JPWO2023047702A5 - - Google Patents
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- Publication number
- JPWO2023047702A5 JPWO2023047702A5 JP2023549366A JP2023549366A JPWO2023047702A5 JP WO2023047702 A5 JPWO2023047702 A5 JP WO2023047702A5 JP 2023549366 A JP2023549366 A JP 2023549366A JP 2023549366 A JP2023549366 A JP 2023549366A JP WO2023047702 A5 JPWO2023047702 A5 JP WO2023047702A5
- Authority
- JP
- Japan
- Prior art keywords
- compression molding
- molding material
- material according
- liquid compression
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000748 compression moulding Methods 0.000 claims 13
- 239000007788 liquid Substances 0.000 claims 13
- 239000012778 molding material Substances 0.000 claims 12
- 239000003822 epoxy resin Substances 0.000 claims 8
- 229920000647 polyepoxide Polymers 0.000 claims 8
- 239000000945 filler Substances 0.000 claims 5
- 239000000203 mixture Substances 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 229920001971 elastomer Polymers 0.000 claims 4
- 239000000806 elastomer Substances 0.000 claims 4
- 238000002156 mixing Methods 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- 239000004844 aliphatic epoxy resin Substances 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- -1 nitrogen-containing heterocyclic compound Chemical class 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021154478 | 2021-09-22 | ||
| PCT/JP2022/021246 WO2023047702A1 (ja) | 2021-09-22 | 2022-05-24 | 液状コンプレッションモールド材、電子部品、半導体装置、および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023047702A1 JPWO2023047702A1 (https=) | 2023-03-30 |
| JPWO2023047702A5 true JPWO2023047702A5 (https=) | 2024-10-15 |
Family
ID=85720383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023549366A Pending JPWO2023047702A1 (https=) | 2021-09-22 | 2022-05-24 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250178245A1 (https=) |
| EP (1) | EP4407673A4 (https=) |
| JP (1) | JPWO2023047702A1 (https=) |
| KR (1) | KR20240058048A (https=) |
| CN (1) | CN117461127A (https=) |
| TW (1) | TWI912528B (https=) |
| WO (1) | WO2023047702A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250162492A (ko) * | 2023-03-28 | 2025-11-18 | 나믹스 가부시끼가이샤 | 에폭시 수지 조성물, 전자 부품, 반도체 장치, 반도체 장치의 제조 방법 |
| JP7671555B1 (ja) * | 2023-11-24 | 2025-05-02 | ナミックス株式会社 | 半導体装置の製造方法及び封止体 |
| WO2025109864A1 (ja) * | 2023-11-24 | 2025-05-30 | ナミックス株式会社 | 半導体装置の製造方法及び封止体 |
| WO2026034370A1 (ja) * | 2024-08-07 | 2026-02-12 | ナミックス株式会社 | エポキシ樹脂組成物、硬化物、及び半導体装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008274083A (ja) * | 2007-04-27 | 2008-11-13 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
| JP2009155431A (ja) * | 2007-12-26 | 2009-07-16 | Sumitomo Bakelite Co Ltd | 液状封止樹脂組成物、半導体装置および半導体装置の製造方法 |
| JP2015166403A (ja) * | 2012-06-29 | 2015-09-24 | 太陽ホールディングス株式会社 | 熱硬化型樹脂組成物および熱硬化型樹脂フィルム |
| JP6456027B2 (ja) * | 2013-03-27 | 2019-01-23 | 日東電工株式会社 | 封止シート、封止シートの製造方法及び電子部品パッケージの製造方法 |
| JP6196138B2 (ja) | 2013-11-29 | 2017-09-13 | ナミックス株式会社 | 半導体封止剤および半導体装置 |
| JP6749887B2 (ja) * | 2015-02-26 | 2020-09-02 | 日立化成株式会社 | 封止用フィルム及びそれを用いた電子部品装置 |
| CN108137793B (zh) * | 2015-08-03 | 2021-12-24 | 昭和电工材料株式会社 | 环氧树脂组合物、膜状环氧树脂组合物及电子装置 |
| EP3620481B1 (en) | 2017-05-31 | 2024-03-27 | Resonac Corporation | Liquid resin composition for sealing and electronic component apparatus |
| US12454612B2 (en) * | 2017-05-31 | 2025-10-28 | Resonac Corporation | Liquid resin composition for compression molding and electronic component apparatus |
| JP7424743B2 (ja) * | 2018-09-04 | 2024-01-30 | 味の素株式会社 | 樹脂組成物、樹脂インク、樹脂インク層、樹脂シート及び半導体チップパッケージ |
| CN111763403A (zh) * | 2020-07-15 | 2020-10-13 | 深圳先进电子材料国际创新研究院 | 一种液体环氧树脂组合物及其制备方法和应用 |
-
2022
- 2022-05-24 WO PCT/JP2022/021246 patent/WO2023047702A1/ja not_active Ceased
- 2022-05-24 CN CN202280041249.XA patent/CN117461127A/zh active Pending
- 2022-05-24 JP JP2023549366A patent/JPWO2023047702A1/ja active Pending
- 2022-05-24 EP EP22872460.5A patent/EP4407673A4/en active Pending
- 2022-05-24 KR KR1020237041986A patent/KR20240058048A/ko active Pending
- 2022-05-24 US US18/291,755 patent/US20250178245A1/en active Pending
- 2022-05-27 TW TW111119826A patent/TWI912528B/zh active
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