2009073987A (ja) * | 2007-09-21 | 2009-04-09 | Ajinomoto Co Inc | 高誘電樹脂組成物 |
| EP2351710A4 (en) * | 2008-09-05 | 2013-05-01 | Sumitomo Electric Industries | CERAMIC POWDER, DIELECTRIC COMPOSITE CONTAINING CERAMIC POWDER, AND DIELECTRIC ANTENNA |
| CN103347940A (zh) * | 2011-02-02 | 2013-10-09 | 积水化学工业株式会社 | 粗糙化固化物及叠层体 |
| JP2012216685A (ja) * | 2011-03-31 | 2012-11-08 | Nippon Zeon Co Ltd | 多層基板 |
| JP6042054B2 (ja) * | 2011-05-26 | 2016-12-14 | Dic株式会社 | 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム |
| JP6048734B2 (ja) * | 2012-11-15 | 2016-12-21 | Dic株式会社 | 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
| JP6070134B2 (ja) | 2012-12-07 | 2017-02-01 | Dic株式会社 | 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
| CN103351581B (zh) * | 2013-07-19 | 2015-11-25 | 广东生益科技股份有限公司 | 一种高介电常数树脂组合物及其用途 |
| JP6066865B2 (ja) | 2013-08-15 | 2017-01-25 | 信越化学工業株式会社 | 高誘電率エポキシ樹脂組成物および半導体装置 |
| CN105693141B (zh) * | 2014-08-29 | 2017-08-04 | 天津德高化成新材料股份有限公司 | 一种用于指纹传感器感应层的介电复合材料的制备方法 |
| JP6679849B2 (ja) * | 2015-07-01 | 2020-04-15 | 味の素株式会社 | 樹脂組成物 |
| JP6742785B2 (ja) * | 2015-08-13 | 2020-08-19 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルムおよびプリント配線板 |
| JP6519424B2 (ja) | 2015-09-16 | 2019-05-29 | 住友ベークライト株式会社 | 高誘電樹脂組成物 |
| US10269732B2 (en) * | 2016-07-20 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Info package with integrated antennas or inductors |
| US10594019B2 (en) * | 2016-12-03 | 2020-03-17 | International Business Machines Corporation | Wireless communications package with integrated antenna array |
| JP6832193B2 (ja) | 2017-02-27 | 2021-02-24 | 京セラ株式会社 | 樹脂組成物および樹脂封止型半導体装置 |
| MY194474A (en) * | 2017-03-14 | 2022-11-30 | Mitsui Mining & Smelting Co Ltd | Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor |
| JP7142233B2 (ja) * | 2017-12-14 | 2022-09-27 | パナソニックＩｐマネジメント株式会社 | 封止用エポキシ樹脂組成物、硬化物、及び半導体装置 |
| CN111344351B (zh) * | 2018-02-01 | 2024-02-09 | 三井金属矿业株式会社 | 树脂组合物、带树脂铜箔、介电层、覆铜层叠板、电容器元件以及内置电容器的印刷电路板 |
| JP7354567B2 (ja) * | 2019-03-27 | 2023-10-03 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体装置 |
| JP6870778B1 (ja) * | 2020-12-11 | 2021-05-12 | 昭和電工マテリアルズ株式会社 | 成形用樹脂組成物及び電子部品装置 |
-
2020
- 2020-12-11 WO PCT/JP2020/046412 patent/WO2022123792A1/ja not_active Ceased
-
2021
- 2021-04-28 WO PCT/JP2021/017047 patent/WO2022123807A1/ja not_active Ceased
- 2021-12-10 WO PCT/JP2021/045521 patent/WO2022124396A1/ja not_active Ceased
- 2021-12-10 EP EP21903492.3A patent/EP4242268A4/en active Pending
- 2021-12-10 KR KR1020237019119A patent/KR20230118098A/ko active Pending
- 2021-12-10 CN CN202180081702.5A patent/CN116529315A/zh active Pending
- 2021-12-10 JP JP2022568346A patent/JP7485088B2/ja active Active
- 2021-12-10 US US18/039,957 patent/US20240034833A1/en active Pending
- 2021-12-13 TW TW110146574A patent/TWI911350B/zh active
-
2024
- 2024-04-30 JP JP2024073979A patent/JP2024096290A/ja active Pending
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