PT3121651T - Composição de resina sensível a radiação e componente eletrónica - Google Patents

Composição de resina sensível a radiação e componente eletrónica

Info

Publication number
PT3121651T
PT3121651T PT15764394T PT15764394T PT3121651T PT 3121651 T PT3121651 T PT 3121651T PT 15764394 T PT15764394 T PT 15764394T PT 15764394 T PT15764394 T PT 15764394T PT 3121651 T PT3121651 T PT 3121651T
Authority
PT
Portugal
Prior art keywords
radiation
resin composition
electronic component
sensitive resin
sensitive
Prior art date
Application number
PT15764394T
Other languages
English (en)
Inventor
Tsutsumi Takashi
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Publication of PT3121651T publication Critical patent/PT3121651T/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Resins (AREA)
PT15764394T 2014-03-20 2015-03-18 Composição de resina sensível a radiação e componente eletrónica PT3121651T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014058522 2014-03-20

Publications (1)

Publication Number Publication Date
PT3121651T true PT3121651T (pt) 2019-07-17

Family

ID=54144681

Family Applications (1)

Application Number Title Priority Date Filing Date
PT15764394T PT3121651T (pt) 2014-03-20 2015-03-18 Composição de resina sensível a radiação e componente eletrónica

Country Status (8)

Country Link
US (1) US10025182B2 (pt)
EP (1) EP3121651B1 (pt)
JP (1) JP6471745B2 (pt)
KR (1) KR102381904B1 (pt)
CN (1) CN106104380B (pt)
PT (1) PT3121651T (pt)
TW (1) TWI662363B (pt)
WO (1) WO2015141717A1 (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6844115B2 (ja) * 2016-03-28 2021-03-17 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
US20190079396A1 (en) 2016-03-28 2019-03-14 Zeon Corporation Radiation sensitive resin composition and electronic component
JP6825217B2 (ja) * 2016-03-28 2021-02-03 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
WO2017195548A1 (ja) * 2016-05-12 2017-11-16 株式会社ダイセル ナノインプリント用光硬化性組成物、及び光学部品の製造方法
JP7102691B2 (ja) * 2016-09-05 2022-07-20 荒川化学工業株式会社 フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板
JP6907773B2 (ja) * 2016-09-05 2021-07-21 住友ベークライト株式会社 エポキシ樹脂組成物および半導体装置
KR102473325B1 (ko) 2017-03-30 2022-12-01 니폰 제온 가부시키가이샤 감방사선 수지 조성물 및 전자 부품
JP2018189738A (ja) * 2017-04-28 2018-11-29 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ ポジ型感光性シロキサン組成物、およびそれを用いて形成した硬化膜
CN109581814A (zh) * 2017-09-29 2019-04-05 互耐普勒斯有限公司 低温固化型感光树脂组合物
KR20190087173A (ko) * 2018-01-16 2019-07-24 동우 화인켐 주식회사 네가티브형 감광성 수지 조성물
JP7512889B2 (ja) * 2018-03-30 2024-07-09 日本ゼオン株式会社 樹脂組成物及び電子部品
JP7490932B2 (ja) * 2019-07-31 2024-05-28 住友ベークライト株式会社 硬化性樹脂組成物および電子デバイスの製造方法
CN115895313B (zh) * 2021-09-30 2024-05-10 新应材股份有限公司 树脂组合物以及硬化膜

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3473990B2 (ja) * 1993-06-22 2003-12-08 昭和電工株式会社 プロピレン系重合体組成物
US6200479B1 (en) * 1997-01-14 2001-03-13 Shipley Company, L.L.C. Phenolic resin purification
JP3960055B2 (ja) 2002-01-23 2007-08-15 Ｊｓｒ株式会社 感光性絶縁樹脂組成物およびその硬化物
JP4397601B2 (ja) 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物
TW200604226A (en) * 2004-03-31 2006-02-01 Zeon Corp Radiation-sensitive composition, multilayer body and method for producing same, and electronic component
JP2005290299A (ja) * 2004-04-02 2005-10-20 Nippon Kayaku Co Ltd 自己重合型光重合性化合物及びそれを用いた感光性樹脂組成物
JP4412136B2 (ja) * 2004-09-29 2010-02-10 住友ベークライト株式会社 半導体表面保護膜用樹脂組成物、及びそれを用いた半導体装置
JP4633500B2 (ja) 2005-03-01 2011-02-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4662793B2 (ja) 2005-03-01 2011-03-30 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4640037B2 (ja) 2005-08-22 2011-03-02 Ｊｓｒ株式会社 ポジ型感光性絶縁樹脂組成物およびその硬化物
CN101233165B (zh) * 2005-08-31 2011-08-31 宇部兴产株式会社 低软化点线型酚醛清漆树脂及其制造方法以及使用其的环氧树脂固化物
JP2007078820A (ja) * 2005-09-12 2007-03-29 Sumitomo Bakelite Co Ltd 感光性樹脂組成物、それを用いた半導体装置、表示素子
KR101148051B1 (ko) * 2005-12-26 2012-05-25 에스케이케미칼주식회사 에폭시 수지 조성물
US20080292993A1 (en) * 2006-12-22 2008-11-27 Canon Kabushiki Kaisha Photo-cationic polymerizable epoxy resin composition, liquid discharge head, and manufacturing method thereof
JP4821602B2 (ja) * 2006-12-27 2011-11-24 Ｊｓｒ株式会社 ネガ型感光性絶縁樹脂組成物およびその硬化物
JP2009258471A (ja) * 2008-04-18 2009-11-05 Toray Ind Inc 感光性樹脂組成物フィルムおよびそれを用いたレジスト形成方法
WO2009133843A1 (ja) * 2008-04-28 2009-11-05 日本ゼオン株式会社 感放射線樹脂組成物、積層体及びその製造方法ならびに半導体デバイス
JP2010100678A (ja) * 2008-10-21 2010-05-06 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP5617275B2 (ja) 2009-02-26 2014-11-05 日本ゼオン株式会社 感放射線性樹脂組成物、樹脂膜、積層体及び電子部品
JP5377020B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5561271B2 (ja) * 2009-03-26 2014-07-30 日本ゼオン株式会社 樹脂組成物、樹脂膜及び電子部品
JPWO2010119647A1 (ja) 2009-04-14 2012-10-22 住友ベークライト株式会社 感光性樹脂組成物、接着フィルムおよび受光装置
JP5413097B2 (ja) * 2009-09-29 2014-02-12 日本ゼオン株式会社 感放射線性樹脂組成物、及び積層体
JP2012181371A (ja) * 2011-03-01 2012-09-20 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
WO2012165448A1 (ja) 2011-06-01 2012-12-06 日本ゼオン株式会社 樹脂組成物および半導体素子基板
JP2013130816A (ja) * 2011-12-22 2013-07-04 Nippon Zeon Co Ltd 永久膜用樹脂組成物及び電子部品
JP5688116B2 (ja) * 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Also Published As

Publication number Publication date
CN106104380A (zh) 2016-11-09
KR102381904B1 (ko) 2022-03-31
US20170023859A1 (en) 2017-01-26
WO2015141717A1 (ja) 2015-09-24
TWI662363B (zh) 2019-06-11
JPWO2015141717A1 (ja) 2017-04-13
EP3121651A4 (en) 2017-10-11
US10025182B2 (en) 2018-07-17
KR20160135122A (ko) 2016-11-24
JP6471745B2 (ja) 2019-02-20
CN106104380B (zh) 2020-03-06
EP3121651A1 (en) 2017-01-25
EP3121651B1 (en) 2019-05-15
TW201543154A (zh) 2015-11-16

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