SG11201701852VA - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- SG11201701852VA SG11201701852VA SG11201701852VA SG11201701852VA SG11201701852VA SG 11201701852V A SG11201701852V A SG 11201701852VA SG 11201701852V A SG11201701852V A SG 11201701852VA SG 11201701852V A SG11201701852V A SG 11201701852VA SG 11201701852V A SG11201701852V A SG 11201701852VA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- thermosetting resin
- thermosetting
- composition
- resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
- C07D491/02—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains two hetero rings
- C07D491/10—Spiro-condensed systems
- C07D491/113—Spiro-condensed systems with two or more oxygen atoms as ring hetero atoms in the oxygen-containing ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014185246 | 2014-09-11 | ||
| JP2015031753 | 2015-02-20 | ||
| JP2015035480 | 2015-02-25 | ||
| JP2015150407 | 2015-07-30 | ||
| PCT/JP2015/076205 WO2016039486A1 (en) | 2014-09-11 | 2015-09-09 | Thermosetting resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201701852VA true SG11201701852VA (en) | 2017-04-27 |
Family
ID=55459222
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201903565YA SG10201903565YA (en) | 2014-09-11 | 2015-09-09 | Thermosetting resin composition |
| SG11201701852VA SG11201701852VA (en) | 2014-09-11 | 2015-09-09 | Thermosetting resin composition |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201903565YA SG10201903565YA (en) | 2014-09-11 | 2015-09-09 | Thermosetting resin composition |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US20170253693A1 (en) |
| EP (1) | EP3192834B1 (en) |
| JP (1) | JP6461170B2 (en) |
| KR (1) | KR102393692B1 (en) |
| CN (1) | CN106715578B (en) |
| MY (1) | MY179663A (en) |
| PH (1) | PH12017500465A1 (en) |
| SG (2) | SG10201903565YA (en) |
| TW (1) | TWI667281B (en) |
| WO (1) | WO2016039486A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017031402A (en) * | 2015-08-04 | 2017-02-09 | 信越化学工業株式会社 | Thermosetting epoxy resin composition |
| JP6686457B2 (en) * | 2016-01-15 | 2020-04-22 | 住友ベークライト株式会社 | Sealing resin composition and electronic device |
| JP6766360B2 (en) * | 2016-01-15 | 2020-10-14 | 住友ベークライト株式会社 | Resin composition |
| JP2017160427A (en) * | 2016-03-04 | 2017-09-14 | 京セラ株式会社 | Resin composition for sealing and semiconductor device |
| WO2017168732A1 (en) * | 2016-03-31 | 2017-10-05 | 日立化成株式会社 | Resin composition, prepreg, resin sheet and laminate |
| JP6642342B2 (en) * | 2016-09-02 | 2020-02-05 | 信越化学工業株式会社 | Thermosetting epoxy resin composition |
| JP6947468B2 (en) | 2017-08-28 | 2021-10-13 | 日清紡ケミカル株式会社 | Polycarbodiimide compound and thermosetting resin composition |
| US20200317913A1 (en) * | 2017-12-22 | 2020-10-08 | Teijin Limited | Thermosetting resin composition |
| WO2019138919A1 (en) * | 2018-01-15 | 2019-07-18 | 日立化成株式会社 | Liquid sealing resin composition, electronic component device, and method for manufacturing electronic component device |
| TWI803657B (en) * | 2018-08-09 | 2023-06-01 | 日商三菱瓦斯化學股份有限公司 | Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board |
| KR102257926B1 (en) * | 2018-09-20 | 2021-05-28 | 주식회사 엘지화학 | Multilayered printed circuit board, method for manufacturing the same, and semiconductor device using the same |
| CN109762436B (en) * | 2018-12-12 | 2021-04-13 | 苏州太湖电工新材料股份有限公司 | Low-temperature-resistant heat-conducting insulating resin paint suitable for superconducting insulating material and preparation method and application thereof |
