JPWO2023032971A5 - - Google Patents
Info
- Publication number
- JPWO2023032971A5 JPWO2023032971A5 JP2023545595A JP2023545595A JPWO2023032971A5 JP WO2023032971 A5 JPWO2023032971 A5 JP WO2023032971A5 JP 2023545595 A JP2023545595 A JP 2023545595A JP 2023545595 A JP2023545595 A JP 2023545595A JP WO2023032971 A5 JPWO2023032971 A5 JP WO2023032971A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- compression molding
- resin composition
- mass
- molding according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021143465 | 2021-09-02 | ||
| PCT/JP2022/032567 WO2023032971A1 (ja) | 2021-09-02 | 2022-08-30 | 圧縮成形用エポキシ樹脂組成物及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032971A1 JPWO2023032971A1 (https=) | 2023-03-09 |
| JPWO2023032971A5 true JPWO2023032971A5 (https=) | 2025-07-18 |
Family
ID=85411257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545595A Pending JPWO2023032971A1 (https=) | 2021-09-02 | 2022-08-30 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023032971A1 (https=) |
| TW (1) | TW202313840A (https=) |
| WO (1) | WO2023032971A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026048746A1 (ja) * | 2024-08-27 | 2026-03-05 | 株式会社レゾナック | 封止用樹脂組成物及び電子部品装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0841293A (ja) * | 1994-07-27 | 1996-02-13 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂組成物及び半導体装置 |
| JP5574237B2 (ja) * | 2008-05-21 | 2014-08-20 | ナガセケムテックス株式会社 | 電子部品封止用エポキシ樹脂組成物 |
| JP6558671B2 (ja) * | 2014-11-07 | 2019-08-14 | パナソニックＩｐマネジメント株式会社 | 封止用エポキシ樹脂組成物及び半導体装置 |
| JP2016108367A (ja) * | 2014-12-02 | 2016-06-20 | 信越化学工業株式会社 | 半導体封止用樹脂組成物及び該樹脂組成物を用いた半導体封止方法 |
| KR102951895B1 (ko) * | 2019-10-16 | 2026-04-10 | 가부시끼가이샤 레조낙 | 에폭시 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 |
-
2022
- 2022-08-30 JP JP2023545595A patent/JPWO2023032971A1/ja active Pending
- 2022-08-30 WO PCT/JP2022/032567 patent/WO2023032971A1/ja not_active Ceased
- 2022-09-01 TW TW111133139A patent/TW202313840A/zh unknown
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