JPWO2023120738A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023120738A5
JPWO2023120738A5 JP2023569591A JP2023569591A JPWO2023120738A5 JP WO2023120738 A5 JPWO2023120738 A5 JP WO2023120738A5 JP 2023569591 A JP2023569591 A JP 2023569591A JP 2023569591 A JP2023569591 A JP 2023569591A JP WO2023120738 A5 JPWO2023120738 A5 JP WO2023120738A5
Authority
JP
Japan
Prior art keywords
ppm
composition according
integral value
chemical shift
silicone compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023569591A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023120738A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/048050 external-priority patent/WO2023120738A1/ja
Publication of JPWO2023120738A1 publication Critical patent/JPWO2023120738A1/ja
Publication of JPWO2023120738A5 publication Critical patent/JPWO2023120738A5/ja
Pending legal-status Critical Current

Links

JP2023569591A 2021-12-24 2022-12-26 Pending JPWO2023120738A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021210834 2021-12-24
PCT/JP2022/048050 WO2023120738A1 (ja) 2021-12-24 2022-12-26 封止材組成物及び電子部品装置

Publications (2)

Publication Number Publication Date
JPWO2023120738A1 JPWO2023120738A1 (https=) 2023-06-29
JPWO2023120738A5 true JPWO2023120738A5 (https=) 2024-09-06

Family

ID=86902919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023569591A Pending JPWO2023120738A1 (https=) 2021-12-24 2022-12-26

Country Status (4)

Country Link
JP (1) JPWO2023120738A1 (https=)
CN (1) CN118525071A (https=)
TW (1) TW202340367A (https=)
WO (1) WO2023120738A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0655827B2 (ja) * 1988-04-18 1994-07-27 信越化学工業株式会社 半導体封止用エポキシ樹脂タブレットの製造方法
KR102072060B1 (ko) * 2013-08-05 2020-01-31 히타치가세이가부시끼가이샤 에폭시 수지 조성물 및 전자 부품 장치
WO2019189142A1 (ja) * 2018-03-29 2019-10-03 住友ベークライト株式会社 粒子状封止用樹脂組成物、半導体装置およびその製造方法

Similar Documents

Publication Publication Date Title
EP4474402A3 (en) Liquid resin composition for compression molding and electronic component apparatus
JPWO2023047702A5 (https=)
MY156659A (en) Resin composition for encapsulating semiconductor and semiconductor device
PH12012502576A1 (en) Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film
CN101186803A (zh) 一种环氧树脂基阻尼封装料
TW200720315A (en) Molding resin composition for optical semiconductor elements and optical semiconductor device obtained by using the same
SG10201406428QA (en) Semiconductor device
MY153000A (en) Resin composition for encapsulating semiconductor and semiconductor device
MY144047A (en) Epoxy resin composition, process for providing latency to the composition and a semiconductor device
TW200631981A (en) The novel curable resin, the method of manufacturing the same, the epoxy resin composition and the electronic parts/devices
JPWO2023120738A5 (https=)
JPWO2022124406A5 (https=)
MY202192A (en) Epoxy resin composition for sealing ball grid array package, epoxy resin cured product and electronic component device
JP2018188611A5 (https=)
WO2008111283A1 (ja) 光硬化性樹脂組成物
MX2019008819A (es) Composicion de resina epoxidica termofraguable para preparacion de articulos para ingenieria electrica, y tales articulos obtenidos a partir de la misma.
JP7289108B2 (ja) 半導体封止材料及び半導体装置
JPWO2023032971A5 (https=)
MY145438A (en) Epoxy resin composition for encapsulation of semiconductors and semiconductor devices
MY177304A (en) Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device
TW200619257A (en) Epoxyresin compositions and articles
CN104109348A (zh) 一种双组分环氧电子灌封液体胶
JPWO2023238951A5 (https=)
JPWO2024075343A5 (https=)
SG178934A1 (en) Semiconductor device