JP6102744B2 - Resin composition, and resin sheet, prepreg, laminate, metal substrate, printed wiring board and power semiconductor device using the same - Google Patents

Resin composition, and resin sheet, prepreg, laminate, metal substrate, printed wiring board and power semiconductor device using the same Download PDF

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Publication number
JP6102744B2
JP6102744B2 JP2013541828A JP2013541828A JP6102744B2 JP 6102744 B2 JP6102744 B2 JP 6102744B2 JP 2013541828 A JP2013541828 A JP 2013541828A JP 2013541828 A JP2013541828 A JP 2013541828A JP 6102744 B2 JP6102744 B2 JP 6102744B2
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resin composition
resin
cured
volume
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JP2013541828A
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JPWO2013065758A1 (en
Inventor
優香 吉田
優香 吉田
竹澤 由高
由高 竹澤
靖夫 宮崎
靖夫 宮崎
高橋 裕之
裕之 高橋
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日立化成株式会社
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Priority to PCT/JP2011/075345 priority Critical patent/WO2013065159A1/en
Priority to JPPCT/JP2011/075345 priority
Priority to JP2012090473 priority
Priority to JP2012090473 priority
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to PCT/JP2012/078222 priority patent/WO2013065758A1/en
Publication of JPWO2013065758A1 publication Critical patent/JPWO2013065758A1/en
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Publication of JP6102744B2 publication Critical patent/JP6102744B2/en
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