JPWO2023190419A5 - - Google Patents

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Publication number
JPWO2023190419A5
JPWO2023190419A5 JP2024508598A JP2024508598A JPWO2023190419A5 JP WO2023190419 A5 JPWO2023190419 A5 JP WO2023190419A5 JP 2024508598 A JP2024508598 A JP 2024508598A JP 2024508598 A JP2024508598 A JP 2024508598A JP WO2023190419 A5 JPWO2023190419 A5 JP WO2023190419A5
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JP
Japan
Prior art keywords
resin composition
molding resin
composition according
volume
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024508598A
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English (en)
Japanese (ja)
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JPWO2023190419A1 (https=
JP7521715B2 (ja
Filing date
Publication date
Priority claimed from PCT/JP2022/016913 external-priority patent/WO2023188401A1/ja
Application filed filed Critical
Publication of JPWO2023190419A1 publication Critical patent/JPWO2023190419A1/ja
Publication of JPWO2023190419A5 publication Critical patent/JPWO2023190419A5/ja
Priority to JP2024111905A priority Critical patent/JP2024133208A/ja
Application granted granted Critical
Publication of JP7521715B2 publication Critical patent/JP7521715B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024508598A 2022-03-31 2023-03-27 成形用樹脂組成物及び電子部品装置 Active JP7521715B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024111905A JP2024133208A (ja) 2022-03-31 2024-07-11 成形用樹脂組成物及び電子部品装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2022/016913 2022-03-31
PCT/JP2022/016913 WO2023188401A1 (ja) 2022-03-31 2022-03-31 成形用樹脂組成物及び電子部品装置
PCT/JP2023/012350 WO2023190419A1 (ja) 2022-03-31 2023-03-27 成形用樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024111905A Division JP2024133208A (ja) 2022-03-31 2024-07-11 成形用樹脂組成物及び電子部品装置

Publications (3)

Publication Number Publication Date
JPWO2023190419A1 JPWO2023190419A1 (https=) 2023-10-05
JPWO2023190419A5 true JPWO2023190419A5 (https=) 2024-04-08
JP7521715B2 JP7521715B2 (ja) 2024-07-24

Family

ID=88200454

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024508598A Active JP7521715B2 (ja) 2022-03-31 2023-03-27 成形用樹脂組成物及び電子部品装置
JP2024111905A Pending JP2024133208A (ja) 2022-03-31 2024-07-11 成形用樹脂組成物及び電子部品装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024111905A Pending JP2024133208A (ja) 2022-03-31 2024-07-11 成形用樹脂組成物及び電子部品装置

Country Status (6)

Country Link
US (1) US20250236744A1 (https=)
JP (2) JP7521715B2 (https=)
KR (1) KR20240165371A (https=)
CN (1) CN119173586A (https=)
TW (1) TW202348719A (https=)
WO (2) WO2023188401A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250112775A (ko) * 2022-11-22 2025-07-24 가부시끼가이샤 레조낙 성형용 수지 조성물 및 전자 부품 장치
JP7540554B1 (ja) * 2023-07-19 2024-08-27 株式会社レゾナック 成形用樹脂組成物及び電子部品装置
TWI856873B (zh) * 2023-11-16 2024-09-21 南亞塑膠工業股份有限公司 低介電樹脂組成物
JP2025082667A (ja) * 2023-11-17 2025-05-29 株式会社レゾナック シート状部材、成形用樹脂組成物及び電子部品装置
JP2025088348A (ja) * 2023-11-30 2025-06-11 デンカ株式会社 無機質粉末、および無機質粉末の製造方法
JP2025088334A (ja) * 2023-11-30 2025-06-11 デンカ株式会社 無機質粉末

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320025A (ja) * 1996-05-28 1997-12-12 Mitsubishi Electric Corp 磁気ヘッド
JP4020000B2 (ja) * 2002-04-17 2007-12-12 株式会社村田製作所 複合誘電体材料、複合誘電体成形物、およびこれを用いたレンズアンテナ、並びにこれを用いた表面実装型アンテナ
JP4109500B2 (ja) * 2002-07-08 2008-07-02 株式会社カネカ 熱硬化性樹脂組成物、熱硬化性樹脂溶液、および熱硬化性樹脂シート
JP2004363065A (ja) * 2003-06-09 2004-12-24 Toray Ind Inc 誘電体組成物
CN105693141B (zh) * 2014-08-29 2017-08-04 天津德高化成新材料股份有限公司 一种用于指纹传感器感应层的介电复合材料的制备方法
CN107141721B (zh) * 2017-06-02 2019-11-22 江苏华海诚科新材料股份有限公司 一种高介电常数环氧树脂组合物及其制备方法
WO2019111298A1 (ja) * 2017-12-04 2019-06-13 株式会社東芝 絶縁スペーサ
KR102731475B1 (ko) * 2017-12-28 2024-11-15 가부시끼가이샤 레조낙 볼 그리드 어레이 패키지 밀봉용 에폭시 수지 조성물, 에폭시 수지 경화물 및 전자 부품 장치
JP7384559B2 (ja) * 2019-01-31 2023-11-21 京セラ株式会社 高周波用封止材樹脂組成物および半導体装置
JP6870778B1 (ja) * 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置

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