SG10201903565YA - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
SG10201903565YA
SG10201903565YA SG10201903565YA SG10201903565YA SG10201903565YA SG 10201903565Y A SG10201903565Y A SG 10201903565YA SG 10201903565Y A SG10201903565Y A SG 10201903565YA SG 10201903565Y A SG10201903565Y A SG 10201903565YA SG 10201903565Y A SG10201903565Y A SG 10201903565YA
Authority
SG
Singapore
Prior art keywords
resin composition
thermosetting resin
composition
thermosettingresin
thermosetting
Prior art date
Application number
SG10201903565YA
Inventor
Shinichiro Shoji
Kouhei Endo
Masaya Shibano
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Publication of SG10201903565YA publication Critical patent/SG10201903565YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
    • C07D491/02—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains two hetero rings
    • C07D491/10—Spiro-condensed systems
    • C07D491/113—Spiro-condensed systems with two or more oxygen atoms as ring hetero atoms in the oxygen-containing ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

ThermosettingResin Composition [No Suitable Figures]
SG10201903565YA 2014-09-11 2015-09-09 Thermosetting resin composition SG10201903565YA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014185246 2014-09-11
JP2015031753 2015-02-20
JP2015035480 2015-02-25
JP2015150407 2015-07-30

Publications (1)

Publication Number Publication Date
SG10201903565YA true SG10201903565YA (en) 2019-05-30

Family

ID=55459222

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201903565YA SG10201903565YA (en) 2014-09-11 2015-09-09 Thermosetting resin composition
SG11201701852VA SG11201701852VA (en) 2014-09-11 2015-09-09 Thermosetting resin composition

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201701852VA SG11201701852VA (en) 2014-09-11 2015-09-09 Thermosetting resin composition

Country Status (10)

Country Link
US (2) US20170253693A1 (en)
EP (1) EP3192834B1 (en)
JP (1) JP6461170B2 (en)
KR (1) KR102393692B1 (en)
CN (1) CN106715578B (en)
MY (1) MY179663A (en)
PH (1) PH12017500465A1 (en)
SG (2) SG10201903565YA (en)
TW (1) TWI667281B (en)
WO (1) WO2016039486A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017031402A (en) * 2015-08-04 2017-02-09 信越化学工業株式会社 Thermosetting epoxy resin composition
JP6766360B2 (en) * 2016-01-15 2020-10-14 住友ベークライト株式会社 Resin composition
JP6686457B2 (en) * 2016-01-15 2020-04-22 住友ベークライト株式会社 Sealing resin composition and electronic device
JP2017160427A (en) * 2016-03-04 2017-09-14 京セラ株式会社 Resin composition for sealing and semiconductor device
JPWO2017168732A1 (en) * 2016-03-31 2019-02-07 日立化成株式会社 Resin composition, prepreg, resin sheet and laminate
JP6642342B2 (en) * 2016-09-02 2020-02-05 信越化学工業株式会社 Thermosetting epoxy resin composition
JP6947468B2 (en) * 2017-08-28 2021-10-13 日清紡ケミカル株式会社 Polycarbodiimide compound and thermosetting resin composition
TWI796409B (en) 2017-12-22 2023-03-21 日商帝人股份有限公司 thermosetting resin composition
WO2019138919A1 (en) * 2018-01-15 2019-07-18 日立化成株式会社 Liquid sealing resin composition, electronic component device, and method for manufacturing electronic component device
KR20210042259A (en) * 2018-08-09 2021-04-19 미츠비시 가스 가가쿠 가부시키가이샤 Resin composition for printed wiring boards, prepregs, laminates, metal foil clad laminates, printed wiring boards, and multilayer printed wiring boards
KR102257926B1 (en) * 2018-09-20 2021-05-28 주식회사 엘지화학 Multilayered printed circuit board, method for manufacturing the same, and semiconductor device using the same
CN109762436B (en) * 2018-12-12 2021-04-13 苏州太湖电工新材料股份有限公司 Low-temperature-resistant heat-conducting insulating resin paint suitable for superconducting insulating material and preparation method and application thereof
TW202344552A (en) * 2022-03-23 2023-11-16 日商納美仕有限公司 Resin composition, adhesives or sealing material, cured product, semiconductor device and electronic part

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3643238C2 (en) 1985-03-29 1989-08-03 Nisshinbo Industries, Inc., Tokio/Tokyo, Jp
JPS621714A (en) 1985-06-28 1987-01-07 Nisshinbo Ind Inc Thermosetting resin and production thereof
JPH02175756A (en) 1988-12-28 1990-07-09 Mitsui Toatsu Chem Inc Thermosetting resin composition
JP4200250B2 (en) 1999-10-26 2008-12-24 パナソニック電工株式会社 Epoxy resin composition, prepreg, metal foil with resin and laminate
CN101014639B (en) 2004-06-21 2010-05-26 亨斯迈先进材料（瑞士）有限公司 Polyaminoamide-monoepoxy adducts
JP2006176549A (en) 2004-12-20 2006-07-06 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
MX2011006374A (en) 2008-12-15 2011-09-27 Teijin Ltd Resin composition containing cyclic carbodimide.
JP2010144121A (en) 2008-12-22 2010-07-01 Kyocera Chemical Corp Resin composition for encapsulating and apparatus for encapsulating semiconductor
JP5588631B2 (en) * 2009-06-12 2014-09-10 帝人株式会社 Resin composition containing cyclic carbodiimide
JP2011068814A (en) 2009-09-28 2011-04-07 Dic Corp Epoxy resin composition and cured product thereof
BR112012018682A2 (en) * 2010-01-27 2019-09-24 Teijin Ltd film.
WO2011158959A1 (en) * 2010-06-16 2011-12-22 帝人株式会社 Process for production of intermediate for cyclic carbodiimide compound
JP5615051B2 (en) * 2010-06-16 2014-10-29 川口化学工業株式会社 Method for producing carbodiimide body
ES2538090T3 (en) 2010-06-16 2015-06-17 Kawaguchi Chemical Industry Co. Ltd. Process for the production of a carbodiimide
JP5645494B2 (en) 2010-06-16 2014-12-24 帝人株式会社 Method for producing amine body
JP5717928B2 (en) 2012-09-21 2015-05-13 帝人株式会社 Manufacturing method of composite material

Also Published As

Publication number Publication date
US10865272B2 (en) 2020-12-15
TW201623428A (en) 2016-07-01
WO2016039486A1 (en) 2016-03-17
JP6461170B2 (en) 2019-01-30
PH12017500465A1 (en) 2017-07-31
CN106715578B (en) 2019-05-10
US20170253693A1 (en) 2017-09-07
JPWO2016039486A1 (en) 2017-06-22
EP3192834A4 (en) 2017-08-30
KR20170057248A (en) 2017-05-24
CN106715578A (en) 2017-05-24
SG11201701852VA (en) 2017-04-27
TWI667281B (en) 2019-08-01
KR102393692B1 (en) 2022-05-02
EP3192834A1 (en) 2017-07-19
EP3192834B1 (en) 2023-04-05
MY179663A (en) 2020-11-11
US20190194381A1 (en) 2019-06-27

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