SG10201603175QA - Sealing resin sheet and electronic device apparatus - Google Patents
Sealing resin sheet and electronic device apparatusInfo
- Publication number
- SG10201603175QA SG10201603175QA SG10201603175QA SG10201603175QA SG10201603175QA SG 10201603175Q A SG10201603175Q A SG 10201603175QA SG 10201603175Q A SG10201603175Q A SG 10201603175QA SG 10201603175Q A SG10201603175Q A SG 10201603175QA SG 10201603175Q A SG10201603175Q A SG 10201603175QA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic device
- resin sheet
- sealing resin
- device apparatus
- sealing
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015089190A JP6646360B2 (en) | 2015-04-24 | 2015-04-24 | Sealing resin sheet and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201603175QA true SG10201603175QA (en) | 2016-11-29 |
Family
ID=57400160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201603175QA SG10201603175QA (en) | 2015-04-24 | 2016-04-21 | Sealing resin sheet and electronic device apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6646360B2 (en) |
CN (1) | CN106065243A (en) |
SG (1) | SG10201603175QA (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018104649A (en) * | 2016-12-28 | 2018-07-05 | 日東電工株式会社 | Resin sheet |
JP7087372B2 (en) * | 2017-12-19 | 2022-06-21 | 日本ゼオン株式会社 | Heat conduction sheet and its manufacturing method |
WO2019131097A1 (en) * | 2017-12-28 | 2019-07-04 | 日立化成株式会社 | Encapsulating epoxy resin composition for ball grid array package, cured epoxy resin object, and electronic component/device |
JP7158184B2 (en) * | 2018-06-28 | 2022-10-21 | 日東電工株式会社 | Sealing sheet and method for producing electronic element device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5134824B2 (en) * | 2007-02-05 | 2013-01-30 | 日東電工株式会社 | Resin molded product manufacturing method |
JP2012067205A (en) * | 2010-09-24 | 2012-04-05 | Hitachi Chemical Co Ltd | High heat radiation insulating resin sheet and method of manufacturing the same |
JP2013006893A (en) * | 2011-06-22 | 2013-01-10 | Hitachi Chemical Co Ltd | High thermal conductivity resin composition, high thermal conductivity cured product, adhesive film, sealing film, and semiconductor device using them |
JP6102744B2 (en) * | 2011-11-02 | 2017-03-29 | 日立化成株式会社 | Resin composition, and resin sheet, prepreg, laminate, metal substrate, printed wiring board and power semiconductor device using the same |
KR20160006801A (en) * | 2012-03-07 | 2016-01-19 | 린텍 코포레이션 | Sheet for forming resin film for chips |
US20150037575A1 (en) * | 2012-03-30 | 2015-02-05 | Showa Denko K.K. | Curable heat radiation composition |
JP2014059340A (en) * | 2012-09-14 | 2014-04-03 | Canon Inc | Imaging apparatus |
JP2014091199A (en) * | 2012-11-06 | 2014-05-19 | Komatsu Ntc Ltd | Work clamp device |
JP2016155985A (en) * | 2015-02-26 | 2016-09-01 | 日立化成株式会社 | Epoxy resin composition, semi-cured epoxy resin composition and cured epoxy resin composition, and resin sheet, prepreg, laminate sheet, metal substrate, wiring board and power semiconductor device, using these |
-
2015
- 2015-04-24 JP JP2015089190A patent/JP6646360B2/en active Active
-
2016
- 2016-04-21 CN CN201610250872.2A patent/CN106065243A/en active Pending
- 2016-04-21 SG SG10201603175QA patent/SG10201603175QA/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN106065243A (en) | 2016-11-02 |
JP6646360B2 (en) | 2020-02-14 |
JP2016204545A (en) | 2016-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL276708A (en) | Electronic vaping device and components thereof | |
IL261296B (en) | Electronic vaping device | |
IL251279A0 (en) | Electronic vaping device and components thereof | |
IL251127A0 (en) | Electronic vaping device and components thereof | |
EP3439492C0 (en) | Electronic vaping device | |
EP4009618C0 (en) | Electronic device | |
EP3489723A4 (en) | Detection device and electronic apparatus | |
HK1244351A1 (en) | Electronic device | |
EP3050135A4 (en) | Apparatus and techniques for electronic device encapsulation | |
EP3218787A4 (en) | Image forming apparatus and electronic device | |
GB2555526B (en) | Electronic apparatus | |
HK1255708A1 (en) | Electronic component housing apparatus and electronic device | |
SG11201609273UA (en) | Electronic device and method | |
GB201612114D0 (en) | Input device and electronic apparatus | |
SG10201703315TA (en) | Motor and electronic apparatus including motor | |
HK1251352A1 (en) | Electronic device | |
HK1224083A1 (en) | Composite resin and electronic device | |
HK1250533A1 (en) | Electronic device and projector | |
GB201711531D0 (en) | Electronic device and electronic apparatus | |
HK1252139A1 (en) | Electronic device | |
GB2559948B (en) | Electronic device retaining apparatus | |
EP3220718A4 (en) | Sealing sheet, member for electronic devices, and electronic device | |
HK1252632A1 (en) | Electronic device | |
SG10201603175QA (en) | Sealing resin sheet and electronic device apparatus | |
GB2546881B (en) | Assembly and electronic device |