| TW202344552A (en) * | 2022-03-23 | 2023-11-16 | 日商納美仕有限公司 | Resin composition, adhesives or sealing material, cured product, semiconductor device and electronic part |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3643241C2 (en) | 1985-03-29 | 1990-07-26 | Nisshinbo Industries, Inc., Tokio/Tokyo, Jp | |
| JPS621714A (en) | 1985-06-28 | 1987-01-07 | Nisshinbo Ind Inc | Thermosetting resin and production thereof |
| JPH02175756A (en) | 1988-12-28 | 1990-07-09 | Mitsui Toatsu Chem Inc | Thermosetting resin composition |
| JP4200250B2 (en) | 1999-10-26 | 2008-12-24 | パナソニック電工株式会社 | Epoxy resin composition, prepreg, metal foil with resin and laminate |
| EP1786849B1 (en) | 2004-06-21 | 2007-10-24 | Huntsman Advanced Materials (Switzerland) GmbH | Polyaminoamide-monoepoxy adducts |
| JP2006176549A (en) | 2004-12-20 | 2006-07-06 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| WO2010071213A1 (en) | 2008-12-15 | 2010-06-24 | 帝人株式会社 | Resin composition containing cyclic carbodimide |
| JP2010144121A (en) | 2008-12-22 | 2010-07-01 | Kyocera Chemical Corp | Resin composition for encapsulating and apparatus for encapsulating semiconductor |
| JP5588631B2 (en) * | 2009-06-12 | 2014-09-10 | 帝人株式会社 | Resin composition containing cyclic carbodiimide |
| JP2011068814A (en) | 2009-09-28 | 2011-04-07 | Dic Corp | Epoxy resin composition and cured product thereof |
| WO2011093478A1 (en) * | 2010-01-27 | 2011-08-04 | 帝人株式会社 | Film |
| ES2538090T3 (en) | 2010-06-16 | 2015-06-17 | Kawaguchi Chemical Industry Co. Ltd. | Process for the production of a carbodiimide |
| WO2011158959A1 (en) | 2010-06-16 | 2011-12-22 | 帝人株式会社 | Process for production of intermediate for cyclic carbodiimide compound |
| JP5615051B2 (en) * | 2010-06-16 | 2014-10-29 | 川口化学工業株式会社 | Method for producing carbodiimide body |
| JP5645494B2 (en) * | 2010-06-16 | 2014-12-24 | 帝人株式会社 | Method for producing amine body |
| JP5717928B2 (en) | 2012-09-21 | 2015-05-13 | 帝人株式会社 | Manufacturing method of composite material |
-
2015
- 2015-09-09 WO PCT/JP2015/076205 patent/WO2016039486A1/en active Application Filing
- 2015-09-09 SG SG10201903565YA patent/SG10201903565YA/en unknown
- 2015-09-09 JP JP2016547816A patent/JP6461170B2/en active Active
- 2015-09-09 EP EP15839512.9A patent/EP3192834B1/en active Active
- 2015-09-09 KR KR1020177005941A patent/KR102393692B1/en active IP Right Grant
- 2015-09-09 US US15/510,457 patent/US20170253693A1/en not_active Abandoned
- 2015-09-09 CN CN201580048930.7A patent/CN106715578B/en active Active
- 2015-09-09 MY MYPI2017700809A patent/MY179663A/en unknown
- 2015-09-09 SG SG11201701852VA patent/SG11201701852VA/en unknown
- 2015-09-10 TW TW104129948A patent/TWI667281B/en active
-
2017
- 2017-03-10 PH PH12017500465A patent/PH12017500465A1/en unknown
-
2019
- 2019-03-05 US US16/292,708 patent/US10865272B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI667281B (en) | 2019-08-01 |
| KR102393692B1 (en) | 2022-05-02 |
| CN106715578A (en) | 2017-05-24 |
| MY179663A (en) | 2020-11-11 |
| JP6461170B2 (en) | 2019-01-30 |
| WO2016039486A1 (en) | 2016-03-17 |
| EP3192834B1 (en) | 2023-04-05 |
| PH12017500465A1 (en) | 2017-07-31 |
| JPWO2016039486A1 (en) | 2017-06-22 |
| CN106715578B (en) | 2019-05-10 |
| US20170253693A1 (en) | 2017-09-07 |
| US20190194381A1 (en) | 2019-06-27 |
| TW201623428A (en) | 2016-07-01 |
| SG10201903565YA (en) | 2019-05-30 |
| US10865272B2 (en) | 2020-12-15 |
| EP3192834A4 (en) | 2017-08-30 |
| KR20170057248A (en) | 2017-05-24 |
| EP3192834A1 (en) | 2017-07-19 |
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