HK1255708A1 - 電子組件容納裝置和電子設備 - Google Patents

電子組件容納裝置和電子設備

Info

Publication number
HK1255708A1
HK1255708A1 HK18114858.2A HK18114858A HK1255708A1 HK 1255708 A1 HK1255708 A1 HK 1255708A1 HK 18114858 A HK18114858 A HK 18114858A HK 1255708 A1 HK1255708 A1 HK 1255708A1
Authority
HK
Hong Kong
Prior art keywords
component housing
housing apparatus
electronic device
electronic
electronic component
Prior art date
Application number
HK18114858.2A
Other languages
English (en)
Inventor
村上勝弘
增田則夫
Original Assignee
Nec網絡傳感器系統株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec網絡傳感器系統株式會社 filed Critical Nec網絡傳感器系統株式會社
Publication of HK1255708A1 publication Critical patent/HK1255708A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/023—Handles; Grips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK18114858.2A 2015-12-02 2018-11-21 電子組件容納裝置和電子設備 HK1255708A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015235363 2015-12-02
PCT/JP2016/085669 WO2017094814A1 (ja) 2015-12-02 2016-12-01 電子部品収容機器および電子装置

Publications (1)

Publication Number Publication Date
HK1255708A1 true HK1255708A1 (zh) 2019-08-23

Family

ID=58796988

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18114858.2A HK1255708A1 (zh) 2015-12-02 2018-11-21 電子組件容納裝置和電子設備

Country Status (7)

Country Link
US (2) US10506742B2 (zh)
EP (1) EP3386285B1 (zh)
JP (1) JP6989386B2 (zh)
KR (1) KR102050680B1 (zh)
CN (1) CN108432357B (zh)
HK (1) HK1255708A1 (zh)
WO (1) WO2017094814A1 (zh)

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* Cited by examiner, † Cited by third party
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CN108432357B (zh) * 2015-12-02 2020-03-27 Nec网络传感器系统株式会社 电子组件容纳装置和电子设备
JP6941005B2 (ja) * 2017-08-24 2021-09-29 株式会社三社電機製作所 電気機器
US10636725B2 (en) * 2017-12-19 2020-04-28 Veoneer Us Inc. Electrical module cooling through waste heat recovery
JP2020123655A (ja) * 2019-01-30 2020-08-13 ヤマハ株式会社 電子機器
US11267354B2 (en) * 2019-08-16 2022-03-08 DESIGNWERK TECHNOLOGIES GmbH Power supply
CN218102609U (zh) * 2019-09-17 2022-12-20 米沃奇电动工具公司 充电器、场地灯以及电源适配器组件
US11340571B2 (en) * 2020-02-11 2022-05-24 Dell Products L.P. System with retrofit enhancement of an ultra dense thermally challenged server
CN113851780A (zh) * 2020-06-10 2021-12-28 华为数字能源技术有限公司 电池、电动车和电子设备
CN214240677U (zh) * 2020-09-16 2021-09-21 深圳市英维克信息技术有限公司 新能源车及其电控盒
USD1033372S1 (en) * 2022-05-30 2024-07-02 Beijing Tusen Zhitu Technology Co., Ltd. Electronic controller
USD1046843S1 (en) * 2022-09-06 2024-10-15 Bitmain Technologies Inc. Data processor

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US5905647A (en) * 1997-01-20 1999-05-18 Kabushiki Kaisha Toshiba Inverter with incorporated filter circuit and improved component cooling arrangement
US5831847A (en) * 1997-02-05 1998-11-03 Jerome Industries Corp. Power supply with separated airflows
ATE235799T1 (de) * 1999-06-01 2003-04-15 Volker Dalheimer Gehäuseanordnung zur aufnahme elektronischer baugruppen, insbesondere flaches desktop-pc- oder multimedia-gehäuse
US6653787B2 (en) 2002-03-05 2003-11-25 L-3 Communications Corporation High power density multistage depressed collector
JP4269632B2 (ja) 2002-10-15 2009-05-27 パナソニック電工株式会社 電子回路モジュール
JP2004179308A (ja) 2002-11-26 2004-06-24 Hitachi Kokusai Electric Inc 電子機器
GB2411050A (en) * 2004-02-16 2005-08-17 E2V Tech Uk Ltd Electrical apparatus cooling system
JP2005341630A (ja) * 2004-05-24 2005-12-08 Mitsubishi Electric Corp 電力変換装置
FR2881018B1 (fr) * 2005-01-19 2007-04-06 Intelligent Electronic Systems Procede de refroidissement d'un dispositif de conversion statique d'electronique de puissance et dispositif correspondant
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JP5034316B2 (ja) 2006-05-22 2012-09-26 トヨタ自動車株式会社 電源装置
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US7929301B2 (en) * 2008-11-03 2011-04-19 Microsoft Corporation Splash resistant power adapter
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JP5827513B2 (ja) * 2011-07-25 2015-12-02 株式会社アイ・ライティング・システム スイッチング電源装置
CN103049045B (zh) * 2011-10-17 2015-11-18 华硕电脑股份有限公司 主机板模块及应用该主机板模块的电子装置
WO2014132591A1 (ja) * 2013-02-26 2014-09-04 日本電気株式会社 電子装置および冷却装置
WO2014147963A1 (ja) 2013-03-19 2014-09-25 富士電機株式会社 冷却装置及びこれを備えた電力変換装置
EP2978291A4 (en) * 2013-03-19 2016-11-02 Fuji Electric Co Ltd ELECTRONIC DEVICE COOLING APPARATUS AND POWER CONVERTING APPARATUS HAVING THE SAME
JP6225477B2 (ja) * 2013-05-16 2017-11-08 富士通株式会社 電子機器
KR20150025755A (ko) * 2013-08-30 2015-03-11 엘에스산전 주식회사 인버터 냉각장치
CN104679163A (zh) * 2013-11-30 2015-06-03 鸿富锦精密工业（深圳）有限公司 电子设备机箱
US10076062B2 (en) * 2014-05-30 2018-09-11 Nicholas Heath Wright Audio amplifier
CN108432357B (zh) * 2015-12-02 2020-03-27 Nec网络传感器系统株式会社 电子组件容纳装置和电子设备
CN206195593U (zh) 2016-10-31 2017-05-24 湖南沃森电气科技有限公司 一种变频器散热结构

Also Published As

Publication number Publication date
JPWO2017094814A1 (ja) 2018-09-20
US20200060046A1 (en) 2020-02-20
US10856445B2 (en) 2020-12-01
CN108432357A (zh) 2018-08-21
US10506742B2 (en) 2019-12-10
KR102050680B1 (ko) 2019-11-29
EP3386285A1 (en) 2018-10-10
WO2017094814A1 (ja) 2017-06-08
US20180324981A1 (en) 2018-11-08
CN108432357B (zh) 2020-03-27
EP3386285A4 (en) 2019-08-28
KR20180081542A (ko) 2018-07-16
EP3386285B1 (en) 2021-07-07
JP6989386B2 (ja) 2022-01-05

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