SG10201603175QA - Sealing resin sheet and electronic device apparatus - Google Patents

Sealing resin sheet and electronic device apparatus

Info

Publication number
SG10201603175QA
SG10201603175QA SG10201603175QA SG10201603175QA SG10201603175QA SG 10201603175Q A SG10201603175Q A SG 10201603175QA SG 10201603175Q A SG10201603175Q A SG 10201603175QA SG 10201603175Q A SG10201603175Q A SG 10201603175QA SG 10201603175Q A SG10201603175Q A SG 10201603175QA
Authority
SG
Singapore
Prior art keywords
electronic device
resin sheet
sealing resin
device apparatus
sealing
Prior art date
Application number
SG10201603175QA
Inventor
Toyoda Eiji
Masuda Shotaro
Habu Takashi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG10201603175QA publication Critical patent/SG10201603175QA/en

Links

SG10201603175QA 2015-04-24 2016-04-21 Sealing resin sheet and electronic device apparatus SG10201603175QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015089190A JP6646360B2 (en) 2015-04-24 2015-04-24 Sealing resin sheet and electronic device

Publications (1)

Publication Number Publication Date
SG10201603175QA true SG10201603175QA (en) 2016-11-29

Family

ID=57400160

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201603175QA SG10201603175QA (en) 2015-04-24 2016-04-21 Sealing resin sheet and electronic device apparatus

Country Status (3)

Country Link
JP (1) JP6646360B2 (en)
CN (1) CN106065243A (en)
SG (1) SG10201603175QA (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018104649A (en) * 2016-12-28 2018-07-05 日東電工株式会社 Resin sheet
JP7087372B2 (en) * 2017-12-19 2022-06-21 日本ゼオン株式会社 Heat conduction sheet and its manufacturing method
WO2019131097A1 (en) * 2017-12-28 2019-07-04 日立化成株式会社 Encapsulating epoxy resin composition for ball grid array package, cured epoxy resin object, and electronic component/device
JP7158184B2 (en) * 2018-06-28 2022-10-21 日東電工株式会社 Sealing sheet and method for producing electronic element device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134824B2 (en) * 2007-02-05 2013-01-30 日東電工株式会社 Resin molded product manufacturing method
JP2012067205A (en) * 2010-09-24 2012-04-05 Hitachi Chemical Co Ltd High heat radiation insulating resin sheet and method of manufacturing the same
JP2013006893A (en) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd High thermal conductivity resin composition, high thermal conductivity cured product, adhesive film, sealing film, and semiconductor device using them
JP6102744B2 (en) * 2011-11-02 2017-03-29 日立化成株式会社 Resin composition, and resin sheet, prepreg, laminate, metal substrate, printed wiring board and power semiconductor device using the same
KR20160006801A (en) * 2012-03-07 2016-01-19 린텍 코포레이션 Sheet for forming resin film for chips
US20150037575A1 (en) * 2012-03-30 2015-02-05 Showa Denko K.K. Curable heat radiation composition
JP2014059340A (en) * 2012-09-14 2014-04-03 Canon Inc Imaging apparatus
JP2014091199A (en) * 2012-11-06 2014-05-19 Komatsu Ntc Ltd Work clamp device
JP2016155985A (en) * 2015-02-26 2016-09-01 日立化成株式会社 Epoxy resin composition, semi-cured epoxy resin composition and cured epoxy resin composition, and resin sheet, prepreg, laminate sheet, metal substrate, wiring board and power semiconductor device, using these

Also Published As

Publication number Publication date
CN106065243A (en) 2016-11-02
JP6646360B2 (en) 2020-02-14
JP2016204545A (en) 2016-12-08

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