JPWO2023238951A5 - - Google Patents

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Publication number
JPWO2023238951A5
JPWO2023238951A5 JP2024508602A JP2024508602A JPWO2023238951A5 JP WO2023238951 A5 JPWO2023238951 A5 JP WO2023238951A5 JP 2024508602 A JP2024508602 A JP 2024508602A JP 2024508602 A JP2024508602 A JP 2024508602A JP WO2023238951 A5 JPWO2023238951 A5 JP WO2023238951A5
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JP
Japan
Prior art keywords
resin composition
composition according
molding resin
epoxy resin
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024508602A
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English (en)
Japanese (ja)
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JPWO2023238951A1 (https=
JP7501818B2 (ja
Filing date
Publication date
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Priority claimed from PCT/JP2023/021623 external-priority patent/WO2023238951A1/ja
Publication of JPWO2023238951A1 publication Critical patent/JPWO2023238951A1/ja
Publication of JPWO2023238951A5 publication Critical patent/JPWO2023238951A5/ja
Priority to JP2024092502A priority Critical patent/JP2024107187A/ja
Application granted granted Critical
Publication of JP7501818B2 publication Critical patent/JP7501818B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024508602A 2022-06-10 2023-06-09 成形用樹脂組成物及び電子部品装置 Active JP7501818B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024092502A JP2024107187A (ja) 2022-06-10 2024-06-06 成形用樹脂組成物及び電子部品装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022094677 2022-06-10
JP2022094677 2022-06-10
PCT/JP2023/021623 WO2023238951A1 (ja) 2022-06-10 2023-06-09 成形用樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024092502A Division JP2024107187A (ja) 2022-06-10 2024-06-06 成形用樹脂組成物及び電子部品装置

Publications (3)

Publication Number Publication Date
JPWO2023238951A1 JPWO2023238951A1 (https=) 2023-12-14
JPWO2023238951A5 true JPWO2023238951A5 (https=) 2024-05-21
JP7501818B2 JP7501818B2 (ja) 2024-06-18

Family

ID=89118471

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024508602A Active JP7501818B2 (ja) 2022-06-10 2023-06-09 成形用樹脂組成物及び電子部品装置
JP2024092502A Pending JP2024107187A (ja) 2022-06-10 2024-06-06 成形用樹脂組成物及び電子部品装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024092502A Pending JP2024107187A (ja) 2022-06-10 2024-06-06 成形用樹脂組成物及び電子部品装置

Country Status (6)

Country Link
US (1) US20250289951A1 (https=)
JP (2) JP7501818B2 (https=)
KR (1) KR20250020460A (https=)
CN (1) CN119173580A (https=)
TW (1) TW202405086A (https=)
WO (1) WO2023238951A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7540554B1 (ja) * 2023-07-19 2024-08-27 株式会社レゾナック 成形用樹脂組成物及び電子部品装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001131393A (ja) * 1999-10-29 2001-05-15 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
US7846998B2 (en) * 2004-03-03 2010-12-07 Hitachi Chemical Co., Ltd. Sealant epoxy-resin molding material, and electronic component device
JP6042054B2 (ja) 2011-05-26 2016-12-14 Dic株式会社 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP6070134B2 (ja) 2012-12-07 2017-02-01 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP6066865B2 (ja) * 2013-08-15 2017-01-25 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
JP6519424B2 (ja) 2015-09-16 2019-05-29 住友ベークライト株式会社 高誘電樹脂組成物
JP6832193B2 (ja) 2017-02-27 2021-02-24 京セラ株式会社 樹脂組成物および樹脂封止型半導体装置
WO2020262654A1 (ja) * 2019-06-26 2020-12-30 昭和電工マテリアルズ株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7589435B2 (ja) * 2020-01-23 2024-11-26 株式会社レゾナック 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JP6870778B1 (ja) * 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置

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