PT3620481T - Composição de resina líquida para selagem e dispositivo de componentes eletrónicos - Google Patents

Composição de resina líquida para selagem e dispositivo de componentes eletrónicos

Info

Publication number
PT3620481T
PT3620481T PT188092993T PT18809299T PT3620481T PT 3620481 T PT3620481 T PT 3620481T PT 188092993 T PT188092993 T PT 188092993T PT 18809299 T PT18809299 T PT 18809299T PT 3620481 T PT3620481 T PT 3620481T
Authority
PT
Portugal
Prior art keywords
sealing
resin composition
electronic component
liquid resin
component device
Prior art date
Application number
PT188092993T
Other languages
English (en)
Original Assignee
Namics Corp
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp, Resonac Corp filed Critical Namics Corp
Publication of PT3620481T publication Critical patent/PT3620481T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1025—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by non-chemical features of one or more of its constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0243—Silica-rich compounds, e.g. silicates, cement, glass
    • C09K2200/0247—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Details Of Resistors (AREA)
PT188092993T 2017-05-31 2018-05-31 Composição de resina líquida para selagem e dispositivo de componentes eletrónicos PT3620481T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017108715 2017-05-31

Publications (1)

Publication Number Publication Date
PT3620481T true PT3620481T (pt) 2024-04-08

Family

ID=64454806

Family Applications (1)

Application Number Title Priority Date Filing Date
PT188092993T PT3620481T (pt) 2017-05-31 2018-05-31 Composição de resina líquida para selagem e dispositivo de componentes eletrónicos

Country Status (8)

Country Link
US (1) US20200194325A1 (pt)
EP (1) EP3620481B1 (pt)
JP (2) JP7148507B2 (pt)
KR (1) KR20200015584A (pt)
CN (1) CN110785451A (pt)
PT (1) PT3620481T (pt)
TW (1) TWI786121B (pt)
WO (1) WO2018221681A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7302496B2 (ja) 2020-02-05 2023-07-04 味の素株式会社 樹脂組成物
WO2021261064A1 (ja) 2020-06-23 2021-12-30 ナミックス株式会社 液状コンプレッションモールド材
CN116390967A (zh) * 2020-10-21 2023-07-04 松下知识产权经营株式会社 液态树脂组合物及其固化物
KR20240058048A (ko) 2021-09-22 2024-05-03 나믹스 가부시끼가이샤 액상 컴프레션 몰드재, 전자 부품, 반도체 장치, 및 반도체 장치의 제조 방법
WO2023062877A1 (ja) 2021-10-13 2023-04-20 ナミックス株式会社 液状封止剤、電子部品及びその製造方法、並びに半導体装置
WO2024075343A1 (ja) * 2022-10-07 2024-04-11 ナミックス株式会社 エポキシ樹脂組成物、半導体装置、及び半導体装置の製造方法
WO2024134951A1 (ja) * 2022-12-23 2024-06-27 ナミックス株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置

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JP4577536B2 (ja) * 1998-12-28 2010-11-10 ナガセケムテックス株式会社 エポキシ樹脂組成物およびそれを用いてｌｓｉを封止する方法
JP5000053B2 (ja) * 2001-09-05 2012-08-15 三菱化学株式会社 液状エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP4047613B2 (ja) * 2002-03-29 2008-02-13 住友ベークライト株式会社 液状封止樹脂及びそれを用いた半導体装置
JP2003335923A (ja) * 2002-05-21 2003-11-28 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及び半導体装置
JP2006176678A (ja) 2004-12-22 2006-07-06 Matsushita Electric Works Ltd エポキシ樹脂組成物及び電子部品
JP5217119B2 (ja) 2005-06-15 2013-06-19 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP2007138002A (ja) * 2005-11-17 2007-06-07 Yokohama Rubber Co Ltd:The 熱硬化性樹脂組成物
JP5692212B2 (ja) * 2005-12-08 2015-04-01 日立化成株式会社 電子部品用液状樹脂組成物及びこれを用いた電子部品装置
JP2007182562A (ja) * 2005-12-08 2007-07-19 Hitachi Chem Co Ltd 電子部品用液状樹脂組成物及び電子部品装置
US20080039555A1 (en) * 2006-08-10 2008-02-14 Michel Ruyters Thermally conductive material
JP5374818B2 (ja) 2006-12-20 2013-12-25 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP5210011B2 (ja) * 2008-03-18 2013-06-12 積水化学工業株式会社 電子部品用接着剤
JP5574237B2 (ja) * 2008-05-21 2014-08-20 ナガセケムテックス株式会社 電子部品封止用エポキシ樹脂組成物
JP5629168B2 (ja) * 2010-09-10 2014-11-19 積水化学工業株式会社 半導体チップ実装体の製造方法及び半導体装置
JP5617495B2 (ja) * 2010-09-29 2014-11-05 住友ベークライト株式会社 半導体装置の製造方法及び半導体装置
JP2012077129A (ja) * 2010-09-30 2012-04-19 Namics Corp 樹脂組成物、および、それを用いた封止材
JP2012162585A (ja) 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
JP2013155363A (ja) * 2012-02-01 2013-08-15 Shin-Etsu Chemical Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP6125262B2 (ja) 2013-02-13 2017-05-10 ナミックス株式会社 液状モールド剤、および液状モールド剤の製造方法
JP6222428B2 (ja) * 2013-07-05 2017-11-01 ナガセケムテックス株式会社 エポキシ樹脂組成物
JP6460365B2 (ja) * 2014-03-14 2019-01-30 Dic株式会社 樹脂組成物、熱伝導性接着剤及び積層体
JP6331570B2 (ja) * 2014-03-28 2018-05-30 日立化成株式会社 アンダーフィル材及び該アンダーフィル材により封止する電子部品とその製造方法
CN105778409A (zh) * 2014-12-18 2016-07-20 北京首科化微电子有限公司 半导体封装用的环氧树脂组合物及其制备方法
JP6539150B2 (ja) * 2015-08-17 2019-07-03 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP6586005B2 (ja) 2015-12-18 2019-10-02 グローブライド株式会社 魚釣用スピニングリール
JP2020029494A (ja) * 2018-08-21 2020-02-27 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置

Also Published As

Publication number Publication date
JPWO2018221681A1 (ja) 2020-07-09
EP3620481A4 (en) 2020-12-09
JP7148507B2 (ja) 2022-10-05
JP2022179534A (ja) 2022-12-02
WO2018221681A1 (ja) 2018-12-06
KR20200015584A (ko) 2020-02-12
TWI786121B (zh) 2022-12-11
EP3620481B1 (en) 2024-03-27
TW201902974A (zh) 2019-01-16
US20200194325A1 (en) 2020-06-18
CN110785451A (zh) 2020-02-11
EP3620481A1 (en) 2020-03-11

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